IEEE Solid-State Circuits Magazine - Winter 2016 - 62
Tile
Knights Landing Overview
EDC
PCIe
Gen 3
EDC
36 Tiles
Connected by
2-D Mesh
Interconnect
EDC
DDR MC
Misc
EDC
MCDRAM
MCDRAM
Package
EDC
CHA
1 MB
L2
2 VPU
Core
Chip: 36 Tiles Interconnected by 2-D Mesh
Tile: 2 Cores + 2 VPU/Core + 1 MB L2
EDC
Tile
DDR MC
Core
×4
MCD RAM
DMI
MCDRAM
Memory: MCDRAM: 16 GB On-Package; High BW
DDR4: 6 Channels at 2,400 up to 384 GB
3 DDR4 Channels
3 DDR4 Channels
EDC
2 × 16
1×4
DMI
MCDRAM
MCDRAM
2 VPU
IO: 36 Lanes PCIe Gen3. 4 Lanes of DMI for Chipset
Node: 1-Socket Only
Fabric: Omni-Path On-Package (Not Shown)
Vector Peak Perf: 3 + TF DP and 6 + TF SP Flops
Scalar Perf: ~3× Over Knights Corner
Streams Triad (GB/s): MCDRAM: 400+; DDR: 90+
EDC
MCDRAM
MCDRAM
Omni-Path Not Shown
KNL showing the mesh-connected 36 tiles and the MCDRAMs integrated on the package.
Servers
Scalable Unified Storage Solution
* Entry Solutions Are TDP Constrained
- Xeon D TDP Range (20-45 w) Critical
Switches
PCIe
SAS
SAS IOC
Canister
B
PCIe
Intel
Xeon D
SAS SAS IOC
SAS
SAS
SAS EXP
SAS EXP
- PCIe NTB, DMA Engine Enable Higher
Availability
- ADR Feature for RAID Cache Data
Protection
NVM
SAS
4x 4x
4x 4x
NVM
PCIe NTB
DDR4 DDR4
Intel
Xeon D
Host
IOCs
DDR4 DDR4
Storage
Platform
Host
IOCs
PCIe
PCIe NTB
Canister
A
* Integrated Storage Extensions
Fundamental to the Solution
- PCIe Dualcast Reduces Memory BW
Demand
- Integrated Ethernet Used as the Host
Interface or for Clustering
* ISA for Data Protection, Storage
Efficiency, and Management
- RAID-5/6, CRC, Encryption, Hashing,
and Compression
SSD: High-Performance Storage
SAS: Enterprise Performance Storage
SATA: Enterprose Bulk Storage
Xeon-D: enterprise storage example with dual canister flow.
it features an integrated 10-GbE Ethernet with two ports. DDR4 interfaces
provide 2400 MT/s. Other features include support for virtualization, cache
allocation, cache monitoring, and memory bandwidth monitoring.
62
W I N T E R 2 0 16
Oracle's Sonoma Processor:
Advanced Low-Cost SPARC
Processor for Enterprise Workloads
Sonoma, Oracle's low-cost form
factor SPARC processor, is optimized for scale-out and features an
IEEE SOLID-STATE CIRCUITS MAGAZINE
integrated infiniband-host channel
adapter with virtualization, four
direct attached DDR4-2400 channels
supporting up to 1 TB of memory,
and advanced software-in-silicon
hardware features optimized for
Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Winter 2016
IEEE Solid-State Circuits Magazine - Winter 2016 - Cover1
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IEEE Solid-State Circuits Magazine - Winter 2016 - 1
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IEEE Solid-State Circuits Magazine - Winter 2016 - Cover3
IEEE Solid-State Circuits Magazine - Winter 2016 - Cover4
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