Automotive Engineering - March 2025 - 29

PRODUCT
BRIEFS
SPOTLIGHT: ADAS/AV SENSORS
Logic ICs
Nexperia
(Nijmegen,
Netherlands)
introduced a
new portfolio of
logic ICs in automotive-qualified
MicroPak
XSON5 leadless
packaging. The
MicroPak
XSON5 is a
thermally enhanced
plastic
enclosure with a 75% smaller PCB footprint than traditional
leaded mini logic packages. It also features sidewettable
flanks to support automated optical inspection
(AOI) of solder joints. Nexperia's SOT8065-1 MicroPak
XSON5 has 5 terminals, is free from delamination and reportedly
offers high moisture resistance. Uniform 7 μm Sn
layer on pad sides and bottom prevent oxidation and is
RoHS and dark green compliant. SOT8065-1 devices use
the same die as the SOT353 package but offers a smaller
PCB footprint with superior solder durability and enhanced
electrical performance.
https://www.nexperia.com
Inverters
Cambridge GaN
Devices
(Cambridge, United
Kingdom) and IFP
Energies (RueilMalmaison,
France)
have developed a
demo which confirms
the suitability of CGD's ICeGaN®650 V GaN ICs in a
multi-level, 800 VDC inverter. The demo delivers high power
density - 30 kW/l - which is greater than can be achieved by
more expensive silicon-carbide (SiC)-based devices. The inverter
also reportedly demonstrates the potential of paralleling
that ICeGaN technology enables. Each inverter node has
three 25mΩ / 650V ICeGaN ICs totaling 36 devices in paralell.
This multi-level GaN Inverters can power electric motors to
over 100 kW peak, 75 kW continuous power. The CGD/IFPEN
demo features: a high voltage input of up to 800Vdc; 3-phase
output; a peak current of 125 Arms (10s) (180 Apk); and a
continuous current of 85 Arms continuous (120 Apk).
https://camgandevices.com
AUTOMOTIVE ENGINEERING
SPOTLIGHT: SIMULATION
Vehicle models
VI-grade (Darmstadt, Germany) announced an expanded
collaboration with Applus+ IDIADA (Troy, Michigan). The
partnership introduces IDIADA's high-fidelity vehicle models
- accurate digital twins based on real-world test data - into
VI-grade's VI-CarRealTime software for advanced simulation
and testing capabilities. VI-grade states that the collaboration
represents a significant step forward in virtual vehicle development,
enabling automotive OEMs and suppliers to use
IDIADA's validated vehicle models in both offline and online
simulations on driving simulators through the VI-CarRealTime
platform. These models, derived from physical vehicle testing,
reportedly allow manufacturers to perform in-depth virtual
evaluations of vehicle dynamics and performance with customizable
parameters such as tire models and payloads.
https://www.vi-grade.com
TVS Diodes
Littelfuse (Chicago, Illinois) launched
a new range of TVS Diodes specifically
designed for the protection of
Silicon Carbide (SiC) MOSFET gate
drivers in automotive applications.
This product addresses the increasing
demand for reliable overvoltage
protection in next-generation electric
vehicle (EV) systems, delivering a
compact, single-component solution
that replaces multiple Zener diodes or TVS components traditionally
used for gate driver protection. The TPSMB
Asymmetrical TVS Diode Series reportedly provides superior
protection for SiC MOSFET gate drivers, which are prone to
overvoltage events due to faster switching speeds compared
to traditional silicon-based MOSFETs or IGBTs. The unique
asymmetrical design of the TPSMB Series supports SiC
MOSFETs' differing positive and negative gate driver voltage
ratings, ensuring enhanced performance in a variety of demanding
automotive power applications.
https://www.littelfuse.com/
March 2025 29
https://www.nexperia.com https://www.vi-grade.com https://camgandevices.com/ https://www.littelfuse.com/
Automotive Engineering - March 2025

Table of Contents for the Digital Edition of Automotive Engineering - March 2025
