Electronics Protection - Summer 2014 - (Page 3)

Editor's Choice Advanced Plasma Technology Protects Electronics from Water and Contaminants Uyemura International Corp. has brought vacuum plasma treatment technology (Nanofics) to electronic manufacturing companies (EMS) and board makers in the US, Canada and Mexico. This low pressure plasma technology allows manufacturers to apply conformal coatings to electronic components, and to fully assembled products such as headsets, hearing aids and mobile phones. It provides a highly effective and cost-efficient surface finish to protect board surfaces prior to assembly. Nanofics technology uses a low pressure, dry plasma system to deposit polymer nanocoatings with high levels of long-term hydrophobicity and oleophobicity. It is inherently "green," and does not generate chemical waste. It also offers the distinctive advantage of being usable as an encapsulate for the complete board, with Z axis conductivity that allows electrical connection through the coating. These coatings can also be soldered through. Sabic Collaborates with Cima Nanotech on Transparent Polycarbonate Film With smart materials being one of the fastest growing areas of materials technology, Sabic and Cima NanoTech have jointly development of a plastics industry first, a transparent conductive polycarbonate film. The material has the potential to further enhance performance, enable new applications and open doors for new product designs. This could translate into faster response touch screens for consumer electronics, transparent "no-line" anti-fogging capabilities for automotive windows, better EMI shielding effectiveness for electronics, and transparent WiFi/Bluetooth antennas for mobile devices like smartphones, tablets, laptops and all-in-one computers. The collaboration, leveraging both Cima NanoTech's proprietary Sante nanoparticle technology with Sabic's Lexan film, a polycarbonate material, has resulted in the development of a series of transparent conductive materials that are lightweight with excellent transparency, outstanding conductivity and high flexibility. Cima NanoTech worked with Sabic's team of scientists to jointly develop materials that not only meet the requirements of existing industries, but also stretches the possibilities for exciting opportunities by breaking boundaries faced with current materials. iTRACS Evolves DCIM to Better Manage Network Connections in the Data Center iTRACS has released Converged Physical Infrastructure Management (CPIM) 3.2. This latest release enables faster workflows, enhanced integration tools and a new level of automated connectivity management featuring the integrated imVision automated infrastructure management solution. The integration of the imVision platform with CPIM extends iTRACS' capabilities with intelligent connectivity management. This integration offers CPIM users real-time visibility into the physical cabling infrastructure that connects IT assets in the data center. Using imVision's asset and connectivity information, CPIM customers can optimize the capacity of their infrastructure by identifying and eliminating unused network and patch panel ports and other patching inefficiencies. They can reduce the time to resolve issues and enhance network availability by pinpointing and resolving connectivity issues, such as unscheduled changes, that can cause downtime. They can also ensure the fastest time-to-value for new IT and network assets by leveraging imVision's guided work order administration and real time information updates. CPIM users will now have an additional source of connectivity intelligence offering real-time visibility into every port and panel. The flow of connectivity data from imVision is seamless. The connectivity database only has to be created once, allowing both platforms to leverage the data. Hammond Manufacturing Develops Enclosure Designed to House the Raspberry Pi Model B The 1593HAM is available in translucent blue, grey and black. The enclosure features a stylish rounded design with apertures for all the I/O interfaces and supported accessories. There are no fixings; the Raspberry Pi board clips into the base and, in turn, the top half of the enclosure then clips into the base. A catch secures the assembly and allows the case to be easily opened if required. All I/O capability is directly accessible without having to modify the enclosure. The camera module can be fitted through a slot in the top, or it can be screwed to the inside of the top cover with a hole provided for the lens. A cut out in the split line between the two halves of the case provides access to the GPIO header. Two USB ports, the RJ45 LAN port, the SD carrier, the audio and video RCA ports, the micro USB power-in connector and a HDMI interface are all accessible through apertures of the correct size and shape in the sides of the enclosure. Two captive slots are moulded into the base to enable the enclosure to be attached to a surface; for stand-alone applications, small feet are also supplied. Free Sizing Software for Thermoelectric Air Conditioners TECA Corp. has launched its newest sizing software to estimate thermoelectric air conditioner requirements. Available as a free download from TECA's website the sizing software features an intuitive and user-friendly interface. With parameters defined by the user, the free software quickly and accurately estimates cooling requirements and suggests the best TECA air conditioners to use. Selectable environment, power input and mounting options help the user narrow the choices. Other features include a notepad and interactive performance charts. The user's notes and the software solutions can be saved and printed. The software is available now on TECA's website: www.thermoelectric.com/2010/ssw/software.htm as a download. www.ElectronicsProtectionMagazine.com * Summer 2014 3 http://www.thermoelectric.com/2010/ssw/software.htm http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - Summer 2014

Editor's Choice
New High Efficiency LED Technology Benefits From Best Practice Thermal Management Design
Passive Thermal Management of Lithium-ion Batteries Using Phase Change Materials
Considerations for Powering Military Applications
How Thermal Ground Plane and Compact Air-Cooled Heat Sinks are Revolutionizing Thermal Management
Access Control Solutions for Railway Infrastructure
20 Data Center Downtime Study Puts Focus on Maximum Protection
Cooling and Shielding in the Right-Sized Enclosure
Enclosures
Thermal
Power
Hardware
EMI/EMC/ESD
Industry News
Calendar of Events

Electronics Protection - Summer 2014