IEEE Solid-State Circuits Magazine - Spring 2016 - 84

P-N Junction Diode
V (n )
V (n )

V (n + 1)
N+

V (n + 1)

P+

N+

P-Well
N-Well
P-Substrate
(b)

(a)
V (n )
V (n )
Schottky
Barrier
Diode

PIN Diode
V (n + 1)

Metal
P+

N+

N+

Equivalent Circuit
of Ideal Charge Pump

Intrinsic Poly Silicon

V (n + 1)

(d)

(c)
Saturation Mode

Body Effect Reduction

Triode Mode
Booster

Body Bias
(e)

(f)

(g)

FIGURE 1: A switching device structure.

N-Well Capacitor
(Standard CMOS Process)
T2

Gate
Capacitance

MIM/PIP Capacitor
(Mixed Signal LSI)
T2

T1

Using Parasitic
Cap Between
Interconnection Layers
T1

T2

Gate
Poly

Gate Poly

N-Well

T2

T1
(a)

(b)

(c)

FIGURE 2: A capacitor structure.

Capacitor
An N-well capacitor can be fabricated without any additional process
cost in a standard CMOS process
[Figure 2(a)] [24]. The N-well terminal can be driven by a clock with a
voltage range from 0 V to VIN. The
gate oxide is usually thick enough
to sustain a high voltage generated
by a pump. There are some parasitic

84

S P R I N G 2 0 16

capacitance components associated with the pump capacitor, such
as a junction capacitance between
N-well and P-substrate, a fringe
capacitance between the gate edge
to the P-substrate, and wring capacitance to the gate and N-well. A nominal parasitic capacitance to the gate
capacitance ratio is an order of 10%.
When a charge pump is needed in a

IEEE SOLID-STATE CIRCUITS MAGAZINE

mixed signal large-scale integration
(LSI), metal-insulator-metal or polysilicon-insulator-polysilicon capacitor
may be available [Figure 2(b)]. But the
capacitor is usually designed as a lowvoltage device. A nominal parasitic
capacitance ratio can be on the order
of 1%. When you have many interconnection layers in a certain technology
node, parasitic capacitance between
the layers can be used as a pump
capacitor or a part of the pump capacitor [Figure 2(c)] [16].

In an ideal case where there is no
parasitic capacitance and resistance and zero threshold voltage of
switching device, the input current
is given by (N + 1) times larger than
the output current. We have N current paths through N-capacitors and
one current path from the input terminal as shown in Figure 3(a). Using
notation of the dc-dc voltage converter with a conversion ratio of (N + 1),
the charge pump is expressed by an
equivalent circuit shown in Figure 3(b).
It is also matched with the fact that
the maximum attainable voltage
VMAX is given by (N + 1)VIN. As calculated in Part 1 [1], the output impedance RPMP is given by N/(fC) because
there are N switched-capacitors
between the input and output terminals and each switched capacitor has
an effective resistance of 1/(fC). CPMP
indicates an effective load capacitance associated with the internal
pump capacitance to show dynamic
behavior [17]. It is calculated to be
about one-third of the total pump
capacitors. As shown in Figure 3(b),
power efficiency of the ideal charge
pump is given by
h = VOUT /VMAX .

(3)

Power Efficiency
of Ideal Charge Pump
We can focus on the conduction part
shown in Figure 3(c) to understand
how power efficiency is determined in
steady state. It is identical to a linear



Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Spring 2016

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