IEEE Power Electronics Magazine - June 2018 - 31

layer screen help to suppress voltage overshoot and heatsink-coupled common-mode interference. Finally, the
application of a direct-substrate liquid impingement
cooler permits exceptional thermal performance within a
small physical envelope.

the high-electric fields while maintaining compact commutation loops and effective thermal management presents significant challenges including: 1) the mitigation of
high-electric fields in the substrates, interconnects, and
leadout connections; 2) the suppression of switching
voltage overshoot and common-mode interference; and
3) the high-performance thermal management. The assembled module described in [2] incorporates stacked substrates with vias to mitigate internal electric fields and
allows for the realization of vertical-commutation loops
(Figure 5). Embedded decoupling capacitors and an inter-

400

20

200

10
0

0

0.04

0.035

0.03

-20
0.025

-400
0.02

-10

0.015

-200

0

Output Voltage (V)

FIG 3 The relevance to technology-driver color coding.

0.01

High

Output Current (A)

Because of numerous emerging challenges that are different from those in the automotive industry, a sustained effort is required to realize the aggressive targets of heavy
equipment electrification, e.g., heavy-duty and off-road
vehicles. Heavy equipment manufacturers are increasingly investing in a new generation of power electronics technology to fulfill high-performance and reliability targets
under harsh environments while reducing fuel consumption and maintaining cost competitiveness. In a recent
work led by the University of Arkansas [3], a holistic

0.005

Low

case study 3: sic Power Electronics
for traction applications

Time (s)
Output Voltage

Output Current

(b)

(a)

FIG 4 (a) A modular three-phase inverter based on half-bridge switching cells incorporating gate drives, sensors, low-level controls, and
input/output filters [1]. (b) The output V and I waveforms with a resistive load, demonstrating low levels of switching noise and ripple.

Stacked DBA
Substrate

Outlet

SiC MOSFET

Integrated
Cooler

Jet Impingement
Cells

Inlet

(a)

(b)

FIG 5 (a) A cross section through the module and cooler, showing stacked substrates, interconnected posts, and termination pins.
(b) The physical realization of the prototype 10-kV SiC MOSFET module [2].

June 2018

z	IEEE PowEr ElEctronIcs MagazInE

31



Table of Contents for the Digital Edition of IEEE Power Electronics Magazine - June 2018

Contents
IEEE Power Electronics Magazine - June 2018 - Cover1
IEEE Power Electronics Magazine - June 2018 - Cover2
IEEE Power Electronics Magazine - June 2018 - Contents
IEEE Power Electronics Magazine - June 2018 - 2
IEEE Power Electronics Magazine - June 2018 - 3
IEEE Power Electronics Magazine - June 2018 - 4
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IEEE Power Electronics Magazine - June 2018 - Cover3
IEEE Power Electronics Magazine - June 2018 - Cover4
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