IEEE Solid-State Circuits Magazine - Winter 2015 - 19

supercomputers. During this time,
aggregate I/O bandwidth requirements have increased at a rate of approximately two to three times every
two years. Demand for bandwidth
is driven by applications including
memory, graphics, chip-to-chip fabric, backplane, rack-to-rack, and local
area networks. In part, this increase
in bandwidth is enabled by expanding the number of I/O pins per component. As a result, I/O circuitry
consumes an increasing amount of
area and power on today's chips.
At the same time, increasing
bandwidth has also been enabled
by rapidly accelerating the per-pin
data rate. Figure 11 shows that the
per-pin data rate has approximately
doubled every four years across
a variety of diverse I/O standards
ranging from double data rate (DDR)
to graphics to high-speed Ethernet.
Figure 12 shows that the data rates
for published transceivers have kept
pace with these standards, enabled
in part by process-technology scaling. However, continuing along this
rather amazing trend for I/O scaling
will require more than just transistor scaling. Significant advances in
both energy efficiency and signal
integrity must be made to enable the

Per-Lane Transfer Rate (GT/s)

64

PCle

32

QPI/KTI

16
8

HT

4

SATA

2

SAS

1

USB

0.5

DDR

0.25
2000

2004

2008
Year

2012

2016

Figure 11: The per-pin data rate versus year for a variety of common I/O standards.

Data Rate (Gb/s)

100

2006
2007
2008
2009
2010
2011
2012
2013
2014
2015

10

1
20 30 40 50 60 70 80 90 100 110 120 130 140 150
Process Node (nm)
Figure 12: The data rate versus process node and year.

Short Links, 1 m
100-G Ethernet
100 G

802.11.ax

10-G Ethernet
10 G
USB 2.0

1G
Data Rate (Hz)

USB 3.0
PCIxpress
802.15.3c
802.11.ac/ad
UWB
LTE-A
802.11n LTE

LAN, 10 m
5G

Cellular, 100 m

100 M
802.11b
10 M
1M

802.11ag

USB 1.0

HSPA
HSDPA
WiMAX

802.11

3G R99/EDGE
100 K
GSM
10 K
1995

GPRS
2000

2005

Year

2010

2015

2020

Figure 13: Trends in data-rate frequencies for various communication channels.

IEEE SOLID-STATE CIRCUITS MAGAZINE

W I N T E R 2 0 15

19



Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Winter 2015

IEEE Solid-State Circuits Magazine - Winter 2015 - Cover1
IEEE Solid-State Circuits Magazine - Winter 2015 - Cover2
IEEE Solid-State Circuits Magazine - Winter 2015 - 1
IEEE Solid-State Circuits Magazine - Winter 2015 - 2
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IEEE Solid-State Circuits Magazine - Winter 2015 - Cover3
IEEE Solid-State Circuits Magazine - Winter 2015 - Cover4
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https://www.nxtbook.com/nxtbooks/ieee/mssc_summer2019
https://www.nxtbook.com/nxtbooks/ieee/mssc_2019summer
https://www.nxtbook.com/nxtbooks/ieee/mssc_2019winter
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018fall
https://www.nxtbook.com/nxtbooks/ieee/mssc_2018summer
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https://www.nxtbook.com/nxtbooks/ieee/solidstatecircuits_winter2015
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