IEEE Solid-State Circuits Magazine - Spring 2014 - 29
systems dedicated to various metallurgies, a VLSI area with defect control. Multi-user common areas were
designed to encourage the transfer
of technologies within the diverse
user community [5]. This concept
was most successful throughout the
existence of the Microlab. Fig. 17
shows the layout of the lab, which
remained basically the same for
28 years.
The new lab area occupied 8,700
square feet, incorporating the Integrated Circuits Laboratory, the "old
lab". Operations were maintained in
the "old lab" during the construction, except for the last three months
when the two labs were joined as a
single facility. Don Rogers, a longtime employee of the Department,
was the overseer of the construction.
(He became the first manager of the
Microlab.) The new lab was created
with modular walls, which could be
reconfigured later as required by new
developments. Utilities were overhead, color-coded for easy identification and visible through the ceiling.
The deionized water system was
placed in the building's mechanical
room one floor above, with a 2000 gal.
holding tank on the roof. Two air
conditioning systems supplying the
lab were placed on the roof, also
two sink exhaust fans. Nitrogen gas
was plumbed in from a liquid nitrogen vessel located in the backyard
of Cory Hall. The new lab was a text
book example of how to fit a modern
semiconductor lab into an old building2 not designed for temperature
and humidity controlled clean room
(class 100)3 labs.
An interesting side note: to see
how the modular walls are assembled,
the contractor was asked to demonstrate the process by a side project,
constructing a small lab for an undergraduate class, in 218 Cory Hall. They
did it in two days thereby gaining
Prof. Oldham's approval. (Fig. 18.)
TABLE I. FABRICATION EQUIPMENT AT THE START OF THE NEW LAB (1983).
FABRICATION EQUIPMENT
Furnaces
12-4" Tylan computer contr.; 9-3"; 4-2"
Lithography
1-GCA 10 x; 1-Ultratech 1x; 1-Canon 4 x;
2-Contact printers; 1-mask duplicator
Pattern generation
1-GCA 3600; 1 Gyrex 1005A; 1-6 barrel S/R
Implantation
14-Extrion 20-200 (modified for versatility)
Thin films
4 4" tubes, 2 2" tubes LPCVD; 5 evaporators; 5 sputtering systems
Bonds & package
Wire bonder; dicing saw
MBE
1-Riber (Instruments SA)
Ion milling
1-VEECO Microtech
Plasma etching
1-Lam Autoetch 480
1-Plasma Therm 12" parallel plate etcher
2-Technics parallel plate etcher
1-Technics 4" barrel etcher
RO water
1-Continental water reverse osmosis system
Figure 9: Piezoelectric field-effect transistor strain transducers. J.
Conragan, Prof. Muller (1969).
2) Cory Hall was designed before WW II and
building completed in 1950.
3) Less than 100 particles (of size 0.5 microns
or larger) per cubic foot of air
Figure 10: Image contour extractor. P. Suciu, Prof. Hodges (1975).
IEEE SOLID-STATE CIRCUITS MAGAZINE
s p r i n g 2 0 14
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Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Spring 2014
IEEE Solid-State Circuits Magazine - Spring 2014 - Cover1
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