IEEE Power Electronics Magazine - June 2017 - 68
From components
to Power systems
by Tom Keim
and Ashok Bindra
©ISTOCKPHOTO.COM/KASTO80
APEC showcases exceptional technologies across the board
T
his year, the IEEE Applied Power Electronics
Conference and Exposition (APEC) in Tampa,
Florida, again highlighted the latest advances in
circuit design, power semiconductors, passives,
packaging, and manufacturing. From plenary
talks to technical sessions and industry seminars in the
exhibit hall, attendees from around the world witnessed
developing trends in gallium nitride (GaN) integration,
higher-voltage silicon carbide (SiC) devices, gallium
Digital Object Identifier 10.1109/MPEL.2017.2692403
Date of publication: 23 June 2017
68
IEEE PowEr ElEctronIcs MagazInE
z June 2017
arsenide (GaAs) power field-effect transistors (FETs),
high-frequency magnetics, advanced packaging, highvoltage and high step-down converters, and design
for manufacturability.
Plenary Sessions
The plenary session kicked off on the afternoon of Monday, 27 March, with a talk on "Power Semiconductor
Technology-Intelligence for Tomorrow's Solutions" by
Texas Instruments' Technologist and Senior Vice President
(VP) Ahmad Bahai. Examining the state of power semiconductor devices from multiple perspectives, including
2329-9207/17©2017IEEE
http://www.ISTOCKPHOTO.COM/KASTO80
Table of Contents for the Digital Edition of IEEE Power Electronics Magazine - June 2017
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