Automotive Engineering - December 2024 - 30

PRODUCT
BRIEFS
SPOTLIGHT: PROCESSORS & SEMICONDUCTORS
Click boards
GaN power ICs
Cambridge
GaN Devices
(Cambridge,
United
MIKROE (Belgrade, Serbia) announced a new feature for its
range of click boards that reduces size, weight and power consumption
for second-level prototyping and production. With
Click Snap, users can reportedly develop systems using add-on
peripheral boards and development boards equipped with the
mikroBUS socket. The portion of the board with the specific
active peripheral circuitry can be snapped free of the rest of
the click board and used as a system-on-module (SoM). The
new Snap feature is Inclinometer 4 Click, which is designed to
measure angles of slope or elevation of an object. This board
features the FXLS8971CF, a three-axis low-g MEMS accelerometer
from NXP Semiconductor with selectable full-scale ranges
of ±2/4/8/16g and features such as selectable output data
rates, motion detection and a 144-byte output data buffer.
https://www.mikroe.com
MUX modules
Pickering Interfaces
(Clacton, United Kingdom)
offers a new high channel
count microwave MUX family
(models 40/42-788) based
on Radiall mechanical microwave
switches. The family is
available with bandwidth
options from 8GHz to 40GHz and versatile switching configurations,
including single or dual SP8T, SP10T or SP12T multiplexers.
They are suited for many uses across the RF spectrum where
extremely low insertion loss and ultra-high isolation are critical.
These modules are said to provide the highest RF and microwave
switching performance available within a Pickering switching
system as well as the highest channel count microwave multiplexer
switches available from any PXI vendor. This can result in
fewer switches and associated interconnections being required
for high channel count microwave switching applications, improving
signal quality and ease of programming.
https://www.pickeringtest.com
30 December 2024
Kingdom) announced
two
new packages
for the company's
ICeGaN
family of GaN
power ICs that
reprotedly offer
enhanced
thermal performance
and simplify inspection. Developed for
Cambridge, the DHDFN-9-1 (Dual Heat-spreader DFN) is a
thin, dual-side cooled package with a small, 10x10-mm
footprint and wettable flanks to simplify optical inspection.
It offers low thermal resistance (Rth(JC) and can be operated
with bottom-side, top-side and dual-side cooling, offering
flexibility in design and out-performing the oftenused
TOLT package in top-side and, especially, dual-side
cooled configurations. The DHDFN-9-1 package has been
designed with dual-gate pinout to facilitate optimal PCB
layout and paralleling, enabling customers to address applications
up to 6 kW.
https://camgandevices.com
Wheel motor seals
Freudenberg Sealing
Technologies (Weinheim,
Germany) has developed a
pair of seal designs specfically
for in-wheel motors.
The cassette seal reportedly
offers a double sealing lip
and mating contact surface
installed in a closed system, featuring precisely matched materials
made of stainless steel and special rubber compounds.
The required speed ranges and contamination protection can
be scaled. The cassette seal also offers a long service life and
high functional reliability. It is capable of achieving up to
500,000 km and protection class IP67. This makes it a maintenance-free,
self-lubricating solution throughout its entire service
life. The second design, a V-seal, works in an open system
and features wear-resistant elastomers with excellent sliding
properties. According to Freudenberg, this seal creates a plugand-play
solution designed for flexible applications.
https://www.freudenberg.com
AUTOMOTIVE ENGINEERING
https://www.mikroe.com https://camgandevices.com https://www.pickeringtest.com https://www.freudenberg.com
Automotive Engineering - December 2024

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