IEEE Solid-State Circuits Magazine - Fall 2017 - 143

ISSCC 2018-"Silicon Engineering a Social World"

C

Continued advances in solid-state
circuits and systems have brought
evermore powerful communication
and computational capabilities into
mobile form factors. Such ubiquitous
smart devices lie at the heart of a revolution shaping how we connect, collaborate, build relationships, and
share information. These social technologies allow people to maintain connections and support networks that
otherwise would not be possible; they
provide the ability to access information instantaneously and from any
location, thereby helping to shape the
world's events and culture, empowering citizens of all nations, providing
social networks, and allowing worldwide communities to develop and
bond with common interests.
The 2018 International Solid-State
Circuits Conference (ISSCC 2018) will
showcase numerous innovations that
will fuel further progress toward a
truly connected social world. ISSCC
2018 will be held at the San Francisco
Marriott Marquis from 11 to 15 February 2018.
The plenary session on Monday,
11 February, will feature four distinguished invited speakers:
■ Vince Roche, president, chief executive officer, Analog Devices,
United States, will present "Semiconductor Innovation: Is the Party
Over or Just Getting Started?" and
explore the next paradigm for
semiconductor innovation and
what our path forward as scientists, technologists, and industry
overall will be.
■ Barbara De Salvo, chief scientist and
scientific director, CEA-Leti, France,
will give her insights in her talk,
"Brain-Inspired Technologies: Towards Chips That Think," and will
illustrate a research strategy encompassing algorithms, circuits,
and components, all in support of
Digital Object Identifier 10.1109/MSSC.2017.2746199

David Patterson, professor of the
graduate school at the University of
California, Berkeley, will discuss "50
Years of Computer Architecture:
From Mainframe CPUs to NeuralNetwork TPUs," reviewing a halfcentury of computer architecture,
from the IBM System 360 to modern
domain-specific computer architectures such as Google's Tensor
Processing Unit.
ISSCC 2018 will feature educational
events such as tutorials for those who
wish to learn the basics of circuit topics and forums for experts who want
to be in touch with the latest trends.
This year, the conference will feature
ten 90-min tutorials on Sunday, 11
February (see Table 1 for details).
Of the six all-day forums, two will
be on Sunday, 11 February, and four
on Thursday, 15 February (see Table 2
for details).
■

The 2018 International
Solid-State Circuits
Conference (ISSCC 2018)
will showcase numerous
innovations that will
fuel further progress
toward a truly
connected social world.

■

brain-inspired technologies to meet
the needs of 21st century applications.
Yukihiro Kato, senior executive director, Denso, Japan, will give the
talk "Future Mobility Society Enabled by Semiconductor Technology" and discuss how the automotive industry is in the midst of a
once-in-a-century transformation
caused by electrification, automated driving, and connected vehicles.

TABLE 1. TUTORIALS-SUNDAY, 11 FEBRUARY.
*

Low-Jitter PLLs for Wireless Transceivers

Xiang Gao, Credo Semiconductor, Milpitas, California, United States
*

Nonvolatile Circuits for Memory, Logic, and Artificial Intelligence
Meng-Fan Chang, National Tsing Hua University, Hsinchu, Taiwan

*

Basics of Quantum Computing
Edoardo Charbon, EPFL, Switzerland

*

Error-Correcting Codes in 5G/NVM Applications
Hsie-Chia Chang, National Chiao Tung University, Hsinchu, Taiwan

*

Hybrid Design of Analog-to-Digital Converters
Seng-Pan (Ben) U, University of Macau, Macau

*

Single-Photon Detection in CMOS
Matteo Perenzoni, FBK, Trento, Italy

*

Basics of Adaptive and Resilient Circuits
Keith Bowman, Qualcomm, Raleigh, North Carolina, United States

*

Fundamentals of Switched-Mode Power Converter Design
Hoi Lee, The University of Texas at Dallas, United States

*

Digital RF Transmitters
Renaldi Winoto, Tectus, Saratoga, California, United States

*

ADC-Based Serial Links: Design and Analysis
Samuel Palermo, Texas A&M University, United States

Date of publication: 16 November 2017

IEEE SOLID-STATE CIRCUITS MAGAZINE

FA L L 2 0 17

143
Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Fall 2017
