IEEE Solid-State Circuits Magazine - Summer 2016 - 92

IEEE N E WS

CEDA Currents

T

The following is reprinted from CEDA
Currents, July 2016 issue, a publication of the IEEE Council on Electronic
Design Automation (CEDA). Please send
contributions to Jose L. Ayala (jayala@
fdi.ucm.es).

IEEE Acquires GlobalSpec and the
Engineering360 Platform
IEEE, the world's largest technical professional organization dedicated to
advancing technology for humanity,
today announced the acquisition of
GlobalSpec, a leading source of news,
data, and analytics for the global
engineering and technical community
including the widely known brand
name Engineering360.
The new for-profit subsidiary of IEEE
has been renamed IEEE GlobalSpec,
Inc. and will significantly complement
IEEE's already broad offerings for engineers as well as its emerging position
in research analytics, further fueling
the organization's value to industry
through its business-oriented, content
rich marketing platforms.
IEEE GlobalSpec is a prominent
multimedia destination for the engineering community providing proprietary editorial and technical content,
classified in a relevant engineering-focused system. This dynamic destination is targeted to a decision-making
audience of industry-based engineers,
technical professionals, manufacturers, distributors, and service providers involved in technical research,
product design, and purchasing. The
business also provides webinars and
online forums for technical professionals to share and collaborate and
a full suite of content marketing tools
and products.

IEEE GlobalSpec will be headquartered in the Albany suburb of East
Greenbush, New York.
"IEEE GlobalSpec solidifies our
leadership position by broadening
our product offerings and expertly
diversifying our appeal to the global
technology community," said IEEE
President Barry L. Shoop. "We are
committed to our mission of advancing technology for humanity, and
we believe the synergistic benefits
created through this acquisition-
across content, st a nda rds, a nd
communities-will better serve the
needs of our members, professions,
and customers."
The site delivers a unique information experience, comprised of
■ news and analysis: authoritative content, including industry/market news
and perspectives, analysis, insights
and critical information, driven by
a seasoned editorial staff

Upcoming conferences
(Yao-Wen chang,
YWchang@ntU.edU.tW)
*

*

*

Digital Object Identifier 10.1109/MSSC.2016.2575758
Date of publication: 2 September 2016

92

Su m m e r 2 0 16

products and suppliers: more than
122 million parts from suppliers
across numerous industrial sectors, searchable by specification
■ a standards directory: access to metadata and abstracts for 1.6 million
standards documents
■ a reference library: a gateway to
more than 95 million engineering documents, including technical articles, reports, publications,
patents, and e-books
■ an engineering community: an
established online community in
the engineering/industrial space,
offering forums, blogs and related resources.
"IEEE GlobalSpec delivers an unparalleled depth and quality of highly
relevant content critical to the worldwide technical community. Professionals can utilize IEEE GlobalSpec to
research, compare. and price components; download reference material;
research industry standards and patent information; review product data
sheets; and interact with the global
engineering community," said IEEE Executive Director E. James Prendergast.
"IEEE GlobalSpec is destined to drive
new research efficiencies and productivity opportunities for academic
and corporate users by harnessing
powerful insights and expert analysis,
from specifications to expert marketplace analysis."
■

IEEE SOLID-STATE CIRCUITS MAGAZINE

IOLTS
Cataluña, Spain
4-6 July
MPSoC
Nara, Japan
11-15 July
NoCs
Nara, Japan
31 August - 2 September

IEEE Embedded Systems Letters
is open for submissions. Visit mc.
manuscriptcentral.com/les-ieee.
IEEE Design & Test is open for submissions. Visit mc.manuscriptcentral.
com/dandt and ieee-ceda.org /
publications/d-t/paper-submission.


http://www.manuscriptcentral.com/les-ieee http://www.ieee-ceda.org/

Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Summer 2016

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IEEE Solid-State Circuits Magazine - Summer 2016 - Cover3
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