IEEE Power Electronics Magazine - September 2021 - 36

is only 3.5 mm thick resulting in a converter total thickness
of just 5 mm. The choice of a three-level converter topology
ensured the required inductance for the converter was
reduced by 70% when compared to a standard buck converter
operating under the same conditions.
About the Authors
Michael A. de Rooij (michael.derooij@epc-co.com)
received the B. Eng., M. Eng. and, D. Eng. degrees from
The University of Johannesburg (previously Rand Afrikaans
University), Johannesburg, South Africa, in 1992,
1994 and 1998 respectively, all in electronics and electrical
engineering with major in power electronics. He is
currently vice president of applications engineering at
Efficient Power Conversion Corporation (EPC) headquartered
in El Segundo, CA, USA. Dr. de Rooij has
authored and co-authored over 50 papers at various conferences
and journals and has been granted 55 U.S. and
international patents and 12 U.S. and international pending
patent applications. He is the author and co-author of
six books. His experience covers highly resonant, loosely
coupled wireless power, high density dc to dc converters,
GaN IC development, RF power amplifiers, solid-state
high-frequency power converters and devices, utility
applications of power electronics, uninterruptible power
supplies, integration of power electronic converters,
power electronic packaging, induction heating, photovoltaic
converters, magnetic resonance imaging systems and
gate drivers with protection features. He is a senior member
of IEEE.
Quentin Laidebeur is the product definition engineer
and has worked at Würth Elektronik since 2011. He studied
general engineering and material properties at the University
of Lyon in France. He started his career as a
mechanical engineer and led the connector engineering
group at Würth Elektronik France. He left Europe for the
USA in 2015, and is currently team leader of the product
definition engineers of America, an international business
unit of the Würth Elektronik eiSos group. He works with
the U.S. west coast IC manufacturers by supporting application
engineers with their passive component design
requirements. Specializing in power transfer efficiency,
electromagnetic emission, and filtering, he is continuously
researching new trends in the industry and aims to develop
new products that will fulfill application requirements
of tomorrow.
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36 IEEE POWER ELECTRONICS MAGAZINE z September 2021

http://www.vicorpower.com http://www.analog.com http://www.analog.com/ http://www.analog.com/ https://www.we-online.com/web/en/electronic_components/news_pbs/blog_pbcm/blog_detail-worldofelectronics_109449.php https://www.we-online.com/web/en/electronic_components/news_pbs/blog_pbcm/blog_detail-worldofelectronics_109449.php https://www.analog.com/en/analog-dialogue/articles/does-the-assembly-orientation-of-an-smps-inductor-affect-emissions.html?utm_source=74459&utm_medium=linkedin&es_sh=b59c5a98666154268916057c6a36de6a&es_ad=76218# https://www.analog.com/en/analog-dialogue/articles/does-the-assembly-orientation-of-an-smps-inductor-affect-emissions.html?utm_source=74459&utm_medium=linkedin&es_sh=b59c5a98666154268916057c6a36de6a&es_ad=76218# https://www.analog.com/en/analog-dialogue/articles/does-the-assembly-orientation-of-an-smps-inductor-affect-emissions.html?utm_source=74459&utm_medium=linkedin&es_sh=b59c5a98666154268916057c6a36de6a&es_ad=76218# http://www.epc-co.com/epc/Products/DemoBoards/EPC9148.aspx http://www.deltaww.com http://www.epc-co.com/epc/Products/DemoBoards/EPC9148.aspx https://www.we-online.com/ catalog/datasheet/7443762504022.pdf https://www.we-online.com/ catalog/datasheet/7443762504022.pdf

IEEE Power Electronics Magazine - September 2021

Table of Contents for the Digital Edition of IEEE Power Electronics Magazine - September 2021