IEEE Solid-State Circuits Magazine - Fall 2017 - 145

IEEE N E WS

CEDA Currents

T

The following is reprinted from CEDA
Currents, September 2017 issue, a publication of the IEEE Council on Electronic Design Automation (CEDA).
Please send contributions to Jose L.
Ayala (jayala@fdi.ucm.es).

SMACD 2017 EDA Competition
The 2017 edition of the International Conference on Synthesis,
Modeling, Analysis and Simulation
Methods and Applications to Circuit Design (SMACD 2017) was held
in Giardini Naxos-Taormina, Italy,
12-15 June 2017, with the technical
sponsorships of IEEE, IEEE Circuits
and Systems Society (CASS) and IEEE
Council on Electronic Design Automation (CEDA).
Since several editions, SMACD
organizes an EDA students' competition, where M.Sc. and Ph.D. students
can compete with their best ideas,
methodologies, flows, and tools
with one unique but challenging
goal: improving design automation
for integrated circuits and systems.
Every year the number of papers and
live demos proposed for the competition is increasing as well as the
quality and the potentiality of the
proposed solutions. A US$1,000 prize
has been granted to the winner of the
competition. IEEE CEDA has also promoted the event, funding US$500 of
the total prize.
The 2017 edition of the competition has been coorganized by Rafael
Castro-Lopez (CSIC and University
of Seville, Spain) and Ralf Sommer
(Ilmenau University of Technology,
Germany). In two dedicated sessions
of the conference, the best six proposals and ideas were presented

by the students. A committee of
experts from academia and industry
interacted with the students during
the sessions and selected the winner of the competition based on the
quality of the paper, its presentation, and its live demo. The competition prize was granted to Axel Hald,
from Automotive Electronics Robert
Bosch GmbH, Germany. His paper,
titled "A New Method for the Analysis
of Movement Dependent Parasitics in
Full Custom Designed MEMS Sensor,"
(coauthors: J. Seelhorst, P. Herzogenrath, J. Scheible and J. Lienig)
was awarded during the SMACD 2017
gala dinner.
More details on the competition
are available at http://smacd2017
.unisa.it/?id=callcomp.

Recipient of the Accellera Systems
Initiative 2017 Leadership Award
Congratulations to Shishpal Rawat,
president of CEDA, as recipient of

UPCOMING CONFERENCES
(YAO-WEN CHANG,
YWCHANG@NTU.EDU.TW)
*

FMCAD
TU Wien, Vienna, Austria
October 2-6

*

ESWEEK
Seoul, Korea
October 15-20

*

NOCS
Seoul, Korea

Digital Object Identifier 10.1109/MSSC.2017.2746200

the Accellera Systems Initiative
2017 Leadership Award. The award
recognizes the vision, leadership,
and contribution to standards development, governance, and promotional
activities of an Accellera member
on behalf of the organization. The
award was presented to Shishpal at
the 54th Design Automation Conference (DAC) during the Accellera Breakfast and Portable Stimulus Town Hall
on Tuesday, June 20.
"Shishpal has had a profound impact on the advancement of Accellera's
mission and its growth worldwide,"
stated Lu Dai, Accellera Systems
Initiative chair. "We are grateful for
his years of leadership and dedication. Among his many accomplishments during his tenure as chair of the
Board of Accellera from 2010 to 2016,
15 members were added worldwide,
three standards were published, and
two of those standards were successfully delivered to the IEEE Standards
Association (SystemC AMS and UVM).
He is very deserving of this award, and
I am proud to honor him among his colleagues at DAC."
"I am deeply honored by this recognition from Accellera," stated Dr.
Shishpal Rawat. "With the help of key
leaders in Accellera, we were able to
expand the technical scope of Accellera and also market its standards
across the globe at multiple DVCon

October 19-20

IEEE Embedded Systems Letters is open for
submissions. Visit mc. manuscriptcentral
.com/les-ieee.
IEEE Design & Test is open for submissions. Visit mc.manuscriptcentral.com/
dandt and ieee-ceda.org/publications/
d-t/paper-submission.

Date of publication: 16 November 2017

IEEE SOLID-STATE CIRCUITS MAGAZINE

FA L L 2 0 17

145


http://www.M.Sc http://smacd2017 http://www.unisa.it/?id=callcomp http://mc.manuscriptcentral.com/ http://www.ieee-ceda.org/publications/

Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Fall 2017

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