Electronics Protection - September/October 2013 - (Page 30)

Industry News Calendar of Events Motion Control 2013, Oct. 15-17, 2013, Los Angeles, Calif. www.MotionControlExpo.com EOS/ESD Symposium 2013, September 8-13, 2013, Las Vegas, Nev. www.esda.org IEEE ECEE 2013 September 15-19, 2013, Denver, CO. www.ecce2013.org IMAPS 2013, September 29- Oct. 3rd, 2013 Orlando, Fla. www.imaps.org FABTECH 2013, November 18-21, 2013, Chicago, IL www.fabtechexpo.com Remote Monitoring and Control 2013, Dec. 12-13, 2013 Las Vegas, Nev. www.RemoteExpo.com Design East, September 30-Oct. 3rd, 2013Boston, MA. http://east.ubmdesign.com Antenna Systems 2013, Dec. 12-13, 2013, Las Vegas, Nev. www.antennasonline.com/conferences OSP Expo, October 8-10, 2013 Dallas, Texas www.ospmag.com Technology Convergence Conference, February 18, 2014 Santa Clara, Calif., www.teladatatcc.com Thermal Solutions and Flexible Circuit Manufacturer Strengthens Representative Network in the US Vulcan Electric Company has expanded its presence in the US by establishing a representative relationship with Stress Analysis Services (SAS). “SAS has earned its reputation for working closely with both OEM and end-user accounts in a wide number of markets,” said Fred Conroy, vice president of Sales, Vulcan Electric. “Their philosophy is to work side-by-side with their customers in order to help them solve often complex design, test, and measurement issues. By working so intimately with their customers, SAS will be able to provide them with the ideal thermal or flex circuit solution to meet the application requirements.” With manufacturers’ ever-increasing demand for higher quality at a reduced total cost and with a faster time to market, Vulcan’s expanded representative network will leverage Vulcan’s focus on design and operational excellence over a much larger region of the country that includes a number of key market areas. Survey of North American Data Center Users Shows Growing Concern Over Heat Density and Infrastructure Monitoring Remains Important Heat density is once again becoming a top-of-mind issue for data center managers, according to a spring survey of data center users from Emerson Network Power. The spring installment of the biannual survey, sponsored by Emerson Network Power, polled members of the Data Center Users’ Group (DCUG), an association of influential data center, IT and facility managers, and captured input from more than 100 respondents across North America. The survey results show that, for the first time in two years, heat density is again one of the three biggest concerns for data center professionals. When asked to identify their top three facility/network concerns, 42 percent of respondents cited heat density, ranking it third, behind energy efficiency (49 percent) and adequate monitoring (51 percent). Heat density was cited as the number one concern for the first four years of the survey, starting in 2005. In the spring 2012 survey, it dropped to fourth place, and adequate monitoring, availability and energy efficiency remained in the top three until this spring’s survey. The trend toward consolidation and growth is reflected in the plans data center professionals have for their data centers 30 SAE 2013 Thermal Management Systems Symposium October 23-25, 2013, Troy, Mich., www.sae.org throughout the next 12 months. When asked the question, 65 percent plan to consolidate or replace existing servers, 64 percent plan to add additional servers, 27 percent plan to consolidate multiple data centers and 19 percent plan to build a new data center. While 26 percent expressed plans to move at least part of their operation to co-location or hosting providers, there are still some perceived drawbacks to the option. Seventy percent cited lack of control as the primary drawback of utilizing a co-location or hosting provider. This was followed by increased cost (53 percent), a setup not unique to specific needs (29 percent) and security concerns (22 percent). When asked how the professional skill set demanded of data center managers is changing, 75 percent said it’s increasingly important to understand how various data center systems work together to support overall objectives. In addition, 73 percent of respondents indicated that a greater ability to ‘see the big picture’ is a necessary skill. “It’s no longer enough for data center managers to know that all the lights in their facilities are green,” said Bob Miller, vice president, Liebert global solutions, Emerson Network Power in North America. “They need to understand the interconnectivity of systems and how they collectively support the business’ ability to grow and change. This is also likely why we’re seeing data center monitoring and management rank as the top concern.” Polycase Provides Full-Color Digital Printing for The Electronic Enclosure Market Polycase has expanded their value-added services to include digital printing on their plastic enclosures. Digital printing (also referred to as four color process or CMYK printing) ensures accurate full-color printing of text and image files. It prints high resolution, photographic quality images directly onto the plastic. Printing directly onto the enclosure eliminates the complexity and cost of sourcing and applying an adhesive label. Pad printing or silk screen printing, offered by most enclosure manufacturers, restricts customers to spot color printing, and can become costly when printing multiple colors. Polycase’s digital printing allows electronic enclosure designers to print virtually unlimited colors, gradients or color transitions, and photorealistic images. The ink used in the digital printing process is UV-cured and highly durable, making it suitable for both indoor and outdoor applications. September/October 2013 www.ElectronicsProtectionMagazine.com http://www.MotionControlExpo.com http://www.esda.org http://www.sae.org http://www.ecce2013.org http://www.fabtechexpo.com http://www.imaps.org http://www.RemoteExpo.com http://east.ubmdesign.com http://www.antennasonline.com/conferences http://www.ospmag.com http://www.teladatatcc.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - September/October 2013

Geist Unveils Rapid Deployment Data Center Environmental Monitoring System
Enabling Effective Thermal Management with DCIM
Predicting Gasket Performance: SE Measurements with a TEM Cell to Study Gasket Reliability
Rack Containment 101
The Nine Core Elements of DCIM
Using Electronic Locking Solutions to Secure Enclosures and Meet Storage Compliance Needs
Hammond’s HJ Series Ticks All the Boxes
Rogers Introduces Poron SlimGrip Foam
Ferrite Suppressors Clear Interference
Fujipoly Thermal Sheets are a Cooling Influence on LED Lighting
GE Introduces TLE Series UPS Platform
Gore PolyVent XL Improves Reliability of Large Outdoor Enclosures
IMI Sensors Launches Linear Adjust Mechanical Vibration Switch
Industry News
Calendar of Events
Five Ways to Realize Server Room Profitability

Electronics Protection - September/October 2013