Electronics Protection - September/October 2013 - (Page 20)

Thermal LCP DX Cooling, the System Solution for Smaller Data Centers Even if a data center consists of just one room with one server enclosure, the highpower dissipation of computer hardware can quickly lead to a dangerous build-up of heat. In fact, studies show that smaller data centers tend to be installed in locations that are even more confined than their larger counter parts, further increasing the risk of temperature-related failure. If the so-called “comfort temperature” of the server is not met, shortened service lives or total failure are real threats. In major data centers, climate control is routine, but in small companies with more limited resources, the servers, switches and storage systems may be less than completely protected. If the devices are housed in a 19 inch enclosure, air is usually only circulated by a fan in the ceiling plate or a 19 inch rack-mounted fan. If the devices are standing around openly in the room, there may be no climate control or only a less than inefficient room air conditioning system. The Rittal Liquid Cooling Package Direct (LCP DX) is designed to address this situation. This flexible climate control option for use in small and medium enterprises can dissipate heat losses of up to 12 kW through an integrated cooling unit, and two versions are suitable for rack-based and row-based climate control. The LCP DX fits into environments where small or mediumsized IT installations need to be cooled and where climate control with air/water heat exchangers or cold water would be too costly. The DX system includes an integrated, speed-controlled compressor, an electronic expansion valve and related refrigeration components that include an appropriate external condenser mounted outside the data center. No active control components are required to operate the external condenser, fan speed is determined only by the pressure of the refrigerant. The LCP DX is available in two versions. The laterally mounted LCP Rack DX, moves cold air either to the right or to the left in a 19 inche rack. With series cooling, the LCP Inline DX is mounted between individual racks and blows the cool air from the front into the cold aisle. Each version is quick and easy to install because of its compact and largely pre-assembled design. New Option for Thermoelectrically Cooled Electronic Enclosures Makes Wash Downs Easy EIC Solutions, Inc. has introduced the new M74 clean out modification option that facilitates wash down of thermoelectric coolers mounted to electronic enclosures. The M74 option was application-driven arising from suggestions received from customers in food processing, and other process industries requiring frequent rinsing or washing of equipment. By making washdown faster and easier, the clean out modification helps minimize downtime and helps promote consistent production rates. Electrical wires and electronic gear used in wash down processes are enclosed to protect them from liquids and cleaning agents. The enclosures are then subject to wash down regulations. During both manufacturing and wash down 20 procedures, liquid and debris may find their way into the openings in the thermoelectric air conditioner covers. The openings are machined into the cooler panels to create space for fans and to permit adequate air circulation. A thorough wash down may or may completely not flush out the openings. Removing the air conditioner covers used to require the use of screwdrivers, wrenches or other tools. Additionally, hardwired electrical connections to fans had to be cut which took time and made for tedious reinstallation of the covers. EIC’s clean out modification option eliminates the need for tools when removing the covers for cleaning. This simplifies and expedites wash down procedures and also speeds up the process of reinstalling the covers which means less production downtime. The internal portion of the air conditioner’s “hot-side” may then be power washed assuring the removal of clinging debris. A more thorough cleaning is achieved through removal of the fans, which are rated for moisture resistance and are not adversely affected by wash downs. Fujipoly Thermal Gel Sheets are a Cooling Influence on LED Lighting Over the last several years hundreds of major electronics manufacturers have expanded their use of LED lighting to enhance both product appearance and functionality. Recent design trends have integrated LED lighting packages in thousands of consumer and industrial electronic platforms. One of the most challenging issues with the use of LEDs is the control of unwanted heat. The most common way to dissipate this performance-hindering byproduct is to connect the LED package directly to a heat sink. To maximize the cooling performance of the heatsink, Fujipoly offers its line soft Sarcon GR-ae thermal interface materials. The gel-like sheet compound is designed to efficiently transfer heat from its source to the nearby heat sink. The physical properties of this material allow it to protect delicate board-level components as they fill unwanted air gaps and levels uneven surfaces. This silicone based compound is available in nine thicknesses that deliver a thermal conductivity of 1.3 W/m°K with a thermal resistance as low as 0.50 °C cm2/W. Sarcon GR-ae is available in pre-cut sheets up to 200 mm by 300 mm or die-cut to your exact application specifications. In addition to growing LED lighting applications, the same thermal interface material has proven successful in helping cool power control units, converters, inverters and batteries. 20-1650 Silicone Potting and Encapsulating Compound Can Withstand the Heat 20-1650, by Epoxies, Etc., is a two component silicone elastomer designed specifically for applications where a large amount of heat is emitted such as high voltage assemblies. Even for a silicone, which can operate under fairly high temperatures, 20-1650 outperforms. It operates in environments from -65°C to 300°C (or up to 572° F). The 20-1650 has been specially formulated for increased thermal stability. It is soft and flexible, and moves with components, September/October 2013 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - September/October 2013

Geist Unveils Rapid Deployment Data Center Environmental Monitoring System
Enabling Effective Thermal Management with DCIM
Predicting Gasket Performance: SE Measurements with a TEM Cell to Study Gasket Reliability
Rack Containment 101
The Nine Core Elements of DCIM
Using Electronic Locking Solutions to Secure Enclosures and Meet Storage Compliance Needs
Hammond’s HJ Series Ticks All the Boxes
Rogers Introduces Poron SlimGrip Foam
Ferrite Suppressors Clear Interference
Fujipoly Thermal Sheets are a Cooling Influence on LED Lighting
GE Introduces TLE Series UPS Platform
Gore PolyVent XL Improves Reliability of Large Outdoor Enclosures
IMI Sensors Launches Linear Adjust Mechanical Vibration Switch
Industry News
Calendar of Events
Five Ways to Realize Server Room Profitability

Electronics Protection - September/October 2013