TRYEngineering 2024 - 9

STEP 6
Deposition
Deposition involves adding a blanket of
conducting metal or non-conducting material
(like oxide) depending on the desired properties of
the final product. See the machine used
to complete this step.
MAKE: Cut another circle (much larger than the
wafer from your sandwich bag) and cover your
wafer including all the areas etched away as
the coating semiconducting materials. Apply
pressure with the tip of an LED to the etched holes
or areas on the blanket. This pulls at the sandwich
bag. Work your way pressing LEDs into the
blanket and smoothing (one at a time).
STEP 7
Vias
Vias are little wires that let us go from
one layer to another - like an elevator
for the circuit, we go from one layer to
another 'via' the via!
MAKE: Arrange your vias like tiny pieces
of Play-Doh to link your layers together.
The top of each via is a 'contact' - where
we will make contact with the
next device.

TRYEngineering 2024

Table of Contents for the Digital Edition of TRYEngineering 2024