IEEE Solid-State Circuits Magazine - Winter 2017 - 47

Prof. Wu Jiangfeng from Tongji University,
China, shares the ADC design "Direct
Sampling Receivers and Multi-GS/s HighResolution ADCs."

neurobiology, implanted technology, and brain-machine interface.
To encourage the innovation and
entrepreneurship among young IC
designers, Dr. Carter Tseng, who is
the founder and chief executive officer of the Little Dragon Foundation
and director of the U.S.-based Committee of 100 was invited to give the
talk "Innovative Entrepreneurship
and Youth Development" on 20 May
2016. In his talk, Dr. Tseng analyzed
the definition and procedure of innovation and the important elements
of the evolution and incubation of
entrepreneurships. He also introduced Carnegie Training from the
United States to encourage young
students to develop their own competitive advantage and to develop
the habits to be successful, grasp the
opportunity, initiate, and achieve the
dream of changing the world.
To conclude such a series of events
in 2016, three more activities were
planned for November and December.
A four-day workshop on advanced
analog IC design was presented by
SSCS DL Prof. Willy Sansen from KU
Leuven, Belgium, during 22-25 November 2016. The workshop was based on
updated materials from Analog Design
Essentials (Springer, 2006), which
was aimed at IC designers of analog

(From left) SSCS Macau Chapter Chair Prof. Seng-Pan (Ben U) with Peter Kinget, who
delivered a lecture on RF circuit and system innovations.

Prof. Bran Ma from UT, Dallas, discusses high-frequency integrated voltage regulators.

Prof. David Z. Pan from UT, Austin, presenting the challenges, opportunities, and outlook of
nanometer IC design and manufacturing.

IEEE SOLID-STATE CIRCUITS MAGAZINE

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Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Winter 2017

IEEE Solid-State Circuits Magazine - Winter 2017 - Cover1
IEEE Solid-State Circuits Magazine - Winter 2017 - Cover2
IEEE Solid-State Circuits Magazine - Winter 2017 - 1
IEEE Solid-State Circuits Magazine - Winter 2017 - 2
IEEE Solid-State Circuits Magazine - Winter 2017 - 3
IEEE Solid-State Circuits Magazine - Winter 2017 - 4
IEEE Solid-State Circuits Magazine - Winter 2017 - 5
IEEE Solid-State Circuits Magazine - Winter 2017 - 6
IEEE Solid-State Circuits Magazine - Winter 2017 - 7
IEEE Solid-State Circuits Magazine - Winter 2017 - 8
IEEE Solid-State Circuits Magazine - Winter 2017 - 9
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IEEE Solid-State Circuits Magazine - Winter 2017 - 12
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IEEE Solid-State Circuits Magazine - Winter 2017 - 39
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IEEE Solid-State Circuits Magazine - Winter 2017 - 44
IEEE Solid-State Circuits Magazine - Winter 2017 - 45
IEEE Solid-State Circuits Magazine - Winter 2017 - 46
IEEE Solid-State Circuits Magazine - Winter 2017 - 47
IEEE Solid-State Circuits Magazine - Winter 2017 - 48
IEEE Solid-State Circuits Magazine - Winter 2017 - 49
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IEEE Solid-State Circuits Magazine - Winter 2017 - 68
IEEE Solid-State Circuits Magazine - Winter 2017 - Cover3
IEEE Solid-State Circuits Magazine - Winter 2017 - Cover4
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