IEEE Solid-State Circuits Magazine - Spring 2014 - 46
Simulation Semiconductor Processes and
Devices (SISPAD), 1998, pp. 271-274.
[36] J. Jang, O. Tornblad, T. Arnborg, Q. Chen,
K. Banerjee, Z. Yu, and R. W. Dutton, "RF
LDMOS characterization and its compact modeling," in IEEE MTT-S Dig., 2001,
pp. 967-970.
[37] A. S. Roy, Y. S. Chauhan, J.-M. Sallese, C. C.
Enz, A. M. Ionescu, and M. Declercq, "Partitioning scheme in lateral asymmetric
MOST," in Proc. 36th European Solid-States
Device Research Conf. (ESSDERC), 2006,
pp. 307-310.
[38] Y. S. Chauhan, F. Krummenacher, R. Gillon,
B. Bakeroot, M. J. Declercq, and A. M.
Ionescu, "Compact modeling of lateral
nonuniform doping in high-voltage MOSFETs," IEEE Trans. Electron Devices, vol. 54,
no. 6, pp. 1527-1539, June 2007.
[39] J. Victory, C. C. McAndrew, and R. Thoma,
"A 3D, physically based compact model
for IC VDMOS transistors," in Proc. 21st
Int. Conf. Microelectronics (MIEL), 1997,
pp. 399-402.
[40] H. K. Dirks, "Kapazitätskoeffizienten nichtlinear dissipativer systeme," Habilitation
Thesis, RWTH Aachen, 1988.
About the Authors
Colin C. McAndrew (mcandrew@
ieee.org) received the Ph.D. and
M.A.Sc. degrees in systems design
engineering from the University of
Waterloo, Canada, in 1984 and 1982,
respectively, and the B.E. (Hons)
degree in electrical engineering from
Monash University, Melbourne, Australia, in 1978. From 1987 to 1995, he
was at AT&T Bell Laboratories, Allentown, Pennsylvania. Since 1995, he
has been with Freescale Semiconductor (formerly Motorola Semiconductor
Products Sector), in Tempe, Arizona,
where he is currently a Freescale fellow. He was an editor of IEEE Transactions on Electron Devices from 2001 to
2010. He is or has been on the technical program committees for IEEE
BCTM, ICMTS, CICC, and BMAS conferences. He is a Fellow of the IEEE.
Alexandra Lorenzo-Cassagnes
(alex.lorenzo-cassagnes@orange.fr)
received the M.Sc. degree in chemistry from the University of Barcelona,
Spain, in 1990. From 1991 to 1994,
she worked as a science teacher in
Tarragona, Spain. Since 1995, she
has been with Freescale Semiconductor (formerly Motorola Semiconductor Products Sector). From 1995 to
1998, she worked as a characterization engineer in the chemical sensors
group in Toulouse, France, and in
1998 she joined the semiconductor
46
s p r i n g 2 0 14
modeling group in Tempe, Arizona,
working on the modeling of several
types of devices including MOS transistors. In 2002, she moved back to
Toulouse where she is still working
within that group focusing on MOS
transistor and high-voltage LDMOS
transistor modeling.
Philippe
Goyhenetche
(Ph.-
Goyhenetche@freescale.com) received
the engineer degree in electronics
from the École Nationale Supérieure
d'Electronique, d'Electrotechnique, dInformatique, d'Hydraulique et des Télécommunications, Toulouse, France, in
1996. From 1997 to 2004, he worked
at ON Semiconductor in Toulouse,
France, as an analog IC designer for
industrial and portable applications.
In 2005, he joined Freescale Semiconductor, Toulouse, France, where he has
developed analog circuits dedicated to
the automotive market.
John Pigott (John.Pigott@-freescale.
com) received the B.E. degree in electrical engineering from the University
College Dublin in 1982 and the M.S.E.E.
degree from the University of Missouri
at Rolla (now Missouri Institute of Science and Technology) in 1984. Since
1984, he has worked at Freescale Semiconductor (formerly Motorola Semiconductor Products Sector), in Tempe,
Arizona, on analog circuits for automotive and consumer applications. He has
developed ultra low-voltage dc/dc converters, high- and low-current motor
driver ICs, system PMICs for consumer
applications, and automotive safety
ICs using various generations of Freescale's SMARTMOS technology. He is
a Freescale fellow and analog IC guru,
a Motorola Dan Noble fellow, and has
40 issued U.S. patents. He is a Senior
Member of the IEEE.
Wei
Yao
(yaow@xilinx.com)
received the B.S. degree in physics from Peking University, Beijing,
China, in 1997, the M.Eng. degree in
solid-state electronics from the Chinese Academy of Sciences, Shanghai,
China, in 2000, and the Ph.D. degree
in electrical engineering from Arizona State University, Tempe, in
2012. From 2000 to 2007, he was with
Freescale Semiconductor (formerly
IEEE SOLID-STATE CIRCUITS MAGAZINE
Motorola Semiconductor Products
Sector), Beijing, China. Since 2012,
he has been with Xilinx in San Jose,
California. His research interests
include semiconductor device physics, modeling, and characterization
for circuit simulation. He is a Member of the IEEE.
Gennady Gildenblat (gildenblat-@
asu.edu) received the Ph.D. degree in
solid-state physics from the Rensselaer Polytechnic Institute, Troy, New
York, in 1984. He worked on semiconductor physics and technology with
General Electric in Fairfield, Connecticut, Digital Equipment Corporation,
and the Pennsylvania State University,
University Park. Currently, he is a
Motorola professor of electrical engineering with Arizona State University,
Phoenix. He is codeveloper of the
industry standard PSP MOS transistor model, a corecipient of the 2006
Semiconductor Research Corporation
Technical Excellence Award, served on
the technical program committees of
the IEEE CICC and IEDM conferences,
and edited the book Compact Modeling: Principles, Techniques and Applications (Springer, 2010). He is a Fellow
of the IEEE.
James Victory (james.victory@
fairchildsemi.com) is currently a senior
director and distinguished member of
the technical staff for Fairchild Semiconductor, working on the research
and development of models for highpower discrete devices. In June 2008,
he cofounded Sentinel IC Technologies
Inc. to develop and deploy innovative
design enablement solutions. He was
executive director of IC Design Enablement at Jazz Semiconductor from 2003
to 2008. From 2001 to 2003, he was
director of Semiconductor Technology at XtremeSpectrum. He was with
Motorola from 1992 to 2001, where he
specialized in semiconductor device
modeling for the circuit simulation of
RF analog and power technologies. He
received his B.S.E.E., M.S.E.E., and Ph.D.
degrees in electrical engineering from
Arizona State University, Tempe, in
1990, 1992, and 1994, respectively. He
is a Senior Member of the IEEE.
http://www.asu.edu
http://M.A.Sc
http://www.M.Sc
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