IEEE Solid-State Circuits Magazine - Winter 2017 - 18

Graphics

OpenGL
(ES1.1)

2D, 3D

Display

16 b QVGA

Camera

1-2 M

MP3

Accelerator

DSP

Downlink
(Mb/s)

3M

5~8 M

10 M

H.264/AVC
(VGA)

UMTs
0.4-2

2004

2005

2006

300
800
2007

2008

2009

2010

Multi-Core (4-8)
LTE
100

800
2,400

2,400
6,000

2011

2012

2013

H.264/VP9
HDR

H.264/VP9

Dolby
TrueHD/Digiatl+

HSPA+
7-42

WQXGA/WQXGA+
at 60 fpsx2 (VR)

12 MxDual 360° VR

24 M

WMA
Dolby 5.4

HSPA
1.8-7

300
500

-300

20 M

SIMD
Multi-Core (2-4)

VR (Virtual Reality
Vulkan)

WQXGA/WQXGA+
at 60 fps

H.264/AVC
H.264/MVC
(Full HD)
H.264/SVC

AAC Plus

FPU

AR
(Augmented Reality)

SXGA
at 60 fps

16 M

H.264/AVC
(D1)

AAC

EGPRS
0.4

CPU (MIPS)

WVGA
at 60 fps

VGA

Image/Video JPEG, MPEG-4
Audio

OpenGL/VG/MAX
(ES2.0)

DSD
Dolby Atmos
Heterogeneous
Multi-Processing

LTE-A
150-750
6K
12 K
2014

LTE-A
1,600
12 K
100 K

2015

2016

13 K
112 K
2017

Figure 10: Application processor trends in smartphones. VGA: video graphics array; QVGA: quarter VGA; WVGA: wide VGA; SXGA: superextend GA; HD: high definition; HDR: high dynamic range; AAC: advanced audio coding; WMA: Windows Media Audio; DSD: Direct-Stream
Digital; DSP: digital signal processing; FPU: floating-point unit; SIMD: single instruction/multiple data; EGPRS: enhanced General Packet Radio
Services; UMTS: Universal Mobile Telecommunications System; HSPA: high-speed packet access.

now being achieved primarily through
architectural innovations.
One continued trend is toward
increasing heterogeneity with application-specific central processing units
(CPUs), general-purpose graphics processing units (GPGPUs), and custom
accelerators. Thus, computation is moving from general-purpose CPUs to more

power-efficient cores in an effort to meet
performance demands within limited
power budgets. Core numbers and frequencies are not growing significantly,
but application-specific cores and accelerators represent a growing portion of
die area. Heterogeneous computing that
enables efficient collaboration between
cores is gaining in importance.

Short Links, 1 m
100G Ethernet

100 G

400G Ethernet

10G Ethernet

Data Rate (Hz)

10 G

802.15.3c
UWB
802.11n

USB 2.0

100 M
10 M
1M

802.11b

802.11ag

USB 1.0
802.11

802.11.ac/ad
LTE-A
LTE

5G

Cellular, 100 m

HSPA

HSDPA
WiMAX
3G R99/EDGE

100 K
10 K

USB 3.0

PCIxpress

1G

LAN, 10 m

802.11.ax

GSM
1995

GPRS
2000

2005

2010

2015

2020

Year
Figure 11: Application processor trends in smartphones. GSM: Global System for Mobile
Communications USB: Universal Serial Bus; HSDPA: High Speed Downlink Packet Access.

18

w i n t e r 2 0 17

IEEE SOLID-STATE CIRCUITS MAGAZINE

Figure 10 shows some application processor feature trends for smartphones. These CPUs are now running
up to 2.8 GHz, approaching laptop
and desktop CPU performance levels. Single-thread performance is
improved by microarchitectural improvements and multithread performance by adding more cores and
more efficiently managing differently
optimized cores. Virtual reality (VR) is
one of the key drivers of the demand
for the evolution of GPUs, displays,
and cameras. Small CPU subsystems
are being added for I/O and sensorhub control to ensure low-power, always-on functionality.
Wired and wireless links continue
to increase in bandwidth. As illustrated in Figure 11, a consistent tentimes increase in data rate is seen
every five years. The IoE revolution
is bringing an explosion of demand
for network bandwidth: everything
will be connected through wired
and wireless networks, generating a
tremendous amount data to be processed/analyzed in the cloud. Correspondingly, IEEE 802.3 400 Gb/s
is being developed, and the LTE
advanced (LTE-A) standard is extending to 1.6-Gb/s bandwidth; 5G is
targeting 10-100 Gb/s, comparable



Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Winter 2017

IEEE Solid-State Circuits Magazine - Winter 2017 - Cover1
IEEE Solid-State Circuits Magazine - Winter 2017 - Cover2
IEEE Solid-State Circuits Magazine - Winter 2017 - 1
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IEEE Solid-State Circuits Magazine - Winter 2017 - Cover3
IEEE Solid-State Circuits Magazine - Winter 2017 - Cover4
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