IEEE Solid-State Circuits Magazine - Winter 2016 - 14
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ISSCC 2016-Silicon Systems for the Internet of Everything
T
The way we access the Internet
has changed rapidly over the past
few years, transitioning from desktops to mobile tablets and smartphones, while changing our society
and lifestyles. Now, the Internet is
expanding again-coming to all of
the everyday devices found in our
homes, businesses, and cities, heralding the age of the Internet of
Everything (IoE).
The IoE is predicted to transform
the future with networks of intelligent devices driving the development of fundamental new products
and services. This transformation
has, at its heart, the silicon sensors,
chips, systems, and communication networks that combine to turn
everyday objects into intelligent
and interacting devices.
The 2016 International SolidState Circuits Conference (ISSCC
2016) will showcase the numerous
ways in which silicon chips and systems underpin the growth of the IoE,
ranging from ultra-low power systems, energy scavenging, and wireless powering to high-performance
circuits and systems, sensors and
three-dimensional ICs, and 5G wireless communications. ISSCC 2016
will be held in the San Francisco
Marriott Marquis from 31 January to
4 February 2016.
The plenary session on Monday,
1 February, will feature four distinguished invited speakers.
■ William Holt, executive vice president, Intel, United States, will give
his insights on "Moore's Law: A Path
■
■
■
Digital Object Identifier 10.1109/MSSC.2015.2495932
Date of publication: 21 January 2016
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w i n t e r 2 0 16
Forward," highlighting future opportunities for the industry and
leading technology options on the
horizon beyond CMOS.
Sophie V. Vanderbroek, chief technology officer, Xerox, United States,
will present "Three Pillars Enabling
the Internet of Everything: Smart
Everyday Objects, Information-Centric Networks, and Automated RealTime Insights" and will highlight a
number of unique challenges and
opportunities for general purpose
and custom chip designs in this
emerging application space.
Seizo Onoe, executive vice president, NTT DoCoMo, Japan, will
explore the challenges and opportunities in "5G Mobile Technology
Evolution Towards 2020 and Beyond," outlining how the combination of various technologies is
expected to provide cost-effective
solutions with a performance level
considered impossible today.
Lars Reger, chief technology officer automotive, NXP Semiconductors, Germany, will present "The
IEEE SOLID-STATE CIRCUITS MAGAZINE
Road Ahead for Securely Connected Cars," discussing how the
next generation of secure, connected, autonomous cars can be
made a reality through the development of powerful, reliable
wireless technologies combined
with the highest level of privacy
and system security.
ISSCC will feature educational
events such as tutorials, for those
who wish to learn basics of circuit
topics, and forums, for experts who
want to be in touch with the latest
trends. This year, the conference
will feature ten half-day tutorials on
Sunday, 31 January (see Table 1 for
details). Of the six forums, two will
be on Sunday, 31 January, and four
will be on Thursday, 4 February (see
Table 2 for details).
Following the theme of this
year's conference, an in-depth short
course, "Circuits for the Internet of
Everything (IoE)," will be held on
Thursday, 4 February. This course
will cover key circuit building blocks
for IoE systems-on-a-chip (SoCs),
presented by renowned industrialists and academic researchers (see
Table 3 for details).
The core of the conference will include over 27 technical sessions covering the latest developments in the
design of circuits and systems involving silicon or other nanotechnologies
in the areas of analog; data converters; digital circuits; digital architectures and systems; imagers, sensors,
MEMS, medical devices, and displays;
memory; RF; technology directions;
wireless; and wireline. These sessions will be held from Monday, 1
February, to Wednesday, 3 February.
1943-0582/16©2016ieee
Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Winter 2016
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