Electronics Protection - June/July 2012 - (Page 25)

EMI/EMC/ESD New Engineered MultiCavity Shielding Solution As engineers push the limits of circuit board design, they struggle to integrate more components within a reduced footprint. Many times this leads to extremely complex board layouts with advanced components such as GPS and cellular chip sets in close proximity. To reduce unwanted RFI/EMI emissions and elevate cross-talk between components, Leader Tech has introduced their MultiCavity Slot-Lok Pro Shield. This proprietary board-level shielding product uses standardized manufacturing methods to create near custom multi-cavity solutions with minimal nonrecurring engineering charges (NRE) and virtually limitless customization options. Leader Tech’s Multi-Cavity Slot-Lok Pro series is constructed from a solid, RoHS compliant frame and a removable high-retention cover. This allows engineers to effectively combine multiple shields under the same footprint saving space, weight, assembly cost and time-to-market. The two-piece frame and removable cover construction also facilitates easy rework and inspection processes. In addition to offering up to 60 dB of shielding effectiveness (SE), the shields are quickly installed using through-hole or surface mount soldering. TE Circuit Protection Introduces Low-Cap Silicon ESD Devices TE Circuit Protection has release a family of eight new single-channel and multi-channel silicon ESD (SESD) protection devices offering the lowest capacitance (bi-directional: 0.10pF typical; uni-directional: 0.20pF typical), highest ESD protection (20 kV air and contact discharge) and smallest size (multichannel: smallest flow-through form-factor and 0.31 mm height) packages in its line. The devices’ ultra-low-capacitance results in low insertion loss, which is essential for maintaining signal integrity in ultra-highspeed applications. The devices help protect against damage caused by ESD, surge and cable discharge events. The devices also feature a flow-through design package that allows for matched impedance of PCB trace routing, which is essential for maintaining high-speed signal integrity. The ultra-low-capacitance, small size and high ESD kV rating of the SESD devices are well-suited for consumer, auto and other products using high speed interfaces such as USB 3.0/2.0, HDMI, eSATA, DisplayPort and Thunderbolt. The single- and multi-channel SESD devices also feature a 20 kV contact and air discharge rating, exceeding IEC61000-4-2’s 8 kV industry standard. In the event of a high voltage ESD strike, this high kV rating helps minimize the risk of the ESD device failing short and permanently disabling the port, or open, exposing the downstream chipset to damage caused by another ESD strike. The single-channel devices are available in 0201-sized XDFN small footprint (0.6 mm by 0.3 mm by 0.31 mm) and 0402-sized XDFN (1.0 mm by 0.6 mm by 0.38 mm) packages. The multichannel SESD arrays (two, four and six-channel options) feature a package height as low as 0.31 mm, resulting in up to a 50 percent lower profile than comparable devices. The SESD devices’ lower profile allows for placement closer to the edge of the PCB, or inbetween boards and connectors, facilitating design flexibility. Polyonics Adds New Double-Coated Polyimide Options to its Family of Engineered Tapes Polyonics has released new doublecoated tapes suited for bonding materials that will be exposed to extremely high temperatures and harsh manufacturing environments. They include liners that are designed to be die cut and, due to their additional stiffness compared to transfer adhesives, can be easily auto-applied. In addition, they provide electrical properties, including dielectric strength, which provide added electrical insulation and isolation. The double-coated polyimide tapes are offered in 1 and 2 mil thicknesses with the 2 mil version being better suited to rougher surfaces. The increased thickness also adds additional stiffness to help in die cutting the tape. Constructions are available with either high temperature acrylic or ultra-high temperature silicone adhesives that offer exceptional bond strength and provide a thin, conformal bond line. These new double-coated, linered tapes are offered in high temperature, ESD and flame retardant constructions. The ESD versions (XT-652 and XT-653) are well suited for bonding static sensitive devices (SSD) to a wide variety of substrates. The tapes provide both low peel voltage (<100 v) when the liners are removed and again when the bonded part is removed specifically helping to eliminate electrostatic charges. The double-coated, flame retardant tape (XT-657) provide high temperature resistance as well as help prevent the propagation of fire. The tape is halogen free and tested for compliance with the UL94 VTM0 and FAR 25.853 flammability and BSS 7238/7239 smoke and toxicity standards. Additionally, combination ESD and flame retardant double-coated tapes are also available as a wide array of custom constructions. Lista International Releases ESD Workstations Lista International Corp. has released its ESD workstation systems that are certified to meet specific electrical property requirements assuring static dissipation at a safe rate. Lista pedestals and workbench components can be protected by static dissipative powder-coat finishes that are available in three standard colors. The workbenches also feature work surfaces and shelves with static dissipative plastic laminate. Work surfaces and shelves have ground bolts with a 12 ft. grounding cord assuring contact for proper grounding. Lista workstation systems can be configured in a variety of heights and lengths, with cabinet pedestals and/or legs. By offering flexibility of components, Lista enables users to create a workbench suited to their specific needs without custom cost. To further customize the workstations, Lista offers a variety of accessories, from electrical outlets to riser shelves to parts racks. Lista ESD drawer storage cabinets can serve as pedestals for the workstations. In addition, a selection of dividing and partitioning accessories and conductive plastic boxes for cabinet drawers allow users to create customized storage compartments. This feature provides flexibility to accommodate changing storage requirements. 25 June/July 2012 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - June/July 2012

Electronics Protection - June/July 2012
FLIR T-series Cameras Introduce Thermal Image Enhancement Technology
Renewable Raw Materials - The Future of Plastic Enclosures
Global Electronic Enclosure Resins and Markets
Ferrite Testing Reveals Significant Performance Variations
Packaging Solutions for Critical Electronics Protection in Challenging Environments
Fluid Submersion Technology for Green Data Center Cooling
TRTL BOT Unveils KidSafe Case for iPhone 4 and 4S
Curtiss-Wright Controls Defense Solution Releases New D2D ATR 3U OpenVPX Chassis
Stulz Introduces CyberRow Data Center Cooling Solution
Abbott Technologies Offers New Sealed Power Supply
New Engineered Multi-Cavity Shielding Solution
Gore Enhances Product Performance with new of Screw-in Vents
Industry News
Calendar of Events

Electronics Protection - June/July 2012