Discrete Module IEEE PowEr ElEctronIcs MagazInE z June 2018 Additive Embedded Substrate Assembled Conventional Multiplanar Press-Pack Hermetic Power Hybrid Conventional Monoplanar Chip Direct SFI 2018 2023 3-D Stacked Structures 2028 Multiplanar IPM Planar Terminations High-Voltage SiC Packages Semihermetic Modules and IPMs 2033 "Printed Package" "PCB-Like" Laminate Extension of Conventional Module Technologies Embedded Passives and EM Control Modules with Planar Interconnect (e.g., Flex, Ceramic) "DBC," LTCC, and Thick-Film Hybrid Embedded Passives and EM Control Optimized Conventional Modules (Si Legacy) Extended V, I, T Packages for GaN and SiC Extended Range of Packages for GaN and SiC Optimized Surface-Mount Packages (Si Legacy) Optimized Through-Hole Packages (Si Legacy) 2038 "Printed Converter" 2043 FIG 2 The roadmap for a range of package types applicable to WBG power electronics. Si: silicon; GaN: gallium nitride; EM: electromagnetic; DBC: direct-bonded copper; LTCC: lowtemperature cofired ceramic; IPM: integrated power module. Integrated Power Module Through-Hole and Surface Mount EMP RR EOR 2017 ITRW Packaging and Integration Roadmap TP 30