IEEE Solid-State Circuits Magazine - Winter 2017 - 56

(from left): willy Sansen, Andreia Cathelin, Jan Van der Spiegel, and Kenneth o at the
signing ceremony at ESSCIRC in Lausanne, Switzerland.

are governed by a common Steering Committee and share plenary
keynote presentations a nd joint
sessions, bringing both communities together. The increasing level
of integration for system-on-chip
design made available by advances in
silicon technology is now, more than
ever, calling for a deeper interaction
among technologists, device experts,
integrated circuit designers, and system designers.

At ESSCIRC, which was held 12-15
September 2016 in Lausanne, Switzerland, a historic memorandum of
understanding was signed by the
ESSCIRC Steering Committee and
the IEEE Solid-State Circuits Society
(SSCS), which has been involved with
the conference for more than 15 years.
This partnership represents a historical union of the Society in alignment
with the leading circuit design conference event in Europe.

"Our Society is honored to have
the opportunity to be in a supportive
alliance with the ESSCIRC community.
It is our fervent desire to bring value
and support," said SSCS President Jan
Van der Spiegel about the signing.
"The importance of this alliance
can't be overstated. It is our privilege
to help the ESSCIRC organizing committee and this prestigious conference
to achieve even greater levels of success while bringing top circuit designers and academics to this educational
and industry exchange. We look forward to being part of the ESSCIRC
family," said SSCS Executive Director
Michael Kelly of the partnership.
This collaboration is the culmination of several years of work of many
dedicated leaders from both the
ESSCIRC and the SSCS. Although the
Society has been supportive with marketing and administrative efforts, this
takes Society support to a whole new
level. The Society is excited to help foster, grow, and build stronger relationships between the European circuits
and design community and the IEEE.
-Abira Sengupta

IEEE Journal of Solid-State Circuits App Early Access Update

The IEEE Solid-State Circuits Society
BrowZine App has just had an update to support the early access
content from IEEE Journal of SolidState Circuits (JSSC) via its "Articles
in Press" feature. "Articles in Press"
contains the latest peer-reviewed
content from JSSC, giving researchers access to the latest content
before it has been fully edited and
placed in an issue. With this latest
version of the app, users will now
have easy access to this content for
JSSC by simply going to "Available
Issues" and using the "Articles in
Press" area above the current issue.
Articles are sorted with the newDigital Object Identifier 10.1109/MSSC.2016.2622940
Date of publication: 23 January 2017

W i n t e r 2 0 17

est content available at the top of
the screen. If you have JSSC on "My
Bookshelf" and are therefore receiving alerts when new articles are published, you will, in the same way, get
alerts when new "Articles in Press"
are available, helping you keep up to
date better than ever before with the
latest research from JSSC.
To get started, please download
the BrowZine App from the iOS or
Android store and select "IEEE SolidState Circuits Society SSCS" as your
library and then put in your IEEE
membership credentials.
-Abira Sengupta
A preview of the JSSC bookshelf
on the BrowZine App.

IEEE SOLID-STATE CIRCUITS MAGAZINE

Table of Contents for the Digital Edition of IEEE Solid-State Circuits Magazine - Winter 2017