IEEE Solid-State Circuits Magazine - Spring 2016 - 93

Chap ters

New York EDS-SSCS Chapter Welcomes SSCS DL Seng-Pan U (Ben)

T

The joint New York Chapter of the
IEEE Electron Devices Society (EDS)
and IEEE Solid-State Circuits Society
(SSCS) hosted SSCS Distinguished
Lecturer (DL) Prof. Seng-Pan U (Ben)
from the University of Macau. His
talk, "Energy Efficient SAR-Type ADC
Design-Trends and Techniques,"
attracted a number of students,
faculty, and industry folks. Prof. U
provided an overview of the stateof-the-art successive approximation
register (SAR)-type high energy-efficient analog-to-digital converters
(ADCs) and also touched upon the
trends of the ADCs through the energy, speed, and noise analysis for
various architectures.

Prof. Seng-Pan U (Ben) gives his talk to the New York Chapter.

Abstract
The evolving broadband wireless
communication increasingly drives
fast development on high-performance consumer portable smart
and green gadgets with longer battery life, which leads to growing
demands on high-speed ADCs with
higher energy efficiency. SAR-type
ADCs, which take advantage of CMOS
technology downscaling for their
"highly digital" implementation, have
dominated large segments of highspeed and energy efficient ADCs
with efficiencies down to fJ/conversion step at 100-MHz+ sampling
rate. This talk provides an overview
of the state-of-the-art SAR-type high
Digital Object Identifier 10.1109/MSSC.2016.2546518
Date of publication: 21 June 2016

Prof. Seng-Pan U (Ben) and some of the lecture attendees.

energy-efficient ADCs and then presents the trends of the ADCs through
the energy, speed, and noise analysis
for various architectures including
SAR and binary search, multibit SAR,

flash SAR, and pipeline SAR. Practical
design examples and the state-of-theart techniques will be also analyzed.

IEEE SOLID-STATE CIRCUITS MAGAZINE

-Abira Sengupta

s p r i n g 2 0 16

93



Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Spring 2016

IEEE Solid-State Circuits Magazine - Spring 2016 - Cover1
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