IEEE Power Electronics Magazine - December 2015 - 38

to a key function of these structures:
when inserted in a multilayer PCB,
The total entity
the low CTE of the core counteracts
created from the tiny
the higher CTE of the standard PCB
laminate. Figure 17 illustrates a typiconverters is called a
cal application, wherein a carbon-figranular power
ber layer sandwiched between 1-oz Cu
sheets is used to constrain the CTE of
supply, because each
a multilayer PCB. Two Cu-carbontiny element is smaller
fiber inserts are incorporated within
the PCB while maintaining geometric
than a grain of sand.
symmetry to minimize warpage [18].
Since the Z-axis thermal conductivity
of the carbon fiber is only 1 W/mK, the
use of Cu thermal vias is recommended.
The thermal management technology influPCB Thermal Path-Schematic
ence map shown in Figure 18 summarizes the
various technologies influencing the design
and development of thermal management soluHeat Source
PCB
tions used in advanced power electronic packMounting
ages. Due to space limitations, only a small
Screw
sample of these technologies could be included
here. Additional details can be found in [1].

1-in evaporator with an uncoated
channel, while Figure  16(b) shows
a coated channel. An additional advantage of the latter is the resulting
turbulence-free flow.
Constraining core laminates are a
unique class of CTE control and heatspreading layers that can be incorporated into PCBs [17]. These laminate
inserts are formed by sandwiching
graphite, carbon fiber, or other material between Cu or other metal layers.
The name constraining core refers

PCB
Mounting
Screw
STABLCOR

STABLCOR

Summary
Chassis
Ground Via

Isolated Via on
Ground Layer

Thermal
Via

FIG 17 The thermal core heat spreader. (Figure courtesy of Stablecor
Technologies Inc.)

For the first time in the history of panel-based
active and passive component embedding,
high-volume commercial manufacturing is
now in place, despite somewhat limited component availability and the limitations of
power and current. Several potentially usable
new technologies are under development in

Advanced Thermal Management Solutions for Power Electronics
Power Sip
with
Integrated
Cooling

Technology Influence Map
High-Temp
Interconnect
(TLP, Cu-Cu)

Integrated
Thermal Design
Software

PCB Embedding
for Power
Electronics

PCB Embedded
Vapor Chambers

Microfluid
Cooling For
CPU and GPU
Laser
Micromachining

Additive
Manufacturing

Microchannel
Cooling
Near-Junction
Thermal
Transport

Thermal
Interface
Materials

FIG 18 The technology influence map of thermal management.

38

IEEE PowEr ElEctronIcs MagazInE

TGPs

z	December 2015



Table of Contents for the Digital Edition of IEEE Power Electronics Magazine - December 2015

IEEE Power Electronics Magazine - December 2015 - Cover1
IEEE Power Electronics Magazine - December 2015 - Cover2
IEEE Power Electronics Magazine - December 2015 - 1
IEEE Power Electronics Magazine - December 2015 - 2
IEEE Power Electronics Magazine - December 2015 - 3
IEEE Power Electronics Magazine - December 2015 - 4
IEEE Power Electronics Magazine - December 2015 - 5
IEEE Power Electronics Magazine - December 2015 - 6
IEEE Power Electronics Magazine - December 2015 - 7
IEEE Power Electronics Magazine - December 2015 - 8
IEEE Power Electronics Magazine - December 2015 - 9
IEEE Power Electronics Magazine - December 2015 - 10
IEEE Power Electronics Magazine - December 2015 - 11
IEEE Power Electronics Magazine - December 2015 - 12
IEEE Power Electronics Magazine - December 2015 - 13
IEEE Power Electronics Magazine - December 2015 - 14
IEEE Power Electronics Magazine - December 2015 - 15
IEEE Power Electronics Magazine - December 2015 - 16
IEEE Power Electronics Magazine - December 2015 - 17
IEEE Power Electronics Magazine - December 2015 - 18
IEEE Power Electronics Magazine - December 2015 - 19
IEEE Power Electronics Magazine - December 2015 - 20
IEEE Power Electronics Magazine - December 2015 - 21
IEEE Power Electronics Magazine - December 2015 - 22
IEEE Power Electronics Magazine - December 2015 - 23
IEEE Power Electronics Magazine - December 2015 - 24
IEEE Power Electronics Magazine - December 2015 - 25
IEEE Power Electronics Magazine - December 2015 - 26
IEEE Power Electronics Magazine - December 2015 - 27
IEEE Power Electronics Magazine - December 2015 - 28
IEEE Power Electronics Magazine - December 2015 - 29
IEEE Power Electronics Magazine - December 2015 - 30
IEEE Power Electronics Magazine - December 2015 - 31
IEEE Power Electronics Magazine - December 2015 - 32
IEEE Power Electronics Magazine - December 2015 - 33
IEEE Power Electronics Magazine - December 2015 - 34
IEEE Power Electronics Magazine - December 2015 - 35
IEEE Power Electronics Magazine - December 2015 - 36
IEEE Power Electronics Magazine - December 2015 - 37
IEEE Power Electronics Magazine - December 2015 - 38
IEEE Power Electronics Magazine - December 2015 - 39
IEEE Power Electronics Magazine - December 2015 - 40
IEEE Power Electronics Magazine - December 2015 - 41
IEEE Power Electronics Magazine - December 2015 - 42
IEEE Power Electronics Magazine - December 2015 - 43
IEEE Power Electronics Magazine - December 2015 - 44
IEEE Power Electronics Magazine - December 2015 - 45
IEEE Power Electronics Magazine - December 2015 - 46
IEEE Power Electronics Magazine - December 2015 - 47
IEEE Power Electronics Magazine - December 2015 - 48
IEEE Power Electronics Magazine - December 2015 - 49
IEEE Power Electronics Magazine - December 2015 - 50
IEEE Power Electronics Magazine - December 2015 - 51
IEEE Power Electronics Magazine - December 2015 - 52
IEEE Power Electronics Magazine - December 2015 - 53
IEEE Power Electronics Magazine - December 2015 - 54
IEEE Power Electronics Magazine - December 2015 - 55
IEEE Power Electronics Magazine - December 2015 - 56
IEEE Power Electronics Magazine - December 2015 - 57
IEEE Power Electronics Magazine - December 2015 - 58
IEEE Power Electronics Magazine - December 2015 - 59
IEEE Power Electronics Magazine - December 2015 - 60
IEEE Power Electronics Magazine - December 2015 - 61
IEEE Power Electronics Magazine - December 2015 - 62
IEEE Power Electronics Magazine - December 2015 - 63
IEEE Power Electronics Magazine - December 2015 - 64
IEEE Power Electronics Magazine - December 2015 - Cover3
IEEE Power Electronics Magazine - December 2015 - Cover4
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_september2023
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_june2023
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_march2023
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_december2022
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_september2022
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_june2022
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_march2022
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_december2021
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_september2021
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_june2021
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_march2021
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_december2020
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_september2020
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_june2020
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_march2020
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_december2019
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_september2019
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_june2019
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_march2019
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_december2018
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_september2018
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_june2018
https://www.nxtbook.com/nxtbooks/ieee/pelcompendium_march2018
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_march2018
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_september2017
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_june2017
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_march2017
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_december2016
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_september2016
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_june2016
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_march2016
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_december2015
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_september2015
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_june2015
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_march2015
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_december2014
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_september2014
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_june2014
https://www.nxtbook.com/nxtbooks/ieee/powerelectronics_march2014
https://www.nxtbookmedia.com