IEEE Solid-State Circuits Magazine - Fall 2017 - 89

topology. Figure 10 shows the core
differential circuit incorporating the
capacitive neutralization technique.
Capacitive neutralization of differential amplifiers is a wideband technique that insures the stability of the
amplifier. Conse quently, differential front-end mm-wave power amplifiers on the transmitter side and
low-noise amplifiers on the receiver
side use this technique to achieve
wideband performance improvement. In addition, this technique can
be used at near-fmax frequencies to
boost the amplifier's power gain.
One important observation is that,
besides stabilizing the amplifier, neutralization essentially increases the
maximum allowable matching bandwidth of the amplifier, predicted by
the Bode-Fano limit [1]. This notion
will be used in wideband RF or mmwave applications.
For a better performance comparison,
consider two amplifiers in the same
180 -n m CMOS pr o cess, bot h de signed to operate at 28-GHz center frequency. In Figure 11, (a) shows a source
degenerated cascode amplifier, and (b)
indicates a common-source stage with
neutralization. For the sake of simplicity,
the input and output matching circuits
are realized with transformers. From
the simulated gain plots indicated in
Figure 12(a), the neutralized commonsource stage exhibits higher peak gain
and wider frequency response, which
is to be expected. Since the operation

frequency is close to fmax of the device
in this process, which is around 55 GHz,
the common-gate transistor contributes considerably to the overall
noise figure. The noise figure of the cascode amplifier is higher than that of the
neutralized common-source amplifier, which is also verified with noise figure simulation of these two stages [see
Figure 12(b)].

Conclusions
The general concept of amplifier
neutralization to overcome amplifier
instability has been around for many
years, dating back to the early part of the
20th century. This article provided an
overview of neutralization techniques
for high frequency amplifiers. First, the
problem of instability in non-unilateral
amplifiers driving tuned RLC tank circuits was studied. This discussion was
followed by revisiting RF cascode amplifiers. The issues associated with cascode topology at high frequencies were
briefly explained, which paved the way
for introducing the neutralization techniques in both single-ended and differential high-frequency amplifiers. Two
examples, a cascode amplifier with
source degeneration and a neutralized

Neutralized

6
5.5

6.5

5
4.5
4
3.5
3
2.5
2

5.5

6
Gain (dB)

Gain (dB)

Cascode

The general concept of amplifier neutralization
to overcome amplifier instability has been
around for many years, dating back to the
early part of the 20th century.

5

2.7 2.8 2.9
3
Frequency (Hz) × 1010
(a)

4
3

Acknowledgments
This work was supported in part by
a grant from the Samsung Advanced
Institute of Technology (SAIT) Global
Research Outreach (GRO) Program
and NSF Award ECCS-1611575.

References

[1] T. H. Lee, Planar Microwave Engineering:
A Practical Guide to Theory, Measurement,
and Circuits. Cambridge, U.K. Cambridge
Univ. Press, 2004.
[2] B. Razavi, Design of Analog CMOS Integrated Circuits, 2nd ed. New York: McGraw-Hill, 2016.
[3] P. Heydari, "Design and analysis of a performance-optimized CMOS UWB distributed LNA," IEEE J. Solid-State Circuits, vol.
42, no. 9, pp. 1892-1905, Sept. 2007.
[4] M. Zargari, M. Terrovitis, S. H. M. Jen, B. J.
Kaczynski, M. Lee, M. P. Mack, S. S. Mehta,
S. Mendis, K. Onodera, H. Samavati, W.
W. Si, K. Singh, A. Tabatabaei, D. Weber,
D. K. Su, and B. A. Wooley, "A single-chip
dual-band tri-mode CMOS transceiver
for IEEE 802.11a/b/g wireless LAN," IEEE
J. Solid-State Circuits, vol. 39, no. 12, pp.
2239-2249, Dec. 2004.
[5] V. Jain, S. Sundararaman, and P. Heydari,
"A CMOS 22-29GHz receiver front-end for
UWB automotive pulse-radars," in Proc.
IEEE Custom Integrated Circuits Conf.,
Sept. 2007, pp. 757-760.
[6] A. Shameli and P. Heydari, "A novel ultralow power (ULP) low noise amplifier using
differential inductor feedback," in Proc.
32nd European Solid-State Circuits Conf.,
Sept. 2006, pp. 352-355.
[7] K. K. Clarke and D. T. Hess, Communication Circuits: Analysis and Design, 2nd ed.
Florida: Krieger Publishing, 1994.

About the Authors

4.5
3.5

2.6

common-source amplifier, in a 180-nm
CMOS process and for carrier frequency
of 28 GHz were presented. The commonsource amplifier shows higher power
gain and lower noise figure compared to
the cascode amplifier, as was anticipated
from the study of this article.

2.6

2.7 2.8 2.9
3
Frequency (Hz) × 1010
(b)

FIGURE 12: (a) Simulated gain versus frequency. (b) Simulated noise figure versus frequency
for both cascode and common-source amplifiers in Figure 11(a) and (b).

Payam Heydari is a full professor of
electrical engineering at the University of California, Irvine. He is noted
for his pioneering work on siliconbased millimeter-wave and terahertz
IC design. He is the author or coauthor
of two books, one book chapter, and
more than 130 journal and conference
papers. He is a Fellow of the IEEE.

IEEE SOLID-STATE CIRCUITS MAGAZINE

FA L L 2 0 17

89



Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Fall 2017

IEEE Solid-State Circuits Magazine - Fall 2017 - Cover1
IEEE Solid-State Circuits Magazine - Fall 2017 - Cover2
IEEE Solid-State Circuits Magazine - Fall 2017 - 1
IEEE Solid-State Circuits Magazine - Fall 2017 - 2
IEEE Solid-State Circuits Magazine - Fall 2017 - 3
IEEE Solid-State Circuits Magazine - Fall 2017 - 4
IEEE Solid-State Circuits Magazine - Fall 2017 - 5
IEEE Solid-State Circuits Magazine - Fall 2017 - 6
IEEE Solid-State Circuits Magazine - Fall 2017 - 7
IEEE Solid-State Circuits Magazine - Fall 2017 - 8
IEEE Solid-State Circuits Magazine - Fall 2017 - 9
IEEE Solid-State Circuits Magazine - Fall 2017 - 10
IEEE Solid-State Circuits Magazine - Fall 2017 - 11
IEEE Solid-State Circuits Magazine - Fall 2017 - 12
IEEE Solid-State Circuits Magazine - Fall 2017 - 13
IEEE Solid-State Circuits Magazine - Fall 2017 - 14
IEEE Solid-State Circuits Magazine - Fall 2017 - 15
IEEE Solid-State Circuits Magazine - Fall 2017 - 16
IEEE Solid-State Circuits Magazine - Fall 2017 - 17
IEEE Solid-State Circuits Magazine - Fall 2017 - 18
IEEE Solid-State Circuits Magazine - Fall 2017 - 19
IEEE Solid-State Circuits Magazine - Fall 2017 - 20
IEEE Solid-State Circuits Magazine - Fall 2017 - 21
IEEE Solid-State Circuits Magazine - Fall 2017 - 22
IEEE Solid-State Circuits Magazine - Fall 2017 - 23
IEEE Solid-State Circuits Magazine - Fall 2017 - 24
IEEE Solid-State Circuits Magazine - Fall 2017 - 25
IEEE Solid-State Circuits Magazine - Fall 2017 - 26
IEEE Solid-State Circuits Magazine - Fall 2017 - 27
IEEE Solid-State Circuits Magazine - Fall 2017 - 28
IEEE Solid-State Circuits Magazine - Fall 2017 - 29
IEEE Solid-State Circuits Magazine - Fall 2017 - 30
IEEE Solid-State Circuits Magazine - Fall 2017 - 31
IEEE Solid-State Circuits Magazine - Fall 2017 - 32
IEEE Solid-State Circuits Magazine - Fall 2017 - 33
IEEE Solid-State Circuits Magazine - Fall 2017 - 34
IEEE Solid-State Circuits Magazine - Fall 2017 - 35
IEEE Solid-State Circuits Magazine - Fall 2017 - 36
IEEE Solid-State Circuits Magazine - Fall 2017 - 37
IEEE Solid-State Circuits Magazine - Fall 2017 - 38
IEEE Solid-State Circuits Magazine - Fall 2017 - 39
IEEE Solid-State Circuits Magazine - Fall 2017 - 40
IEEE Solid-State Circuits Magazine - Fall 2017 - 41
IEEE Solid-State Circuits Magazine - Fall 2017 - 42
IEEE Solid-State Circuits Magazine - Fall 2017 - 43
IEEE Solid-State Circuits Magazine - Fall 2017 - 44
IEEE Solid-State Circuits Magazine - Fall 2017 - 45
IEEE Solid-State Circuits Magazine - Fall 2017 - 46
IEEE Solid-State Circuits Magazine - Fall 2017 - 47
IEEE Solid-State Circuits Magazine - Fall 2017 - 48
IEEE Solid-State Circuits Magazine - Fall 2017 - 49
IEEE Solid-State Circuits Magazine - Fall 2017 - 50
IEEE Solid-State Circuits Magazine - Fall 2017 - 51
IEEE Solid-State Circuits Magazine - Fall 2017 - 52
IEEE Solid-State Circuits Magazine - Fall 2017 - 53
IEEE Solid-State Circuits Magazine - Fall 2017 - 54
IEEE Solid-State Circuits Magazine - Fall 2017 - 55
IEEE Solid-State Circuits Magazine - Fall 2017 - 56
IEEE Solid-State Circuits Magazine - Fall 2017 - 57
IEEE Solid-State Circuits Magazine - Fall 2017 - 58
IEEE Solid-State Circuits Magazine - Fall 2017 - 59
IEEE Solid-State Circuits Magazine - Fall 2017 - 60
IEEE Solid-State Circuits Magazine - Fall 2017 - 61
IEEE Solid-State Circuits Magazine - Fall 2017 - 62
IEEE Solid-State Circuits Magazine - Fall 2017 - 63
IEEE Solid-State Circuits Magazine - Fall 2017 - 64
IEEE Solid-State Circuits Magazine - Fall 2017 - 65
IEEE Solid-State Circuits Magazine - Fall 2017 - 66
IEEE Solid-State Circuits Magazine - Fall 2017 - 67
IEEE Solid-State Circuits Magazine - Fall 2017 - 68
IEEE Solid-State Circuits Magazine - Fall 2017 - 69
IEEE Solid-State Circuits Magazine - Fall 2017 - 70
IEEE Solid-State Circuits Magazine - Fall 2017 - 71
IEEE Solid-State Circuits Magazine - Fall 2017 - 72
IEEE Solid-State Circuits Magazine - Fall 2017 - 73
IEEE Solid-State Circuits Magazine - Fall 2017 - 74
IEEE Solid-State Circuits Magazine - Fall 2017 - 75
IEEE Solid-State Circuits Magazine - Fall 2017 - 76
IEEE Solid-State Circuits Magazine - Fall 2017 - 77
IEEE Solid-State Circuits Magazine - Fall 2017 - 78
IEEE Solid-State Circuits Magazine - Fall 2017 - 79
IEEE Solid-State Circuits Magazine - Fall 2017 - 80
IEEE Solid-State Circuits Magazine - Fall 2017 - 81
IEEE Solid-State Circuits Magazine - Fall 2017 - 82
IEEE Solid-State Circuits Magazine - Fall 2017 - 83
IEEE Solid-State Circuits Magazine - Fall 2017 - 84
IEEE Solid-State Circuits Magazine - Fall 2017 - 85
IEEE Solid-State Circuits Magazine - Fall 2017 - 86
IEEE Solid-State Circuits Magazine - Fall 2017 - 87
IEEE Solid-State Circuits Magazine - Fall 2017 - 88
IEEE Solid-State Circuits Magazine - Fall 2017 - 89
IEEE Solid-State Circuits Magazine - Fall 2017 - 90
IEEE Solid-State Circuits Magazine - Fall 2017 - 91
IEEE Solid-State Circuits Magazine - Fall 2017 - 92
IEEE Solid-State Circuits Magazine - Fall 2017 - 93
IEEE Solid-State Circuits Magazine - Fall 2017 - 94
IEEE Solid-State Circuits Magazine - Fall 2017 - 95
IEEE Solid-State Circuits Magazine - Fall 2017 - 96
IEEE Solid-State Circuits Magazine - Fall 2017 - 97
IEEE Solid-State Circuits Magazine - Fall 2017 - 98
IEEE Solid-State Circuits Magazine - Fall 2017 - 99
IEEE Solid-State Circuits Magazine - Fall 2017 - 100
IEEE Solid-State Circuits Magazine - Fall 2017 - 101
IEEE Solid-State Circuits Magazine - Fall 2017 - 102
IEEE Solid-State Circuits Magazine - Fall 2017 - 103
IEEE Solid-State Circuits Magazine - Fall 2017 - 104
IEEE Solid-State Circuits Magazine - Fall 2017 - 105
IEEE Solid-State Circuits Magazine - Fall 2017 - 106
IEEE Solid-State Circuits Magazine - Fall 2017 - 107
IEEE Solid-State Circuits Magazine - Fall 2017 - 108
IEEE Solid-State Circuits Magazine - Fall 2017 - 109
IEEE Solid-State Circuits Magazine - Fall 2017 - 110
IEEE Solid-State Circuits Magazine - Fall 2017 - 111
IEEE Solid-State Circuits Magazine - Fall 2017 - 112
IEEE Solid-State Circuits Magazine - Fall 2017 - 113
IEEE Solid-State Circuits Magazine - Fall 2017 - 114
IEEE Solid-State Circuits Magazine - Fall 2017 - 115
IEEE Solid-State Circuits Magazine - Fall 2017 - 116
IEEE Solid-State Circuits Magazine - Fall 2017 - 117
IEEE Solid-State Circuits Magazine - Fall 2017 - 118
IEEE Solid-State Circuits Magazine - Fall 2017 - 119
IEEE Solid-State Circuits Magazine - Fall 2017 - 120
IEEE Solid-State Circuits Magazine - Fall 2017 - 121
IEEE Solid-State Circuits Magazine - Fall 2017 - 122
IEEE Solid-State Circuits Magazine - Fall 2017 - 123
IEEE Solid-State Circuits Magazine - Fall 2017 - 124
IEEE Solid-State Circuits Magazine - Fall 2017 - 125
IEEE Solid-State Circuits Magazine - Fall 2017 - 126
IEEE Solid-State Circuits Magazine - Fall 2017 - 127
IEEE Solid-State Circuits Magazine - Fall 2017 - 128
IEEE Solid-State Circuits Magazine - Fall 2017 - 129
IEEE Solid-State Circuits Magazine - Fall 2017 - 130
IEEE Solid-State Circuits Magazine - Fall 2017 - 131
IEEE Solid-State Circuits Magazine - Fall 2017 - 132
IEEE Solid-State Circuits Magazine - Fall 2017 - 133
IEEE Solid-State Circuits Magazine - Fall 2017 - 134
IEEE Solid-State Circuits Magazine - Fall 2017 - 135
IEEE Solid-State Circuits Magazine - Fall 2017 - 136
IEEE Solid-State Circuits Magazine - Fall 2017 - 137
IEEE Solid-State Circuits Magazine - Fall 2017 - 138
IEEE Solid-State Circuits Magazine - Fall 2017 - 139
IEEE Solid-State Circuits Magazine - Fall 2017 - 140
IEEE Solid-State Circuits Magazine - Fall 2017 - 141
IEEE Solid-State Circuits Magazine - Fall 2017 - 142
IEEE Solid-State Circuits Magazine - Fall 2017 - 143
IEEE Solid-State Circuits Magazine - Fall 2017 - 144
IEEE Solid-State Circuits Magazine - Fall 2017 - 145
IEEE Solid-State Circuits Magazine - Fall 2017 - 146
IEEE Solid-State Circuits Magazine - Fall 2017 - 147
IEEE Solid-State Circuits Magazine - Fall 2017 - 148
IEEE Solid-State Circuits Magazine - Fall 2017 - Cover3
IEEE Solid-State Circuits Magazine - Fall 2017 - Cover4
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2019
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2019
https://www.nxtbook.com/nxtbooks/ieee/mssc_2019summer
https://www.nxtbook.com/nxtbooks/ieee/mssc_2019winter
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018fall
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018summer
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018spring
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018winter
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2014
https://www.nxtbookmedia.com