Electronics Protection - Summer 2017 - 22

Thermal
Element Six Introduces Electronically Conductive CVD Diamond Heat Spreader
Element Six has developed a new thermal grade of synthetic
diamond grown by chemical vapor deposition (CVD), Diafilm
ETC700. The material is both thermally and electrically conductive and is uniquely suited to effectively manage heat in high
frequency, high power density devices.

With a thermal conductivity up to 700 W/mK, Diafilm ETC700
CVD diamond heat spreaders are three times more effective in
spreading heat than alternative ceramic solutions. This electrically conductive all-diamond solution does not require the metal
coatings typical of other heat management materials, resulting in
reduced frequency dependent conductive losses.
Diafilm ETC700 outperforms all other commercially available metallized, non-diamond heat spreader materials
or common metal solutions. A larger conduction cross-section enables better RF performance by improving the
ground-plane isolation. Diafilm ETC700 maintains a high bulk thermal conductivity, whilst the bulk electrical conductivity reduces capacitive coupling between ground planes at low frequencies, and reduces conductive losses at
higher frequencies.
Element Six's range of Diafilm TM heat spreaders have the highest known thermal conductivity of any solid material
at room temperature and are available in a range of sizes, thicknesses and metallization. With the addition of Diafilm
ETC700, Element Six expands its portfolio to a total of six material grades spanning several levels of thermal, electrical performance and cost points, ranging from 700 W/mK to 2,000 W/mK.
CVD diamond is a superior material for high power density/high frequency devices due to a unique combination
of exceptional properties including high thermal conductivity, mechanical strength, electrical insulation, low weight
and chemical inertness. Diafilm ETC700 offers better electrical device operation, lower operating temperatures and
improved reliability and longer lifespans of high frequency active semiconductors.

Extremely Soft TIM Delivers 13 W/m°K Performance

Sarcon PG80A from Fujipoly is one of the industry's softest and highest performing thermal gap filler pads. The 13 W/m°K putty-like material requires
very low compression force at high compression rates, allowing it to gently
conform to most component shapes and uneven surfaces. Once installed,
Sarcon PG80A can transfer heat from its source to a nearby heat sink while
exhibiting a thermal resistance as low as 0.08°Cin2/W at 14.5 PSI.
This advanced thermal interface material is ideal for applications that have
delicate or wide-variation component heights and require material compression between 30 percent and 90 percent. PG80A is available in four sheet thicknesses (0.5, 1.0, 1.5 and 2.0 mm) up
to a maximum dimension of 300 by 200 mm. Sarcon PG80A can also be ordered in die-cut form to fit almost any application shape. Fujipoly's new material is well-suited for environments with operating temperatures that range from
-40 to 150°C and exhibits a UL94 flame retardant rating of V-0.

GlacialTech Announces Igloo FR210 Series Cold Forging Heatsinks
GlacialTech has release a series heatsinks using cold forging technology that are
well suited for lighting application from 100 W to 200 W. The Igloo FR210 series
heatsink expands three models of 21cm diameter with different heights: Igloo
FR210B (100 W), Igloo FR210C (150 W) and Igloo FR210D (200 W).

The Igloo FR210 series using AL1070 aluminum, with thermal resistance at 0.81°C/W for Igloo FR210B, 0.70 °C/W for
Igloo FR210C, and 0.64 °C/W for Igloo FR210D. These new heatsinks have different thick bases from 6 mm to 8 mm,
to address the specific needs of LED Technology. With a thicker base, heat dissipation spreads over a larger area for
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Table of Contents for the Digital Edition of Electronics Protection - Summer 2017