28 IEEE PowEr ElEctronIcs MagazInE z June 2018 EOR RR EMP SFI Improved Composites Targeted Integrated Cooling of IPMs Coplanar and Coaxial 2018 2023 Extended Testing 2028 2033 2038 Virtual Testing and Qualification Holistic Multiphysics Modeling Tools Wireless Sensors High-Frequency, High-Temperature Embedded Sensors Modeling Tools - Specific Functions Next-Generation Materials Additive Processes Higher Energy Density and Higher Temperature Capable Passives Substrate Metallization for Joining Technologies and Extended Temperature Range Additive Processes Printed and Embedded Structures Die Metallization Compatible with Joining/Interconnect Technologies Screw, Solder Pin, and Pressure Semihermetic Coatings Printed Multifunctional Composite Based Low CTE and Extended Temperature Range Extended Temperature Range Vapor Chamber and Heat Pipe Polymer, Metal, and Ceramic Integrated Cooler Cu, AlSiC Epoxy-Based Hard Encapsulation Silicone Soft Encapsulation Pressureless Sintering Enhanced Solders Epoxy, Glass, and Cermet-Based Die Attach IMS/FR4/Polyimide Ceramic-Based DBX/AMB/Thick Film Pressure-Assisted Sintering Reflow Soldering Laser-Assisted Bonding Planar and 3-D Interconnects (Deposited) Planar Interconnects (Bonded and Pressure) Ultrasonic Wire/Ribbon Bonding 2043 FIG 1 The roadmap for supporting technology in packaging and integration for WBG power electronics. SFI: structural and functional integration; EMP: electrical and magnetic performance; RR: reliability and robustness; EOR: extended operating range; TP: thermal performance; DBC: direct bonded copper; AMB: active metal brazed; IMS: insulated metal substrate; AlSiC: aluminum-silicon carbide. Testing and Qualification Modeling Tools Passive Components and Sensors Metallization Housing and Termination Baseplate and Thermal Management Encapsulation Substrate Die Attach and Mount-Down Interconnect and Vias TP