Electronics & Connectivity - March 1, 2012 - 17

e
cialists in hardware, embedded applications, network services, device management, Web applications, and user interfaces exist who are willing to work with an OEM and its partners to create a total solution.

The Phoenix International modular gateway offers mobile communications and processing integrating GPS and GPRS data and onboard machine communications via CAN, RS232, or ethernet. The module is sealed to perform in demanding environmental conditions and is suited for machine health monitoring, remote diagnostics and repair, advanced logistics, and machine control.

Hardware reliability
Hardware reliability is a key issue when implementing telematics in heavy, mobile equipment. Broad temperature ranges and high vibration levels are examples of conditions that are much more extreme in mobile equipment environments than in consumer or fixed telematics environments. Care should be taken to select a hardware provider whose product meets the environmental requirements for the OEM’s equipment. For machine integrations, telematics hardware should meet or exceed the reliability required of the vehicle components, especially with more advanced telematics applications such as remote diagnostics.
SAE electronics+connectivity

Many off-the-shelf telematics devices have very limited operating temperature ranges, unsealed enclosures, internal cables, snap antenna connections, unsecured PCBs, etc. While numerous and inexpensive, these devices will not likely provide the reliability needed in harsh environments. Hardware providers do exist that produce devices for rugged environments. These devices have characteristics such as -40 to +85°C (-40 to +185°F) operating ranges, IP67 enclosures, transient protection to industry standards, high g-force shock and vibration resistance, and life testing at high humidity levels. For devices that do not meet requirements such as these, the issue may be the limitations of components used or the construction of the device. It is important to note that wireless radio specifications can often be the challenge in meeting durability requirements. The delay between chipset release of a wireless radio technology and the offering of automotive-grade modules can often be two to three years. Chipsets are typically not feasible for direct implementation in devices with annual volumes less than several hundred thousand. Modules incorporating those chipsets are required by lower volume device manufacturers and they are typically available from the module manufacturers in conMarch 1, 2012

Electronics & Connectivity - March 1, 2012

Table of Contents for the Digital Edition of Electronics & Connectivity - March 1, 2012