Pre-Applied Thermal Interface Material (TIM) The Infineon-qualified solution With the ongoing increase of power densities in power electronics the thermal interface between power module and heatsink becomes a larger challenge. A thermal interface material, especially developed for and pre-applied to Infineon's modules outperforms the general purpose materials available. TIM does not only provide the lowest thermal resistance, it also fulfills the highest quality standards given for power modules to achieve the longest lifetime and highest system reliability. Pre-applied to Infineon Modules Dry to the touch Optimized for dedicated Infineon Modules Benefits Reduced process time in manufacturing Simplified mounting Increased system reliability Increased system lifetime 110 100 Tj-Tamb [K] Main Features Best in class thermal resistance 90 80 70 60 50 1 2 3 Time in HTS* [Weeks] *HTS: High Temperature Storing, Stresstest 1000 h, 125 °C 4 5 n MOD-3 n MOD-2 n MOD-1 n IFX-Solution Optimized thermal management Improved handling in case of maintenance Infineon Technologies North America 1050 Route 22, Lebanon, NJ 08833 Phone: 908-236-5600, info.usa@infineon.com www.infineon.com/timhttp://www.infineon.com/tim