IEEE Power Electronics Magazine - September 2022 - 20
Terminals DCDC-link
PCB Busbar
3D Printed Insulation
DC - Busbar
Stage 1:
1334 V / 2000 V
APS Board
Zoomed in
0 V / 2 kV
Dc inputs
Currenty Sensor &
AC Busbar
178 mm
Gate Drive Board
Nylon Spacer
Power Module
120 mm
IMMD power converter unit
Stage 2:
Stage 3:
0 V / 667 V
667 V / 1334 V
Potential PD locations (sources) for power converter
system
Integrated modular motor
drive (IMMD) and the motor
* High voltage terminals (DC and AC)
* Busbar edges
* Device surfaces (PCB and power module)
* Power module interior
FIG 5 Potential PD locations of power electronics submodules for a 1 MVA IMMD for electrified propulsion.
Copper Silicone gel
Direct wire
bonding
(DBC)
Copper
AIN
GND
HV
GND
Back copper
(a)
Triple point
GND
Floating
Ceramic
(c)
Surface
roughness
Silicone gel
HV
200 400
Pulse width /µs
FIG 6 Triple point, direct bond copper (DBC) test coupons, and PDIV versus rise time and pulse width [29].
600 800
HV
Silicone gel
Protrusion
(b)
3.5
4.0
4.5
5.0
5.5
tr=200 ns
tr=150 ns
tr=100 ns
Power module unit
DC + Busbar
Necessary wire
bounding
DBC
ceramic
Triple
points
Die
AC DC+
Housing
Encapsulation
Solder
Baseplate
(faster switching) will result in lower PDIV. This is largely
because that shorter rise time will have more impact on
the voltage integration over time when the applied voltage
pulses are short.
The decreasing PDIV with fast switching speed means
more challenges in the insulation
design of SiC and GaN power modules,
especially for aerospace applications
where there is a need to further
reduce footprints of baseplates for
power modules for weight reduction
purposes.
For future hybrid and turbo electric
propulsion, the required electric
power is estimated to be 20 MW for
a commercial regional single aisle
aircraft. This means that the dc distribution
voltage for these aircrafts
will need be much higher than current ±270 V. Thus, the
expected high voltage, together with the high altitude and
high switching speed call for innovations in insulation
material, insulation design and grounding strategies.
EMI
At cryogenic
temperature, some
devices showed
decreased switching
losses while some
showed increased
switching losses.
20 IEEE POWER ELECTRONICS MAGAZINE z September 2022
The higher switching speed and
higher switching frequency of WBG
devices will improve the efficiency
and power quality of power electronics
circuits. But at the same time,
more EMI related issues could be
expected. For motor drives, as shown
in Figure 7, the common mode current
largely is a result of the common
mode voltage at the neutral point of
the electric machine and distributed
parasitic capacitance of the motor,
PDIV /kV
IEEE Power Electronics Magazine - September 2022
Table of Contents for the Digital Edition of IEEE Power Electronics Magazine - September 2022
Contents
IEEE Power Electronics Magazine - September 2022 - Cover1
IEEE Power Electronics Magazine - September 2022 - Cover2
IEEE Power Electronics Magazine - September 2022 - Contents
IEEE Power Electronics Magazine - September 2022 - 2
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IEEE Power Electronics Magazine - September 2022 - Cover3
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