IEEE Power Electronics Magazine - September 2020 - 87

White Hot

(continued from page 92)

dc link capacitors integrated into the
assembly. To make a three-phase
active rectifier or inverter all that is
needed is to add a controller. This
level of packaging now seems to be
well developed and readily available
in the market.
Another level of integration is the
multi-chip module. Here I mean individual semiconductor die mounted
on a common substrate. The die
can be connected by a number of
means including wire bonds and
lead frames. The die can also be
flip-chip mounted onto conductors
on an interposer board. A very common example of this level of integration is the endless variety of IGBT
modules, in a wide array of configu-

rations and ratings available today.
Multi-chip modules made with silicon MOSFETs are also widely available. These are particularly popular for appliance and white good
motor drive applications where the
smaller size is advantageous. If you
have ever used a MOSFET rated at
100 A it is very likely that what you
have actually used was a multi-chip
module with two or more carefully
matched MOSFET die hiding in one
package. Now multi-chip module
packages with SiC devices are be coming readily available, although
at this time they are still relative ly expensive.
Another example of a multi-chip
module is the combination of a

driver(s) with one or two MOSFETs
in a package ca lled a "DrMOS".
DrMOS devices were introduced
some years back to reduce the size
and cost of on-board voltage regulator modules (VRMs) that power high
performance processors. Aside from
the size reduction, the minimization
of the gate drive loop and common
source inductances improves the
switching performance by reducing the energy loss in each switching cycle.
So if co-packaging the driver and
switch improves switching performance, what about putting them
both on the same die? This has been
done for a long time. Take a look at
any dc-dc converter chip and you

IEEE PEM_20200817-7inx4.8in-outline.pdf 1 2020/8/18 上午 10:16:02

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September 2020

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IEEE Power Electronics Magazine - September 2020

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