IEEE Robotics & Automation Magazine - March 2017 - 76

CAD (WoodenHaptics uses Solidworks), in two-dimensional vector graphics software (modifications through
free software such as Inkscape), and after fabrication,
using carpentry hand tools. The ability to engrave text on
parts could be used to assist in the sorting of parts to their
logical subassemblies, that is, for the bodies A, B, and C of
the WoodenHaptics device.
A challenge for the stacked plywood method is the variance in quality and thickness of the plywood sheets and the
inconsistency in the precision of the cuts, especially if a
service provider is contracted. However, the existence of
laser-cutting firms that can ship internationally and repeatedly reproduce a design within tolerances can be a key to
wider dissipation and sharing of different designs within the
community. For WoodenHaptics, we have uploaded the
exact files and manufacturing instructions used for a
successful order of laser-cut plywood and PCBs. Providing a
complete bill of materials, including the exact choice of
default components and suppliers that ship internationally,
is important for allowing the user to choose when to go for
the default and when to substitute and do the necessary
adjustments to retain compatibility with the rest (Table 3).
The sourcing process could be further assisted through
open-hardware-facilitating companies that provide complete physical kits or modules. Finally, as affordable 3-D
printing technologies improve (with tens of microns precision features) and options for high-stiffness and low-mass
materials such as aluminum extrusions are able to be formed
in a precise manner, we foresee that the WoodenHaptics
hardware could be fabricated using 3-D printing as well.
The WoodenHaptics project is maintained at http://www
.woodenhaptics.org.
Acknowledgments
The authors would like to thank Reuben Brewer and Ken
Salisbury (Stanford University), Adam Leeper (Google),
François Conti (Force Dimension), and Jordi Solsona
(KTH) for their assistance and insight in the formation and
development of this project. We also thank Eva-Lotta
Sallnäs Pysander and Ylva Fernaeus (KTH) for supporting the project.
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Michael Yip, Department of Electrical and Computer
Engineering, University of California, San Diego. E-mail:
yip@ucsd.edu.
Jonas Forsslund, Forsslund Systems AB, Visby, Sweden. E-mail:
jonas@forsslund.org.


http://www http://www.woodenhaptics.org http://www.chai3d.org

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