Electronics Protection - Fall 2015 - (Page 31)

Industry News Calendar of Events International Wafer-Level Packaging Conference Oct. 13-15, 2015, San Jose, Calif. www.iwlpc.com Antenna Systems 2015 Nov. 5-6, 2015, Las Vegas Nev. www.antennasonline.com/conferences IMAPS 2015 October 26-29, 2015, Orlando, Fla. www.imaps.org Productronica 2015 November 10-13, 2015, Munich, Germany www.productronica.com Remote Monitoring and Control 2015 Nov. 5-6, 2015, Las Vegas Nev. www.RemoteExpo.com FABTECH 2014 November 11-13, 2014, Atlanta, GA. www.fabtechexpo.com IoT West Nov. 5-6, 2015, Las Vegas Nev. www.iot-west.com Power-Gen International December 8-10, 2015, Las Vegas, Nev. www.power-gen.com better than thicker layers deposited by sputtering or PECVD. However, the inherent stability of the films at higher temperature/humidity (e.g. 85C/85%RH) is a problem. If PE-CVD is used, ALD film stability improves, as well as for mixed oxides, but it is still an issue. A second problem comes with particles and substrates non-uniformity. Any defect may lead at an initial non-uniform nucleation that propagates into the growing film. Furthermore, loose particles on substrates may be partially covered, but because of the extreme thinness, the thin film does not have the mechanical strength to keep them in place under mechanical stress. Any mechanical stress leads to film fracture with consequent creation of an ingress path for moisture. That is why multilayer structures are necessary. Deposition tools are in development from Lotus, Beneq, Encapsulix and others. Exploration at Samsung SDC with ALD films for TFE was very much advertised by Synos, but resulted in failure and any further evaluation was halted. ALD for barrier on foil has better results although there are doubts and hurdles in scaling up and reaching the deposition speed required for a cost effective process. Will DC Grid be a Solution for Data Centers? Ever-increasing internet traffic and the video streaming boom will encourage large data center investments in the coming years. Last year, around $143 billion was invested worldwide for new data center projects. Large internet companies like Amazon, Facebook, and Google are leading the investment in next-generation green data centers. There is a trend towards building larger data centers, consolidating and densifying server concentration for the sites which require more efficient buildings. Yole Développement (Yole) has released a comprehensive analysis of the trends, market and opportunities of development for the next generation of data centers, including new architectures and technologies. This report is entitled: New Technologies & Architectures for Efficient Data Centers. Under this new analysis, Yole's team presents market forecasts between 2010 and 2020. It includes regional splits. Yole's analysts also identifies the key players and their market share for servers, UPS, and cooling systems. This report is also an overview of each technology's technical evolution including silicon photonics, nonvolatile memory (NVM), wide band gap (WBG) materials. "At Yole, we clearly identify a trend to develop larger data centers with an increased server concentration",confirms Mattin Grao Txapartegi, technology & market analyst, Yole. This trend has a direct impact on the blade server market: indeed, the blade server market for data centers will display a 2015 - 2020 CAGR of 10.8 percent, while the entire server market will increase by 2.3 percent. Global server market share for data centers will increase from slightly lower than 20 percent in 2014 to almost 35 percent by 2020. "Our regional split shows that North America, particularly the US, has the biggest share of the server market, at 34% / $3.5 billion," details Mattin Grao Txapartegi. "Europe, however, leads the UPS equipment and cooling systems markets for data centers. In fact, Europe's large UPS (Up to 100 kVA) market was estimated at $931 million in 2014." Traditionally rigid AC architectures are evolving towards flexible and modular solutions. Will DC grid be a solution for data centers? Established data centers are not able to enlarge their Information Technology (IT) equipment, since the power architecture and the centralized cooling system were designed for rated power. Such designs cannot be modified either, and more importantly, they present many inefficiencies when servers work in "low load" mode. Modularity brings a fresh approach to data center design, enabling the incorporation of additional servers when needed. Also, the power and cooling systems are better optimized, since equipment modules and distribution sub-networks can be activated/deactivated for improved efficiency. Moreover, virtualization and server resource management systems eliminate unnecessary power waste. Yole has also identified a smaller, high-potential parallel market consisting of container data centers. These containers are rugged, portable, energy-efficient plug and play solutions that have enjoyed rising sales over the last few years. Hewlett Packard (HP) leads this new market, which will enjoy a 23.2 percent CAGR from 2015 to 2020, with Huawei following closely behind. Leader Tech Welcomes Twins Two high-precision laser cutters have recently been added to Leader Tech's rapidly expanding capabilities profile. This significant investment in advanced laser manufacturing technology brings a new level of quality, speed and cost-effectiveness to the EMI shielding market. In addition to military-grade metal circuit board shields, these lasers are able to produce close tolerance custom gaskets and shapes using almost any material including conductive elastomers and conductive foam. www.ElectronicsProtectionMagazine.com * Fall 2015 31 http://www.antennasonline.com/conferences http://www.iwlpc.com http://www.productronica.com http://www.imaps.org http://www.fabtechexpo.com http://www.RemoteExpo.com http://www.power-gen.com http://www.iot-west.com http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - Fall 2015

Electronics Protection - Fall 2015
Contents
Editor's Choice
Beat the Heat: Six Best Practices for Protecting Your People and Your Business from Arc Flash Hazards
Data Center Design and Cooling for Sensitive Electronics
Electronic Access Solutions - Design Considerations for Your Data Center
An Unsung Hero: the Gas Discharge Tube
Innovation Demands That You Break the Rules
Enclosures
Thermal
Power
Hardware
Industry News
Calendar of Events

Electronics Protection - Fall 2015