Electronics Protection - Winter 2014 - (Page 28)

Hardware New microPEM TackScrew Fasteners for Compact Electronics microPEM TackScrew fasteners from PennEngineering integrate self-clinching technology for permanent sheet-to-sheet attachment while also incorporating a thread-like feature to allow fastener removal when necessary. This combination adds functionality to the original microPEM TackPin fastener product line for thin sheet attachment applications, especially compact electronics. TackScrew fasteners can even be reinstalled one time if desired. These hardened stainless steel Type TS fasteners can serve as practical solutions to attach a top sheet or panel to a base material in applications ranging from laptops, notebooks, and tablet computers to smart phones, gaming and hand held devices, and wearable electronics. As suitable replacements for micro screws, TackScrew fasteners will not require the added costs of locking patches, threaded inserts, tapped holes or driver bits for initial installation, or potential rework due to cross threading and driver bit "cam out." The clinch technology resists vibrational loosening in service and the fastener's low-profile head can add cosmetic value. The fasteners install in thin sheets by preparing properly sized mounting holes in the sheet to be attached and the base panel. After inserting the fastener into these holes, the fastener is pressed into place. The fastener then clinches into the base panel and its head subsequently holds the top sheet (as thin as 0.2 mm/0.008 inch) firmly and permanently in place. The base panel can be as hard as HRB 89 / HB 187 or less on the Rockwell "B" and Brinell scales, respectively, and as thin as 0.91 mm /0 .036 inch. Hirose Develops Low-Profile Power Connector Hirose has developed the DF65 series connector, a small, vertical-mating wire-to-board connector that provides highcurrent capacity and high reliability for power supplies, up to 4 Amps (with 24 AWG wire) and 50 V AC/DC. A low profile connector, the DF65 series features a narrow 1.7 mm pitch and 1.8 mm mated height. The vertical mating feature maximizes available board space and reduces assembly time. The DF65 series introduces Hirose's advanced locking system developed for high vibration applications, which makes it wellsuited for use with a DC jack or battery pack. The double locking structure enhances reliability by reinforcing the engagement between the socket and the header. The positive lock secures the socket into the header, and produces over 5N cable pull strength in the upper direction. The friction lock system ensures complete locking by producing a final tactile click, and prevents the socket from floating after mating. The two point contact structure provides optimum reliability by stabilizing contact resistance and restraining temperature rise. The DF65 connector's molded structure prevents solder wicking and accidental unmating, while the header design provides increased cable retention and enhanced lance strength. The small size, high power capability, and ruggedness makes the 28 Winter 2014 * www.ElectronicsProtectionMagazine.com DF65 series wire-to-board connector well-suited for a wide range of applications including industrial machinery, industrial robotics, portable medical devices, laptops, tablets, digital cameras, LCD TVs, home electronics, white goods, and LED lighting. With an operating temperature range of -35°C to 105°C, the DF65 series connector limits contact resistance to 10 M ohms maximum with an insulation resistance of at least 100 M ohms. Curtiss-Wright Expands its Hybricon Family of Fabric40 OpenVPX Backplanes Curtiss-Wright Corp.'s Defense Solutions division has expanded its family of 40 Gbps Gen3 OpenVPX backplanes with the introduction of three Hybricon central-switched Fabric40 OpenVPX backplanes and two Gen3 OpenVPX-optimized Fabric40 OpenVPX pass-through backplanes. Curtiss-Wright's Fabric40 family of backplanes is designed to enable end-to-end transmission of the high speed data required for the most demanding ground and airborne C4ISR and EW deployed applications. The Gen3 OpenVPX backplanes support full-speed, bottleneckfree distribution of data over, Gen3 PCI-Express, 40 Gbps Ethernet or Infiniband fabrics. Featuring patent-pending signal integrity technology to ensure application reliability and reduced risk, these high performance backplanes enable the design of a new class of embedded subsystems capable of delivering previously unobtainable levels of performance to support numerous demanding defense and aerospace EW, SIGINT, RADAR applications, such as the real-time detection and identification of signals of interest. Fabric40 Gen3 OpenVPX backplanes are designed for use in both development and rugged deployed applications. In air-cooled or conduction-cooled development chassis, the new backplane speeds and eases the integration of compute-intensive radar, signal and image processing for ground or airborne platforms. Curtiss-Wright can also design application-specific configurations to meet a customer's individual requirements. New IP 68 Quick Fix Cable Glands from OKW New Quick Fix Cable Glands from OKW speed up installations and make it easier to work when access is difficult. Quick Fix Cable Glands have been designed to be fitted from the outside without the use of special tools. They will fit both OKW and non-OKW enclosures. Installation involves simply pushing the cable gland into a drilled hole, centring it and tightening an external locknut which has a left-hand thread to ensure it remains firm. The cable can then be fed through. Not only are the glands easy to use but they also save space because only a very narrow flange extends into the enclosure. Each Quick Fix Cable Glands is rated to IP 68 as standard for its seal and strain relief. The glands are designed for enclosure wall thicknesses from 0.04 inches to 0.15 inches. Four sizes are available: M16 (cable Ø 0.20 to 0.39 inches), M20 (cable Ø 0.31 to 0.51 inches), M25 (cable Ø 0.43 to 0.67 inches), M32 (cable Ø 0.59 to 1.26 inches). They are molded in polyamide in Light Gray (RAL 7035) as standard. Custom colors are available on request. http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - Winter 2014

Editor's Choice
EMI Compliance: Choosing the Right Shielding and Gasketing
Thermal-Fluid Modeling for Flat Thin Heat Pipes/Vapor Chambers
Increase Rack Cooling Efficiency and Solve Heat-Related Problems
Seven Essential Cabinet Design Considerations for Protecting 19 Inch Electronics
A Better Alternative to Heat Pipes: Integrating Vapor Chambers Into Heat Sinks
Common IP Testing Failures and How to Avoid Them
Enclosures
EMI/EMC/RFI
Thermal
Power
Hardware
Contamination
Industry News

Electronics Protection - Winter 2014