Electronics Protection - November/December 2013 - (Page 18)

Enclosures Professional Enclosures for the Raspberry Pi Teko is the first enclosures manufacturer to launch a professional housing solution for the Raspberry Pi. The TekBerry enclosure has a distinctive design that is the result of detailed analysis of the characteristics required to house this innovative minicomputer. The design of the Tek-Berry exactly matches the profile of the Raspberry PI circuit board and connectors. The top and base parts firmly snap together to capture the whole Raspberry PI assembly. Unlike other low cost Raspberry PI enclosures on the market, the I/O apertures on the Tek-Berry are inset and support the connectors properly. This avoids wear problems on the PCB caused by frequent insertion and removal the USB cables etc. Instead of a simple hole, the Tek-Berry has a proper LED light guide fitted in the top section for viewing the status light on the device. Ventilation holes in the base allow air circulation and optimal internal cooling of the board. The base also has four raised feet. Tek-Berry enclosures are molded in white, black and transparent ABS as standard, but can also be supplied in different colors. New Eurocard-Based KM6 Subrack Systems Verotec strongly supports the Eurocard standard with its KM6 family of subracks that offers a choice of sizes and accessories as standard. The Eurocard remains the packaging form-factor of choice. Used in numerous bus architectures, it offers system designers the versatility they need in a proven format. For light and medium duty general-purpose applications, Verotec's KM6-II, which meets the requirements of DIN41494 and IEC 60297, features two-screw fixing of all tiebars to give a rigid assembly. It is available in heights of 3, 4, 6 and 9U, widths of 24, 42, 60 and 84 HP and depths of 160, 240, 300, 360 and 420 mm. The KM6-HD subrack system is designed for military and transport application where a rugged system offering resistance to shock and vibration is required. Built to meet MIL-STD-167, its features include positive guide retention, heavy two screw fixing tiebars, 3 mm thick side plates and rack angles with a conductive finish throughout. An Iridite NCP conductive finish throughout and slide-in double swipe RFI continuity gaskets fitted to the 19 inch rack mounting angles and rear closing angles providing electrical continuity to adjacent panels in the front and rear apertures. The KM6-HD subrack accepts standard Eurocards in 3, 6 and 9U heights with depths of up to 400 mm. It also conforms to IEEE 1101.10/11, required by modern industrial computing standards such as VME64x, cPCI, VPX and PCI. RFI shielding, support for Rear Transition Modules, front panel ESD and coding and injector/extractor handles are all provided as part of the system. Supplied in kit form or as individual component parts, all versions of the KM6-II family includes a wide range of accessories, including guides, front panels, plug-in modules, plain and venti18 lated covers and doors. In-house modifications of all four families, typically consisting of different sizes, alternative finishes, screen printing and special machining are available on short lead times to reduce time to market. Sturdy lightweight 19 inch enclosures in the new range are designed to accept full width 84E subracks and standard plug-in units. Offering heights from 2U to 9U and constructed from 1 mm thick steel, these 19 inch enclosures feature tilt-feet (front) and fixed feet (rear), ventilation slots in base and rear panel and recessed side handles for comfort and ease of transport. The enclosures are supplied flat-packed with an open front design for various front panel options that can be ordered separately. The range of sturdy metal console cases is available featuring front and rear panels in anodized aluminum. These consoles are supplied with four non-slip feet and two removeable side plates that are placed internally onto which PCBs and mounting trays can be affixed. Standard color is polar grey and five sizes are available ranging from 110 mm by 150 mm by 70 mm up to 220 by 350 by 130 mm. VadaTech Releases Rugged Conduction-Cooled MicroTCA Ecosystem VadaTech has released a complete ecosystem of boards and chassis in the MicroTCA architecture that is conduction-cooled. Designed for rugged applications, the products include Air Transport Racks (ATR), MicroTCA Carrier Hubs (MCH), Power Modules and Advanced Mezzanine Cards. Compliant to MicroTCA.3 (Hardened Conduction-Cooled MicroTCA) specification, the boards and chassis come in various sizes and formats. The MCH, which acts as a shelf controller, features a 400 MHz RISC CPU for high performance and low latency. The power modules provide true hot-swappability in a dual 10 to 36 V input and outputs of up to 800 W. They also have dual Intelligent Platform Management Interface (IPMI) and two banks of 256K Flash for redundancy. Several of VadaTech's Advanced Mezzanine Cards (AMCs) are in the conduction-cooled format. The company is also able to modify standard AMCs to ruggedized versions with wedge locks. The VadaTech ATRs come in ½ and ¾ short sizes with long and tall versions also offered. Customized chassis and module solutions are available. New Age Widens its Expandable Dongle Family New Age Enclosures has released its 2 inch Dongle. Identified as part number S-201209, it is the smallest of the New Age Dongle enclosures measuring 2.0 inches in length, 1.2 inches wide and 0.95 inches in height. The 2 inch Dongle is shaped and lightly textured for a modern look and feel. Internally it is engineered to accommodate a 1.06 by 1.81 inch PCB. These enclosures are well suited for use with Ethernet and or all USB type connectors, including USB 3.0 They are stocked in white and black RoHS compliant ABS plastic. November/December 2013 www.ElectronicsProtectionMagazine.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - November/December 2013

New Features Make F-Series TeraFrame Gen 3 One of CPI’s Most Advanced Cabinets
Silicones for High Reliability and Yield in Electronic Applications
Surge and Transient Protection for Telephone, CATV & Satellite Services
Thermal Management of LEDs: Looking Beyond Thermal Conductivity Values
Understanding NEMA Ratings for Electrical Enclosures
Silent Air Cooling: A New Approach to Thermal Management
VadaTech Releases Rugged Conduction-Cooled MicroTCA Ecosystem
Directable Inverted Blowers Deliver High Volume Air Flow
Cima NanoTech Launches Ultra Low Resistance Sante EMI Shielding Film
Littelfuse Introduces Surge-Tolerant Fuses
ProTek Devices’ TVS Array Provides Circuit Protection in Computing Applications
Reell’s PolyTorq Technology Expands Capabilities For Hinge and Torque Insert Applications
Industry News

Electronics Protection - November/December 2013