IEEE Solid-State Circuits Magazine - Fall 2017 - 146

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conferences. These standards continue to have a positive impact on
the productivity of chip design and
design tools. I look forward to continued collaboration with Accellera."
Shishpal has more than 30 years of
experience in the electronics industry.
He held a variety of positions at Intel
Corporation prior to his retirement
last year, most recently as director of
external EDA strategy.
Shishpal became chair of Accellera
in June 2010. As chair of Accellera, he
oversaw the consolidation of standards bodies, namely the merger
with OSCI, as well as the acquisition
of the OCP standard. He also helped
to extend the relationship with the
IEEE Standards Association's IEEE Get
Program for an additional ten years,
ensuring continued public access
to view and download current EDA
standards at no charge, courtesy of
Accellera. He managed the relicensing
of SystemC contributions to Apache

Are You
Moving?

2.0 and oversaw the move toward
standardization of the Universal Verification Methodology (UVM) standard
to IEEE 1800.2. The Verilog AMS standard also moved under the SystemVerilog AMS standard. The deployment
of Accellera standards via the DVCon
brand of conferences expanded to
Europe and India, and the planning
and development for DVCon China was
initiated during his term of leadership.
Most recently, the emerging Portable
Stimulus standard made significant
strides since work began in 2015 while
Shishpal was chair of Accellera.

IEEE COUNCIL ON ELECTRONIC
DESIGN AUTOMATION
President: Shishpal Rawat
President-Elect: David Atienza
Past President: Sani Nassif
Secretary: Eli Bozorgzadeh
VP Conferences: Yao-Wen Chang
VP Finance: Gi-Joon Nam
VP Publications: Helmut Graeb
VP Publicity: Jose Ayala
VP Activities: Peng Li
Strategy Chair: David Atienza
Awards Chair: Hidetoshi Onodera

Papers in IEEE Embedded
Systems Letters
The top-five accessed articles from
IEEE Embedded Systems Letters in
June 2017 were as follows:
■ "Testing Autonomous Vehicle Software in the Virtual Prototyping
Environment," by B. Kim et al.
■ "Energy Efficient Outdoor Light
Monitoring and Control Architecture Using Embedded System," by
Z. Kaleem, T.M. Yoon, and C. Lee
■ "Public Key Authentication and Key
Agreement in IoT Devices With
Minimal Airtime Consumption," by S.
Sciancalepore et al.
■ "Arduino Debugger," by J. Dolinay
et al.
■ "Wearable Camera- and Accelerometer-Based Fall Detection on Porta-

ble Dev ices," by K. Ozcan and
S. Velipasalar.

Papers in IEEE Design and Test
The top-five accessed articles from
IEEE Design and Test in June 2017
were as follows:
■ "Recent Technology Advances of
Emerging Memories," by Y. Chen et al.
■ "Security and Privacy in Cyber-Physical Systems: A Survey of Surveys,"
by J. Giraldo et al.
■ "Computing in the Dark Silicon
Era: Current Trends and Research
Challenges," by M. Shafique et al.
■ "Post-Silicon Validation in the SoC
Era: A Tutorial Introduction," by P.
Mishra et al.
■ "Approximate Computing: A Survey," by Qiang Xu et al.

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Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Fall 2017