REVOLUTIONARY POWER MODULE PACKAGING AND CHIP TECHNOLOGIES 7TH GENERATION INDUSTRIAL POWER MODULES * Mitsubishi Electric 7th generation IGBT chips featuring CSTBT™ technology enabling minimal power loss * High reliability packaging that dramatically extends thermal cycle life SoLid Cover (SLC) offering enhanced resistance from environmental degradation Thick Metal Substrate (TMS) offering low thermal resistance Insulated Metal Baseplate (IMB) eliminating large solder joints * Wide lineup of package types and ratings HTTP://US.MITSUBISHIELECTRIC.COM/SEMICONDUCTORS/EN/http://us.mitsubishielectric.com/semiconductors/en/