Autonomous Vehicle Engineering - April 2022 - 28

New Tools & Technologies
Data Switches
Microchip Technology Inc.
(Chandler, Arizona) announced
its fourth-generation
automotive-grade PCIe
switches for interconnect
capabilities in ADAS. The
company states these
switches provide high-speed
interconnect that supports
distributed, real-time safety-critical data processing in ADAS
architectures as well as ultra-low latency and low-power bandwidth
scalability to CPUs and specialized accelerator devices.
The company also claims that its Gen 4 switches provide the
lowest latency and high bandwidth required to link the CPU
and accelerator building blocks used in ADAS applications.
Additionally, Microchip's ChipLink diagnostic Graphical User
Interface (GUI) provides extensive debug, diagnostics, configuration,
and forensics tools for rapid deployment.
For more information, visit http://info.hotims.com/82339-406
Server Modules
Congatec (San
Diego, California)
has unveiled the
x86 based COMHPC
Server modules.
The new
COM-HPC Server
modules are
available in Size E
and D as well as the COM Express Type 7. The company
claims that these modules will accelerate the next generation
of real-time microserver workloads in rugged environments
and extended temperature ranges. Improvements include up
to 20 cores, RAM up to 1 TB, double throughput per PCIe
lanes to Gen 4 speed, as well as up to 100 GbE connectivity
and TCC/TSN support. Congatec states that these three new
module families will significantly extend the lifecycle of nextgen
rugged edge server designs.
For more information, visit http://info.hotims.com/82339-407
ADHESIVE COMPOUNDS for
SPECIFIC COMPOUNDS OFFER
CHEMICAL RESISTANCE
to acids, bases and salts
ELECTRICAL INSULATION
Volume resistivity, 75°F
1014
to 1015
ohm-cm
THERMAL CONDUCTIVITY
0.5 to 2 W/(m·K)
Perception Software
Ambarella Inc. (Santa Clara,
California) and Helm.ai (Menlo
Park, California) have announced
a collaboration for
ADAS software integration.
Ambarella's AI SoC architecture
will now be integrated
with Helm.ai's advanced driver
assistance system software.
The companies state that this new integration allows them
to rapidly iterate on technical approaches that meet the
latest automotive market needs, while offering combined
hardware and software solutions to joint customers. This
system features Helm.ai's full 360° surround-view camera
perception stack for L2+/L3 and autonomous driving on
Ambarella's automotive grade CV2FS SoCs. This integration
leverages all hardware capabilities of the Ambarella
CVflow architecture to optimize the performance of
Helm.ai's AI algorithms.
For more information, visit http://info.hotims.com/82339-408
154 Hobart Street, Hackensack, NJ 07601 USA
+1.201.343.8983 * main@masterbond.com
www.masterbond.com
28
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AUTONOMOUS VEHICLE ENGINEERING
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Autonomous Vehicle Engineering - April 2022

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