IEEE Power Electronics Magazine - December 2019 - 29

modeling and GaN-based converter design. He has authored
or coauthored more than 20 journal and conference papers,
a professional education seminar, a patent, and the book
Characterization of Wide Bandgap Power Semiconductor
Devices published by the Institution of Engineering
and Technology.
Michael de Rooij (michael.derooij@epc-co.com) received his B.Eng., M.Eng. and, D.Eng. degrees from the
Rand Afrikaans University (now the University of Johannesburg), South Africa, in 1992, 1994, and 1998, respectively, all in electronics and electrical engineering with a
major in power electronics. He is currently vice president
of applications engineering at Efficient Power Conversion Corporation, El Segundo, California. He has
authored and coauthored more than 50 papers at various
conferences and journals and has been granted 30 U.S.
and international patents and 26 U.S. and international
pending patent applications. He is the author and coauthor of six books. His experience covers highly resonant
loosely coupled wireless power, high density dc-to-dc
converters, gallium nitride integrated circuit development, radio-frequency power amplifiers, solid-state highfrequency power converters and devices, utility applications of power electronics, uninterruptible power supplies, integration of power electronic converters, power
electronic packaging, induction heating, photovoltaic
converters, magnetic resonance imaging systems, and
gate drivers with protection features. He is a Senior Member of the IEEE.

[9] P. Ning, G. Li, F. Wang, and K. Ngo, "Selection of heatsink and fan for
high-temperature power modules underweight constraint," in Proc. IEEE
Applied Power Electronics Conf. and Exposition (APEC), Austin, TX, 2008,
pp. 192-198.
[10] K. C. Otiaba, N. N. Ekere, R. S. Bhatti, S. Mallik, M. O. Alam, and E. H.
Amalu, "Thermal interface materials for automotive electronic control unit:
Trends, technology and R&D challenges," Microelectron. Reliab., vol. 51, no.
12, pp. 2031-2043, 2011.
[11] D. Gautam, D. Wager, M. Edington, and F. Musavi, "Performance comparison of thermal interface materials for power electronics applications,"
in Proc. 2014 IEEE Applied Power Electronics Conf. and ExpositionAPEC 2014.
[12] Bergquist, "Sil-pad 400 datasheet," Jan. 2015. [Online]. Available:
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[15] T-Global Technology, "TG-X ultra soft thermal conductive pad," Apr.
2012. [Online]. Available: https://www.digchip.com/datasheets/parts/
datasheet/3133/TGX-150-150-1_0-0-pdf.php
[16] T-Global Technology, "TG-S606P thermal compound," Document Version 1.280318. Accessed on: Nov. 6, 2019. [Online]. Available: http://www
.tglobaltechnology.com/wp-content/uploads/2018/04/TG-S606P.pdf
[17] Laird Technology, "Tpcm 580 series phase change material," Nov. 2012.
[Online]. Available: https://assets.lairdtech.com/home/brandworld/files/

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Qpedia-Article/Qpedia_Dec10_HS_Selection_Methodology

December 2019

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http://tds.loctite.com/tds5/Studio/ShowPDF/BERGQUIST%20SIL%20PAD%20TSP%20900-EN?pid=BERGQUIST%20SIL%20PAD%20TSP%20900&format=MTR&subformat=HYS&language=EN&plant=WERCS http://tds.loctite.com/tds5/Studio/ShowPDF/BERGQUIST%20SIL%20PAD%20TSP%20900-EN?pid=BERGQUIST%20SIL%20PAD%20TSP%20900&format=MTR&subformat=HYS&language=EN&plant=WERCS http://www.wakefield-vette.com/resource-center/downloads/brochures/thermal-management-accessories-wakefield.pdf http://www.wakefield-vette.com/resource-center/downloads/brochures/thermal-management-accessories-wakefield.pdf http://www.wakefield-vette.com/resource-center/downloads/brochures/thermal-management-accessories-wakefield.pdf http://tds.loctite.com/tds5/Studio/ShowPDF/TGF%204000-EN?pid=TGF%204000&format=MTR&subformat=HYS&language=EN&plant=WERCS http://tds.loctite.com/tds5/Studio/ShowPDF/TGF%204000-EN?pid=TGF%204000&format=MTR&subformat=HYS&language=EN&plant=WERCS https://www.digchip.com/datasheets/parts/datasheet/3133/TGX-150-150-1_0-0-pdf.php https://www.digchip.com/datasheets/parts/datasheet/3133/TGX-150-150-1_0-0-pdf.php http://www.tglobaltechnology.com/wp-content/uploads/2018/04/TG-S606P.pdf http://www.tglobaltechnology.com/wp-content/uploads/2018/04/TG-S606P.pdf https://assets.lairdtech.com/home/brandworld/files/THR-DS-TPCM580%201112.pdf https://assets.lairdtech.com/home/brandworld/files/THR-DS-TPCM580%201112.pdfphp https://www.infineon.com/dgdl/Infineon%20ThinPAK%208x8.pdf?fileId=db3a304327b897500127f6946a286519 https://www.infineon.com/dgdl/an-1059.pdf?fileId=5546d462533600a401535591e1940fc6 https://www.infineon.com/dgdl/Infineon%20ThinPAK%208x8.pdf?fileId=db3a304327b897500127f6946a286519 https://www.infineon.com/dgdl/an-1059.pdf?fileId=5546d462533600a401535591e1940fc6 https://www.infineon.com/dgdl/Infineon%20ThinPAK%208x8.pdf?fileId=db3a304327b897500127f6946a286519 https://www.infineon.com/dgdl/an-1059.pdf?fileId=5546d462533600a401535591e1940fc6 http://www.ti.com/lit/an/slva462/slva462.pdf http://scholar.lib.vt.edu/theses/available/etd-04162012-151740/ http://www.ti.com/lit/an/slva462/slva462.pdf http://scholar.lib.vt.edu/theses/available/etd-04162012-151740/ https://www.electronics-cooling.com/1995/06/how-to-select-a-heat-sink/ https://www.electronics-cooling.com/1995/06/how-to-select-a-heat-sink/ https://www.infineon.com/dgdl/an-1057.pdf?fileId=5546d462533600a401535591d3170fbd https://www.infineon.com/dgdl/an-1057.pdf?fileId=5546d462533600a401535591d3170fbd https://epc-co.com/epc/Portals/0/epc/documents/product-training/Appnote_Thermal_Performance_of_eGaN_FETs.pdf https://epc-co.com/epc/Portals/0/epc/documents/product-training/Appnote_Thermal_Performance_of_eGaN_FETs.pdf https://epc-co.com/epc/Portals/0/epc/documents/product-training/Appnote_Thermal_Performance_of_eGaN_FETs.pdf https://www.onsemi.com/pub/Collateral/AND9016-D.PDF https://ep-us.mersen.com/fileadmin/catalog/Literature/Brochures/BR-Cooling-of-Power-Electronics-Brochure.pdf https://ep-us.mersen.com/fileadmin/catalog/Literature/Brochures/BR-Cooling-of-Power-Electronics-Brochure.pdf https://epc-co.com/epc/Portals/0/epc/documents/application-notes/How2AppNote012%20-%20How%20to%20Get%20More%20Power%20Out%20of%20an%20eGaN%20Converter.pdf https://epc-co.com/epc/Portals/0/epc/documents/application-notes/How2AppNote012%20-%20How%20to%20Get%20More%20Power%20Out%20of%20an%20eGaN%20Converter.pdf https://epc-co.com/epc/Portals/0/epc/documents/application-notes/How2AppNote012%20-%20How%20to%20Get%20More%20Power%20Out%20of%20an%20eGaN%20Converter.pdf http://www.qats.com/Qpedia-Article/Qpedia_Dec10_HS_Selection_Methodology http://www.qats.com/Qpedia-Article/Qpedia_Dec10_HS_Selection_Methodology

IEEE Power Electronics Magazine - December 2019

Table of Contents for the Digital Edition of IEEE Power Electronics Magazine - December 2019