IEEE Power Electronics Magazine - March 2021 - 48

About the Authors
Bhanu Teja Vankayalapati received the B.Tech degree in
electrical engineering and the M.Tech degree in power electronics from the Indian Institute of Technology (BHU), Varanasi, India in 2017. He is currently working toward the Ph.D
degree in WBG semiconductor reliability with The University
of Texas at Dallas, Richardson, TX 75080, United States.
From 2017 to 2018, he was a project engineer with the Indian
Institute of Technology, Kanpur, India, and worked on high
density GaN SMPS project for Indian Space Research Organization. His research areas include, WBG device applications,
WBG reliability, converter design, and embedded control.
Fei Yang received the B.S. degree from Northwestern
Polytechnical University, Xi'an, China, in 2011, the M.S.
degree from The University of Tennessee, Knoxville, TN,
United States in 2017, and the Ph.D. degree from The University of Texas at Dallas, Richardson, TX 75080, United
States, in 2020, all in electrical engineering. He is currently a
System and Application Engineer with Texas Instruments
Incorporated, Dallas, TX 75243, United States. His research
interests include wide-bandgap semiconductor device's reliability and application, power module packaging and integration, and motor drive system design.
Shi Pu received the B.S. degree in electrical engineering
from the School of Electrical and Electronics Engineering,
Huazhong University of Science and Technology, Wuhan,
China, 2014, and the M.S. degree from Auburn University,
Auburn, AL, USA, in 2016. He is currently working toward
the Ph.D. degree with The University of Texas at Dallas,
Richardson, TX 75080, United States. His research interests
include wide-band gap device reliability, device characterization, and real-time fault diagnosis.
Masoud Farhadi received the B.Sc. degree in electrical
engineering with honors and the M.Sc. degree in power
engineering (power electronics and systems) with honors
from the Department of Electrical Engineering, University
of Tabriz, Iran, in 2013 and 2016, respectively. He is currently working toward the Ph.D. degree at the University of
Texas at Dallas, Richardson, TX 75080, United States. His
current research interests include analysis and control of
power electronic converters, reliability of power electronic
systems, wide bandgap semiconductor device's reliability,
and renewable energy conversion systems.
Bilal Akin (Bilal.Akin@utdallas.edu) received the
Ph.D. degree in electrical engineering from the Texas
A&M University, College Station, TX, United States in
2007. From 2005 to 2008, he was an R&D engineer with
Toshiba Industrial Division, Houston, TX, United States.
From 2008 to 2012, he was an R&D engineer with C2000
DSP Systems, Texas Instruments Incorporated. Since
2012, he has been with The University of Texas at Dallas, Richardson, TX 75080, United States, as a faculty.
His research interests include design, control and diagnosis of electric motors and drives, digital power control and management, and fault diagnosis and condition
monitoring of power electronics components and ac

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IEEE POWER ELECTRONICS MAGAZINE	

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motors. He is a recipient of NSF CAREER 2015 Award,
IEEE IAS Transactions First Place Prize Paper Award
and Top Editors Recognition Award from IEEE TVT
Society, and two Jonsson School Faculty Research
Awards. He is currently area editor of IEEE Transactions on Vehicular Technology.

References
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[10] T. Herrmann, M. Feller, J. Lutz, R. Bayerer and T. Licht, " Power cycling
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[11] H. Luo, F. Iannuzzo, F. Blaabjerg, M. Turnaturi and E. Mattiuzzo, " Aging
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[12] S. Dusmez and B. Akin, " An accelerated thermal aging platform to
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d'Alene, ID, 2015, pp. 1352-1358.
[13] E. Ugur and B. Akin, " Aging assessment of discrete SiC MOSFETs under
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[14] H. Chen, B. Ji, V. Pickert, and W. Cao, " Real-time temperature estimation
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[15] F. Erturk, E. Ugur, J. Olson, and B. Akin, " Real-time aging detection of
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IEEE Power Electronics Magazine - March 2021

Table of Contents for the Digital Edition of IEEE Power Electronics Magazine - March 2021

Contents
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