IEEE Solid-State Circuits Magazine - Fall 2017 - 142

Attendees enjoying the dessert buffet at the conclusion of the gala dinner.

The company fair. The gold sponsors were Dialog Semiconductor, Micron Semiconductor, and STMicroelectronics.

The registration desk.

Mount Etna, the highest active volcano
in Europe.
PRIME was an unprecedented success with more than 200 delegates
and 96 presented works from a total
of 136 manuscript submissions.
The conference was honored by the
presence of Prof. Franco Maloberti,
IEEE CASS president, and Prof. Andrea
Baschirotto, chair of the IEEE SSCS
Italian Chapter.

142

FA L L 2 0 17

PRIME 2017 offered a multitude of
opportunities for the attendees to
gain knowledge about relevant topics
in micro/nanoelectronics. The technical program included a preconference
workshop and a tutorial presented
by CADENCE Academic Network and
STMicroelectronics. Three keynote
speeches were given, one per day:
"System in Package Products and
Trends" (by Francesco Pulvirenti,

IEEE SOLID-STATE CIRCUITS MAGAZINE

STMicroelectronics), "System in Package
Design Challenge" (by Roberto G. Massolini, Texas Instruments), and "3D
NAND Memories Technology Trends"
(by Tommaso Vali, Micron Semiconductor). There were also three days
of technical sessions with three oral
sessions in parallel.
As per tradition, a company fair
was promoted by PRIME where the
attendees had the opportunity to
meet industrial exhibitors, such as
Dialog Semiconductor, Micron Semiconductor, STMicroelectronics, CADENCE
Academic Network, Coilcraft, InvenSense,
ON Semiconductor, Texas Instruments,
and Maxim Integrated.
PRIME 2017 was colocated with
the 14th International Conference
on Synthesis, Modeling, Analysis and
Simulation Methods and Applications to Circuit Design. Additional
information and photos from PRIME
2017 can be found on its website,
http://prime2017.unisa.it.
-Salvatore Pennisi



http://prime2017.unisa.it

Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Fall 2017

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