Electronics Protection - Spring 2015 - (Page 30)

Industry News Global Market for Thermal Management Products to Reach $15.56 Billion by 2018 The thermal management industry is moving toward comprehensive solutions to cool electronics and paving the way for the electronics industry to develop high-performance applications. As a result, the dynamic in this market has not been one where there is a move toward a single technology or product that replaces others. The tendency is for systems designers to look at the entire problem and evaluate multiple options and combinations for a solution. According to a recently published report from iRAP, Inc., "Electronic Thermal Management - Technology, Materials, Devices, New Developments, Industry Structure and Global Markets," the world market for thermal management products is predicted to grow from about $8.8 billion in 2013 to $15.56 billion by 2018, at an average annual growth rate (CAGR) of 12.1 percent. Thermal management denotes the array of problem-solving design tools and material technologies that systems manufacturers apply to regulate the unwanted heat caused by the normal functioning of an electronic system. Increasing power densities and decreasing transistor dimensions are hallmarks of modern computer chips. Both trends are increasing the thermal management challenge within the chip and surrounding packaging, as well as accelerating research progress on high conductivity materials. The trend line of the thermal management industry aligns with the development of technology in the semiconductor, microprocessor and computer industries. For every advance in performance of these systems, there is a corresponding increase in the operating heat generated by the system. It is probably more accurate to state that the development of thermal management as an industry is the result of a synergy of solutions constantly engineered to manage excess heat in today's electronic systems. There are four main segments in thermal management technologies: hardware, software, interfaces and substrates. According to the new iRAP report, the hardware segment maintained its number one position with largest share of the market in 2013. This is followed by substrates, thermal interface materials and the software segment. The overview of end-user trends shows the largest market in 2013 was for computers, followed by telecommunications, industrial/military industries, medical/office equipment, automotive and consumer products. The thermal management industry is made up of companies from several industries that supply cooling solutions to manufacturers of electronic systems. The industry itself is structured around the applications that require thermal management. It is made up of component producers, specialty chemical companies, consultants and programmers. Future Resource Engineering Launches to Help Data Centers Reduce Energy Usage, Enhance Operations and Increase Profitability RLE Technologies has launched a new division, Future Resource Engineering. The enterprise will systematically identify facility and operational inefficiencies in enterprise or embedded data centers and implement turnkey solutions to reduce power usage and increase the data center's bottom line. Future Resource Engineering administers a three step process to provide data center owner/ operators with tangible power savings with no IT downtime or movement of equipment. Their Efficiency Engineers will perform facility evaluations, efficiency reporting and implementation. Facility evaluations will determine energy and operational 30 Spring 2015 * www.ElectronicsProtectionMagazine.com inefficiencies. This free service determines if an engagement with Future Resource Engineering can produce a significant enough ROI for the customer to justify moving forward. Efficiency reporting includes a complete energy audit that measures facility metrics and quantifies precisely how much savings a customer can expect to see. Recommendations typically include: adjusting airflow management, implementing or upgrading equipment monitoring and controls, improving operational protocols, increasing cooling efficiency and other best practices. During this phase, the Future Resource Engineering team also works closely with local utility companies to validate their findings and help determine potential energy reduction incentives. Lastly, implementation of the suggestions outlined in the efficiency report. Future Resource Engineering is one of the few companies that can also execute on recommendations. This results in little disruption to the daily facility operations and no downtime. Additionally, the company is one of the few that will help clients reduce the financial risk of implementing the efficiency plan by utilizing utility incentives and vendor neutral solutions to offset project costs. The anticipated utility incentives can be deducted from the total project price up front, essentially transferring much of the risk from the customer to Future Resource Engineering if a project doesn't meet expected efficiency goals. BICSI Releases Updated Edition of Global Data Center Standard BICSI has announced an updated release of its flagship standard, ANSI/BICSI 002-2014, Data Center Design and Implementation Best Practices. Considered the foundation standard for data center design around the world, ANSI/BICSI 002-2014 continues its mission to provide requirements, guidelines and best practices applicable to any data center. Data center construction and expansion is predicted to continue steadily over the next ten years worldwide. With the increasing focus on reliability and efficiency, the initial design is more important than ever. Thus, today's data center designer is required to have knowledge of mechanical, electrical and telecommunications systems and how they interact-areas not typically found in the same reference manual or standard. Now featuring 500 pages of content, the 2014 edition of BICSI 002 focuses on adding or expanding information on critical data center design and infrastructure topics, including modular and "container" data centers, data center infrastructure management (DCIM) and building systems, DC power, hot and cold aisles, multi-data center architecture and data center service outsourcing and energy efficiency. Rogers Corp. Signs Definitive Agreement to Acquire Arlon, LLC Rogers Corp. has signed a definitive agreement to acquire Arlon, LLC, currently owned by Handy & Harman Ltd. for $157 million, subject to closing and post-closing adjustments. The transaction, which is subject to regulatory clearances, is expected to close in the first half of 2015. Rogers intends to finance the transaction through a combination of cash and borrowings under an existing bank credit facility. "This transaction is truly a unique strategic fit for both Rogers and Arlon, said Bruce Hoechner, president and CEO, Rogers. "We are energized by the opportunity to serve our customers with our complementary capabilities and technologies in circuit materials and engineered silicones and to enhance value for our shareholders. We look forward to closing this acquisition as another signifi- http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - Spring 2015

Editor's Choice
Predictive Modeling: The Next Frontier in Data Center Condition Maintenance
Don't Forget the Batteries
Military Aircraft Power
Pumped Two Phase Cooling Solutions for Challenging Thermal Management Applications
Identifying the Ideal Mechanical PCB Hardware for Electronic Systems
Bridging the Technology Gap: The Importance of Cyber and Physical Security within the Data Center
Waterproof Mobile Device Protection without Compromising Acoustic Quality
Enclosures
Thermal
EMI/EMC/RFI
Power
Hardware
Contamination
Industry News

Electronics Protection - Spring 2015