IEEE Power Electronics Magazine - June 2019 - 69

Addressing the space, temperature, a nd higher-frequency challenges, especially as wide-bandgap
semiconductors (such as silicon
carbide and gallium nitride) are deployed, KEMET has developed KONNEKT high-density packaging that
creates stacks of up to four MLCC
capacitors, making greater levels of
capacitance available within a compact format. Using this technology,
working voltages as high as 1,700 V
are achievable in a compact 3,640case size while supporting operating temperatures as high as 150 °C
along with extremely stable capacitance with voltage and temperature.
While onboard voltage changes have
required development in capacitor
technology, advances in batterypowered vehicle charging has required further progress in magnetic
technology. This is not a traditional

FIG 3 A KEMET employee cutting MLCCs by hand in 1968. (Source: KEMET archives;
used with permission.)

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June 2019

z	IEEE POWER ELECTRONICS MAGAZINE

69



http://www.pemuk.com

IEEE Power Electronics Magazine - June 2019

Table of Contents for the Digital Edition of IEEE Power Electronics Magazine - June 2019

Contents
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