IEEE Solid-State Circuits Magazine - Winter 2015 - 18

30
Normalized Sensitivity (dB)

Pout (mW)

10

%

0
10

13.2 13.4
13.3

1
%

30

%

10

0.1
1

2015

1%

3%

10
Pdc (mW)
2013

2012

2009

Commercial

Subcommittee Chair:
Aarno Pärssinen, University
of Oulu, Espoo, Finland
The vision for wireless sensor networks (WSNs) and the IoT continues
to force a more mature integration
strategy. The commercial landscape
is focusing these technologies toward Bluetooth low energy, while
still maintaining flexibility by having the ability to function as multimode radios. ISSCC 2015 features
some of the first published comprehensively integrated wireless-sensor
nodes, including a microcontroller
unit (MCU), power management, digital baseband modem, and wireless
transceivers. The key feature and
challenge of these wireless radios
continues to be the ability to function at the lowest power possible,
while being robust to the presence of
other wireless signals. For most WSN
nodes, transmission is a prominent
operation. Therefore, transmit-power
efficiency is a key metric that determines the evolution of these sensor
nodes in terms of power consumption. The development trend for

18

W I N T E R 2 0 15

15

2015

10
Normalized Pdc (nJ/b)
2013

2012

2009

2008

Commercial

die. PA integration, as well as elimination of the front-end SAW filter, significantly advances the trend toward
system simplification and bill of materials reduction in Figure 10.

Communication Systems-Wireline
Subcommittee Chair:
Daniel Friedman, IBM T.J. Watson
Research, Yorktown Heights,
New York, USA
Over the past decade, wireline input-output (I/O) has been instrumental in enabling the incredible
scaling of computer systems, ranging from handheld electronics to

CMOS
Nine Band
TRX
BiCMOS
iCMOS RX
+ ADC

2000

CMOS TRX
+ Digital BB

CMOS
TRX + PA

CMOS
SAW-Less TRX

2008

Figure 10: Trends in integration strategies.

IEEE SOLID-STATE CIRCUITS MAGAZINE

2010

100

Figure 9: Ultra-low-power 2.4-GHz wireless receiver sensitivity
trends. Sensitivity is normalized to bandwidth at 2.4-GHz carrier. The
lines represent constant performance. The triangle is transceiver only,
and the red dots and squares represent full SOCs.

transmit-power efficiency of wireless
sensor nodes is shown in Figure 8.
As shown in Figure 9, the receiver
sensitivity as a function of power consumption in complete systems on a
chip (SoCs) has almost reached the levels of a stand-alone wireless transceiver.
While an exponential increase in
the data rate of cellular devices is still
ongoing, another important trend is
toward ever-higher levels of SoC integration. This trend in integration strategy is characterized in Figure 10; progress has been multifold: transitioning
from BiCMOS to CMOS, to basebandmodem integration, and finally this
year, to 3G PA integration on the same

Level of Integration

Communication Systems-Wireless

13.3
13.4

1

Figure 8: Ultra-low-power 2.4-GHz wireless transmit efficiency.
The arrow shows the desired trends. All symbols except the red
squares represent ISSCC papers. The ISSCC 2015 paper numbers are
indicated next to the red circles.

mm-wave and sub-mm-wave sources
is seen in Figure 7.

13.2

20

10

100
2008

25

2009

2011

2015



Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Winter 2015

IEEE Solid-State Circuits Magazine - Winter 2015 - Cover1
IEEE Solid-State Circuits Magazine - Winter 2015 - Cover2
IEEE Solid-State Circuits Magazine - Winter 2015 - 1
IEEE Solid-State Circuits Magazine - Winter 2015 - 2
IEEE Solid-State Circuits Magazine - Winter 2015 - 3
IEEE Solid-State Circuits Magazine - Winter 2015 - 4
IEEE Solid-State Circuits Magazine - Winter 2015 - 5
IEEE Solid-State Circuits Magazine - Winter 2015 - 6
IEEE Solid-State Circuits Magazine - Winter 2015 - 7
IEEE Solid-State Circuits Magazine - Winter 2015 - 8
IEEE Solid-State Circuits Magazine - Winter 2015 - 9
IEEE Solid-State Circuits Magazine - Winter 2015 - 10
IEEE Solid-State Circuits Magazine - Winter 2015 - 11
IEEE Solid-State Circuits Magazine - Winter 2015 - 12
IEEE Solid-State Circuits Magazine - Winter 2015 - 13
IEEE Solid-State Circuits Magazine - Winter 2015 - 14
IEEE Solid-State Circuits Magazine - Winter 2015 - 15
IEEE Solid-State Circuits Magazine - Winter 2015 - 16
IEEE Solid-State Circuits Magazine - Winter 2015 - 17
IEEE Solid-State Circuits Magazine - Winter 2015 - 18
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IEEE Solid-State Circuits Magazine - Winter 2015 - 20
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IEEE Solid-State Circuits Magazine - Winter 2015 - 22
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IEEE Solid-State Circuits Magazine - Winter 2015 - 26
IEEE Solid-State Circuits Magazine - Winter 2015 - 27
IEEE Solid-State Circuits Magazine - Winter 2015 - 28
IEEE Solid-State Circuits Magazine - Winter 2015 - 29
IEEE Solid-State Circuits Magazine - Winter 2015 - 30
IEEE Solid-State Circuits Magazine - Winter 2015 - 31
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IEEE Solid-State Circuits Magazine - Winter 2015 - 37
IEEE Solid-State Circuits Magazine - Winter 2015 - 38
IEEE Solid-State Circuits Magazine - Winter 2015 - 39
IEEE Solid-State Circuits Magazine - Winter 2015 - 40
IEEE Solid-State Circuits Magazine - Winter 2015 - 41
IEEE Solid-State Circuits Magazine - Winter 2015 - 42
IEEE Solid-State Circuits Magazine - Winter 2015 - 43
IEEE Solid-State Circuits Magazine - Winter 2015 - 44
IEEE Solid-State Circuits Magazine - Winter 2015 - 45
IEEE Solid-State Circuits Magazine - Winter 2015 - 46
IEEE Solid-State Circuits Magazine - Winter 2015 - 47
IEEE Solid-State Circuits Magazine - Winter 2015 - 48
IEEE Solid-State Circuits Magazine - Winter 2015 - Cover3
IEEE Solid-State Circuits Magazine - Winter 2015 - Cover4
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2023
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2022
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2021
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_spring2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_winter2020
https://www.nxtbook.com/nxtbooks/ieee/mssc_fall2019
https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2019
https://www.nxtbook.com/nxtbooks/ieee/mssc_2019summer
https://www.nxtbook.com/nxtbooks/ieee/mssc_2019winter
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018fall
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018summer
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018spring
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018winter
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2017
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2016
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2015
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_fall2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_summer2014
https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_spring2014
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