Electronics Protection - Summer 2016 - (Page 31)

Industry News Calendar of Events SEMICON West July 12-14, 2016, San Francisco, Calif. www.semiconwest.org EOS/ESD Symposium 2015 September 11-16, 2016, Garden Groove, Calif. www.esda.org/symposia.html IEEE International Symposium on EMC July 25-29, 2016, Ottawa, Canada www.ieee.org OSP Expo September 20- 22, 2016, San Antonio, Texas www.ospmag.com Advancements in Thermal Management 2016 August 3-4, 2016, Denver, CO www.thermalnews.com Inframation 2016 September 27-29, 2016, Las Vegas, Nev. www.inframation.org BICSI Fall 2016 September 11-15, 2016, San Antonio, Texas www.bicsi.org IMAPS 2016 October 11-13, 2016, Pasadena, Calif. www.imaps.org phones, and other electronic devices; a trend that gained traction in 2015, and is expected to impact the flexible electronics demand favorably from 2016 to 2024 owing to high penetration in the wearable's segment. The display segment is projected to grow at a CAGR exceeding 16 percent over the forecast period. It is primarily attributed to the ability of these products to curve, roll, flex, conform and fold, enabling a new intuitive user interface. Further, companies are progressing towards the use of plastic displays as an alternative to glass displays, which provides opportunity for future growth. Wearable devices segment accounted for over 40 percent of the overall revenue in 2015 and is expected to witness a healthy demand over the forecast period. This increase is primarily ascribed to upsurge in demand for fitness or activity trackers as these products are wellpositioned in the market with a promise of tracking productivity, physical activity, heart rate, sleep, etc. that intrigues customers Asia Pacific flexible electronics market accounted for over 20 percent of the overall revenue share in 2015. Research capabilities and aggressive investments by major industry players such as LG and Samsung Electronics in anticipated to drive regional growth over the forecast period. Prominent industry participants include 3M, E Ink Holdings Inc., GE Measurement & Control Solutions, ITN Energy Systems Inc., LG, PARC, Samsung, and Thinfilm Electronics ASA. Strategic alliances among the major stakeholders such as material manufacturers, academia, and device integrators is anticipated to strengthen the existing technology know-how while driving drive efforts to explore new application areas. Chatsworth Products and Sunbird Software Announce Global Partnership Chatsworth Products (CPI) has announced a partnership with Sunbird Software, a provider of software solutions that simplify how data centers are managed. The two companies have collaborated to develop, test and certify a co-branded version of Power IQ that will offer out-of-thebox compatibility with CPI eConnect Power Distribution Units (PDUs). Under the agreement, CPI will market and sell Power IQ for eConnect globally. This joint solution will make it easy for data center managers to monitor data center power, report Power Usage Effectiveness (PUE), bill for energy and manage power capacity. Power IQ for eConnect, a vendor agnostic data center monitoring solution, provides a single pane of glass to make it easier to automatically manage the health and capacity of data centers via monitoring critical infrastructure devices. "Chatsworth Products is pleased to offer our customers a tool that provides critical insight and reporting across the entire power infrastructure," said Ted Behrens, executive VP of Global Engineering, product management & marketing for CPI. "Combining the features of eConnect with the robust, yet simplified monitoring capabilities of Power IQ, our customers will be able to optimize power efficiencies throughout the data center." Additionally, Power IQ supports CPI's Secure Array IP Consolidation, which allows users to link up to 32 eConnect PDUs under a single IP address using standard Ethernet cables, reducing time and costs. Power IQ for eConnect software can be easily deployed as a standalone DCIM solution for monitoring or with Sunbird's dcTrack DCIM software for Operations to provide full asset, configuration and change management. www.ElectronicsProtectionMagazine.com * Summer 2016 31 http://www.esda.org/symposia.html http://www.semiconwest.org http://www.ospmag.com http://www.ieee.org http://www.inframation.org http://www.thermalnews.com http://www.imaps.org http://www.bicsi.org http://www.ElectronicsProtectionMagazine.com

Table of Contents for the Digital Edition of Electronics Protection - Summer 2016

Electronics Protection - Summer 2016
Contents
Editor's Choice
Common Coolant Types and Their Uses in Liquid Cooling Systems
The Benefits of Vertical Integration for Customized EMI Shielding Products and Services
Cool It Your Way: Versatile Cooling for Electronics Enclosure
Heat Pipes and Vapor Chambers – What’s the Difference?
Securing Electronics in Modern Railway Systems
Enclosures
Thermal
Power
Hardware
Industry News
Calendar of Events

Electronics Protection - Summer 2016