IEEE Solid-State Circuits Magazine - Fall 2017 - 33

About the Authors
Power/Performance (%)

250
+40% Power-Efficiency
Improvement Versus HP

200

HP-Cluster
150

LP-Cluster
ULP-Cluster

100

50

+44% Power-Efficiency
Improvement Versus LP
0

100
200
300
Single-Threaded Performance (%)

400

FIGURE 11: CPU power-efficiency curves showing for three CPU types the single-threaded
performance versus the power.

efficiency curves to allow the sched-
uler to make important CPU tradeoffs.
The curves in Figure 11 show the CPU
single-threaded performance versus
the power per CPU as a function of per-
formance. If the HMP architecture can
provide different CPUs, then the soft-
ware can choose the CPU that provides
the lowest possible power for that
given performance requirement [4].
As the system and software become
optimized to minimize power/perfor-
mance for a given application, per-
haps the next optimizations will take
place upward at the humanities level,
where the human aspect of comput-
ing might be brought in. New comput-
ing models such as deep learning and
brain-inspired computing will help
us to further improve the user expe-
rience and power efficiency of the
devices we all rely on in our every day.
The future is extremely bright and
the opportunity is rich in the area of
mobile computing!

Acknowledgments
Many thanks to all of the worldwide
engineering teams at MediaTek who
contributed their blood, sweat, and
tears to this innovative work and deep
appreciation to the management at
MediaTek to support new and excit-
ing technology to be introduced to
our products.

References

[1] A. Wang, T.-Y. Lin, S. Ouyang, W.-H. Huang,
J. Wang, S.-H. Chang, S.-P. Chen, C.-H. Hu,
J. C. Tai, K.-S. Tan, M.-N. Tsou, M.-H. Lee,
G. Gammie, C.-W. Yang, C.-C. Yang, Y.-C.
Chou, S.-H. Lin, W. Kuo, C.-J. Chung, L.-K.
Yong, C.-W. Wang, K. H. Dia, C.-H. Chien,
Y.-M. Tsao, N. Kumar S., R. Lagerquist,
C.-C. Chen, and U. Ko1 "Heterogeneous
multi-processing quad-core CPS and du-
al-GPU design for optimal performance,
power, and thermal tradeoffs in a 28nm
mobile application processor," in Proc. Int.
Solid-State Circuits Conf. Dig., 2014, pp.
180-181.
[2] H. Mair, G. Gammie, A. Wang, S. Gururaja-
rao, I. Lin, H. C. Chen, W. Kuo, A. Rajago-
palan, W.-Z. Ge, R. Lagerquist, S. Rahman,
C. J. Chung, S. Wang, L.-K. Wong, Y.-C.
Zhuang, K. Li, J. Wang, M. Chau, Y. Liu, D.
Dia, M. Peng, and U. Ko "A highly integrat-
ed smartphone SoC featuring a 2.5GHz
octa-core CPU with advanced high-per-
formance and low-power techniques," in
Proc. Int. Solid-State Circuits Conf. Dig.,
2015, pp. 425-426.
[3] H. T. Mair, G. Gammie, A. Wang, R. Lager-
quist, C. J. Chung, S. Gururajarao, P. Kao,
A. Rajagopalan, A. Saha, A. Jain, E. Wang,
S. Ouyang, H. Wen, A. Thippana, H.-C.
Chen, S. Rahman, M. Chau, A. Varma, B.
Flachs, M. Peng, A. Tsai, V. Lin, U. Fu, W.
Kuo, L.-K. Yong, C. Peng, L. Shieh, J. Wu,
and U. Ko, "A 20nm 2.5GHz ultra-low-
power tri-cluster CPU subsystem with
adaptive power allocation for optimal
mobile SoC performance," in Proc. Int.
Solid-State Circuits Conf. Dig., 2016.
pp. 76-77.
[4] H. Mair, E. Wang, A. Wang, P. Kao, Y. Tsai,
S. Gururajarao, R. Lagerquist, J. Son, G.
Gammie, G. Lin, A. Thippana, K. Li, M.
Rahman, W. Kuo, D. Yen, Y.-C. Zhuang, U.
Fu, H.-W. Wang, M. Peng, C.-Y. Wu, T. Do-
sluoglu, A. Gelman, D. Dia, G. Gurumur-
thy, T. Hsieh, W. X. Lin, R. Tzeng, J. Wu,
C. H. Wang, and U. Ko, "A 10nm FinFET
2.8GHz tri-gear deca-core CPU complex
with optimized power-delivery network
for mobile SoC performance," in Proc.
Int. Solid-State Circuits Conf. Dig., 2017,
pp. 56-57.

Alice Wang (alice.wang@mediatek
.com) received her bachelor's, mas-
ter's, and Ph.D. degrees in electrical
engineering and computer science
from the Massachusetts Institute of
Technology, in 1997, 1998, and 2004,
respectively. She wrote the paper "A
180-mV Subthreshold FFT Proces-
sor Using a Minimum Energy Design
Methodology" with Prof. Anantha
Chandrakasan, which inspired a new
research field in ultra-low voltage
technology. After her Ph.D., she spent
eight years at Texas Instruments and
six years at MediaTek developing
low-power circuit and system tech-
nology for mobile baseband applica-
tion processors and radios. Her work
on low-power technology has been
showcased in more than 30 IEEE pub-
lications, and she has coauthored two
books. She is a Senior Member of the
IEEE. Currently, she is an assistant
general manager in high-performance
processor technology at MediaTek.
She has served on the International
Solid-State Circuit Conference Techni-
cal Program Committee for more than
ten years and been a guest editor of
IEEE Journal of Solid-State Circuits. She
was elected to the Advisory Commit-
tee for the IEEE Solid-State Circuits
Committee (2017-2019) and heads up
the IEEE Solid-State Circuit Society
Women in Circuits Committee.
Hugh Mair graduated from Glasgow
University with a degree in electrical
and electronics engineering in 1990
and joined the mixed-signal design
group of Texas Instruments, Dallas.
His work has focused on high-speed,
low-power mixed-signal and digital
circuit design, including high-rate/
long-reach SERDES, low-power SRAM,
and power management for advanced
CMOS. He has authored/coauthored
19 papers and invented/coinvented
more than 50 patents. Currently, he
is an assistant general manager in
high-performance processor technol-
ogy at MediaTek.

IEEE SOLID-STATE CIRCUITS MAGAZINE

FA L L 2 0 17

33



Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Fall 2017

IEEE Solid-State Circuits Magazine - Fall 2017 - Cover1
IEEE Solid-State Circuits Magazine - Fall 2017 - Cover2
IEEE Solid-State Circuits Magazine - Fall 2017 - 1
IEEE Solid-State Circuits Magazine - Fall 2017 - 2
IEEE Solid-State Circuits Magazine - Fall 2017 - 3
IEEE Solid-State Circuits Magazine - Fall 2017 - 4
IEEE Solid-State Circuits Magazine - Fall 2017 - 5
IEEE Solid-State Circuits Magazine - Fall 2017 - 6
IEEE Solid-State Circuits Magazine - Fall 2017 - 7
IEEE Solid-State Circuits Magazine - Fall 2017 - 8
IEEE Solid-State Circuits Magazine - Fall 2017 - 9
IEEE Solid-State Circuits Magazine - Fall 2017 - 10
IEEE Solid-State Circuits Magazine - Fall 2017 - 11
IEEE Solid-State Circuits Magazine - Fall 2017 - 12
IEEE Solid-State Circuits Magazine - Fall 2017 - 13
IEEE Solid-State Circuits Magazine - Fall 2017 - 14
IEEE Solid-State Circuits Magazine - Fall 2017 - 15
IEEE Solid-State Circuits Magazine - Fall 2017 - 16
IEEE Solid-State Circuits Magazine - Fall 2017 - 17
IEEE Solid-State Circuits Magazine - Fall 2017 - 18
IEEE Solid-State Circuits Magazine - Fall 2017 - 19
IEEE Solid-State Circuits Magazine - Fall 2017 - 20
IEEE Solid-State Circuits Magazine - Fall 2017 - 21
IEEE Solid-State Circuits Magazine - Fall 2017 - 22
IEEE Solid-State Circuits Magazine - Fall 2017 - 23
IEEE Solid-State Circuits Magazine - Fall 2017 - 24
IEEE Solid-State Circuits Magazine - Fall 2017 - 25
IEEE Solid-State Circuits Magazine - Fall 2017 - 26
IEEE Solid-State Circuits Magazine - Fall 2017 - 27
IEEE Solid-State Circuits Magazine - Fall 2017 - 28
IEEE Solid-State Circuits Magazine - Fall 2017 - 29
IEEE Solid-State Circuits Magazine - Fall 2017 - 30
IEEE Solid-State Circuits Magazine - Fall 2017 - 31
IEEE Solid-State Circuits Magazine - Fall 2017 - 32
IEEE Solid-State Circuits Magazine - Fall 2017 - 33
IEEE Solid-State Circuits Magazine - Fall 2017 - 34
IEEE Solid-State Circuits Magazine - Fall 2017 - 35
IEEE Solid-State Circuits Magazine - Fall 2017 - 36
IEEE Solid-State Circuits Magazine - Fall 2017 - 37
IEEE Solid-State Circuits Magazine - Fall 2017 - 38
IEEE Solid-State Circuits Magazine - Fall 2017 - 39
IEEE Solid-State Circuits Magazine - Fall 2017 - 40
IEEE Solid-State Circuits Magazine - Fall 2017 - 41
IEEE Solid-State Circuits Magazine - Fall 2017 - 42
IEEE Solid-State Circuits Magazine - Fall 2017 - 43
IEEE Solid-State Circuits Magazine - Fall 2017 - 44
IEEE Solid-State Circuits Magazine - Fall 2017 - 45
IEEE Solid-State Circuits Magazine - Fall 2017 - 46
IEEE Solid-State Circuits Magazine - Fall 2017 - 47
IEEE Solid-State Circuits Magazine - Fall 2017 - 48
IEEE Solid-State Circuits Magazine - Fall 2017 - 49
IEEE Solid-State Circuits Magazine - Fall 2017 - 50
IEEE Solid-State Circuits Magazine - Fall 2017 - 51
IEEE Solid-State Circuits Magazine - Fall 2017 - 52
IEEE Solid-State Circuits Magazine - Fall 2017 - 53
IEEE Solid-State Circuits Magazine - Fall 2017 - 54
IEEE Solid-State Circuits Magazine - Fall 2017 - 55
IEEE Solid-State Circuits Magazine - Fall 2017 - 56
IEEE Solid-State Circuits Magazine - Fall 2017 - 57
IEEE Solid-State Circuits Magazine - Fall 2017 - 58
IEEE Solid-State Circuits Magazine - Fall 2017 - 59
IEEE Solid-State Circuits Magazine - Fall 2017 - 60
IEEE Solid-State Circuits Magazine - Fall 2017 - 61
IEEE Solid-State Circuits Magazine - Fall 2017 - 62
IEEE Solid-State Circuits Magazine - Fall 2017 - 63
IEEE Solid-State Circuits Magazine - Fall 2017 - 64
IEEE Solid-State Circuits Magazine - Fall 2017 - 65
IEEE Solid-State Circuits Magazine - Fall 2017 - 66
IEEE Solid-State Circuits Magazine - Fall 2017 - 67
IEEE Solid-State Circuits Magazine - Fall 2017 - 68
IEEE Solid-State Circuits Magazine - Fall 2017 - 69
IEEE Solid-State Circuits Magazine - Fall 2017 - 70
IEEE Solid-State Circuits Magazine - Fall 2017 - 71
IEEE Solid-State Circuits Magazine - Fall 2017 - 72
IEEE Solid-State Circuits Magazine - Fall 2017 - 73
IEEE Solid-State Circuits Magazine - Fall 2017 - 74
IEEE Solid-State Circuits Magazine - Fall 2017 - 75
IEEE Solid-State Circuits Magazine - Fall 2017 - 76
IEEE Solid-State Circuits Magazine - Fall 2017 - 77
IEEE Solid-State Circuits Magazine - Fall 2017 - 78
IEEE Solid-State Circuits Magazine - Fall 2017 - 79
IEEE Solid-State Circuits Magazine - Fall 2017 - 80
IEEE Solid-State Circuits Magazine - Fall 2017 - 81
IEEE Solid-State Circuits Magazine - Fall 2017 - 82
IEEE Solid-State Circuits Magazine - Fall 2017 - 83
IEEE Solid-State Circuits Magazine - Fall 2017 - 84
IEEE Solid-State Circuits Magazine - Fall 2017 - 85
IEEE Solid-State Circuits Magazine - Fall 2017 - 86
IEEE Solid-State Circuits Magazine - Fall 2017 - 87
IEEE Solid-State Circuits Magazine - Fall 2017 - 88
IEEE Solid-State Circuits Magazine - Fall 2017 - 89
IEEE Solid-State Circuits Magazine - Fall 2017 - 90
IEEE Solid-State Circuits Magazine - Fall 2017 - 91
IEEE Solid-State Circuits Magazine - Fall 2017 - 92
IEEE Solid-State Circuits Magazine - Fall 2017 - 93
IEEE Solid-State Circuits Magazine - Fall 2017 - 94
IEEE Solid-State Circuits Magazine - Fall 2017 - 95
IEEE Solid-State Circuits Magazine - Fall 2017 - 96
IEEE Solid-State Circuits Magazine - Fall 2017 - 97
IEEE Solid-State Circuits Magazine - Fall 2017 - 98
IEEE Solid-State Circuits Magazine - Fall 2017 - 99
IEEE Solid-State Circuits Magazine - Fall 2017 - 100
IEEE Solid-State Circuits Magazine - Fall 2017 - 101
IEEE Solid-State Circuits Magazine - Fall 2017 - 102
IEEE Solid-State Circuits Magazine - Fall 2017 - 103
IEEE Solid-State Circuits Magazine - Fall 2017 - 104
IEEE Solid-State Circuits Magazine - Fall 2017 - 105
IEEE Solid-State Circuits Magazine - Fall 2017 - 106
IEEE Solid-State Circuits Magazine - Fall 2017 - 107
IEEE Solid-State Circuits Magazine - Fall 2017 - 108
IEEE Solid-State Circuits Magazine - Fall 2017 - 109
IEEE Solid-State Circuits Magazine - Fall 2017 - 110
IEEE Solid-State Circuits Magazine - Fall 2017 - 111
IEEE Solid-State Circuits Magazine - Fall 2017 - 112
IEEE Solid-State Circuits Magazine - Fall 2017 - 113
IEEE Solid-State Circuits Magazine - Fall 2017 - 114
IEEE Solid-State Circuits Magazine - Fall 2017 - 115
IEEE Solid-State Circuits Magazine - Fall 2017 - 116
IEEE Solid-State Circuits Magazine - Fall 2017 - 117
IEEE Solid-State Circuits Magazine - Fall 2017 - 118
IEEE Solid-State Circuits Magazine - Fall 2017 - 119
IEEE Solid-State Circuits Magazine - Fall 2017 - 120
IEEE Solid-State Circuits Magazine - Fall 2017 - 121
IEEE Solid-State Circuits Magazine - Fall 2017 - 122
IEEE Solid-State Circuits Magazine - Fall 2017 - 123
IEEE Solid-State Circuits Magazine - Fall 2017 - 124
IEEE Solid-State Circuits Magazine - Fall 2017 - 125
IEEE Solid-State Circuits Magazine - Fall 2017 - 126
IEEE Solid-State Circuits Magazine - Fall 2017 - 127
IEEE Solid-State Circuits Magazine - Fall 2017 - 128
IEEE Solid-State Circuits Magazine - Fall 2017 - 129
IEEE Solid-State Circuits Magazine - Fall 2017 - 130
IEEE Solid-State Circuits Magazine - Fall 2017 - 131
IEEE Solid-State Circuits Magazine - Fall 2017 - 132
IEEE Solid-State Circuits Magazine - Fall 2017 - 133
IEEE Solid-State Circuits Magazine - Fall 2017 - 134
IEEE Solid-State Circuits Magazine - Fall 2017 - 135
IEEE Solid-State Circuits Magazine - Fall 2017 - 136
IEEE Solid-State Circuits Magazine - Fall 2017 - 137
IEEE Solid-State Circuits Magazine - Fall 2017 - 138
IEEE Solid-State Circuits Magazine - Fall 2017 - 139
IEEE Solid-State Circuits Magazine - Fall 2017 - 140
IEEE Solid-State Circuits Magazine - Fall 2017 - 141
IEEE Solid-State Circuits Magazine - Fall 2017 - 142
IEEE Solid-State Circuits Magazine - Fall 2017 - 143
IEEE Solid-State Circuits Magazine - Fall 2017 - 144
IEEE Solid-State Circuits Magazine - Fall 2017 - 145
IEEE Solid-State Circuits Magazine - Fall 2017 - 146
IEEE Solid-State Circuits Magazine - Fall 2017 - 147
IEEE Solid-State Circuits Magazine - Fall 2017 - 148
IEEE Solid-State Circuits Magazine - Fall 2017 - Cover3
IEEE Solid-State Circuits Magazine - Fall 2017 - Cover4
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2019
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2019
https://www.nxtbook.com/nxtbooks/ieee/mssc_2019summer
https://www.nxtbook.com/nxtbooks/ieee/mssc_2019winter
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018fall
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018summer
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018spring
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018winter
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2014
https://www.nxtbookmedia.com