Aerospace & Defense Technology - April 2023 - 47

New Products
X9 Venom Xeon D Host Processor Board
General Micro Systems (San Diego, CA) has launched its X9
PCI Express
Mini Card
Venom Xeon D Host 3U VITA 65 OpenVPX single-board computer.
Aligned to the SOSA (Sensor Open Standard Architecture)
Technical Standard, this family of high-performance
modules support the demanding needs of next-generation
warfare with massive, flexible I/O and compute capabilities in
multiple configurations. These single-board computers are
powered by up to 20 Intel® Xeon® D-2700 HCC (formerly Ice Lake D) cores, and unprecedented
bandwidth via inter-chassis and front-panel connectivity with Thunderbolt™ 4, PCIe
Gen 4, USB, and 100 GbE ports.
What makes these single-board computers (SBCs) most unique is the compact combination
of so much ultra-speed I/O at 40Gbits/s or 100Gbits/s, up to three processors per module, and
the breadth of modular, application-specific I/O that interfaces with all manner of defense
systems and platforms.
www.gms4sbc.com
UAS Command and Control
Drone avionics manufacturer uAvionix (Bigfork, MT) introduced
an updated product line offering for uncrewed aircraft system
(UAS) beyond visual line of sight (BVLOS) command and control
(C2). The SkyLine™ C2 management platform ecosystem is headlined
by muLTElink™, an industry first combination of LTE technology
with broadcast radio frequency (RF) radios which permit
dynamic selection of the best radio link at any given moment between LTE, unlicensed industrial,
scientific and medical (ISM) frequencies, or aviation protected C-Band in a single lowSWaP
avionic device. Designed for integrated operation with the uAvionix SkyLine™ C2
management platform, the combination of muLTElink and SkyLine enable a self-healing C2
network capable of both path diversity and link diversity eliminating lost-link possibilities
over broad terrain and altitude ranges.
www.uavionix.com
Product Spotlight
SInergy Family of Connectors
AirBorn (Georgetown, TX) launches its all-new SInergy line
of interconnects. SInergy offers OEMs a mini-modular hybrid
solution in 1-5 configurable bays. With speeds up to 25Gbps
per lane or 75Gbps aggregate bidi bandwidth, SInergy meets
requirements for XAUI, USB 3.0, PCIe Gen 3/4, SAS-3/4, and
Ethernet (10G/25G per lane) applications. Exemplifying milgrade
resilience, high-speed, high-density SInergy connectors
are tested & qualified based on MIL-DTL-83513 performance requirements. SInergy's modularity
means OEMs have multiple signal-carrying options in any configuration of signal or
SMPM RF interfaces, in one to five bays.
www.airborn.com
Rogue Carrier for Jetson AGX Orin
Connect Tech Inc. (Guelph, Canada) has introduced the Rogue Carrier
for Jetson AGX Orin as a full featured carrier board specifically
designed for commercially deployable platforms. Rogue for Jetson
AGX Orin provides access to an impressive list of latest generation
interfaces on the Jetson AGX Orin while adding additional interfaces
of 2× 10GbE, 3× USB 3.1, HDMI and a locking Mini-Fit Jr. power input
connector. Integrations with external storage and Wi-Fi/Bluetooth via
Intel 8265 are also available.
www.connecttech.com
COM-HPC Mini Modules
Congatec (Deggendorf, Germany) introduces the new
COM-HPC Mini designs. Launching officially after final
PICMG ratification of the new specification, the first
high-performance COM-HPC Mini modules will be
equipped with the new 13th Gen Intel Core processors
(codename Raptor Lake), which represent the latest benchmark
for the high end of embedded and edge computing at
client level. The COM-HPC Mini form factor predominantly
addresses ultra-compact high-performance designs such
as DIN rail PCs or rugged handhelds and tablets. However, COM-HPC Mini also solves the
Gordian knot that developers of ultra-compact COM Express systems have been facing when
wanting to switch to COM-HPC to be able to utilize latest interface technologies.
www.congatec.com
Aerospace & Defense Technology, April 2023
mobilityengineeringtech.com
MULTIPHYSICS
MODELING AND
SIMULATION
APPLICATIONS
COMSOL Multiphysics® is a
soft ware environment for creating
physics-based models and simulation apps and
managing simulation projects. Add-on products provide
tools for electromagnetics, structural, acoustics,
fluid flow, heat transfer, and chemical simulations.
Interfacing products offer a unified workflow with all
major technical computing and CAD tools. COMSOL
Compiler™ and COMSOL Server™ are used
for deploying simulation applications to colleagues
and customers. https://www.comsol.com/products
COMSOL, Inc.
ONE PART
EPOXY CURES
AT 80°C
Master Bond EP5TC-80
is a flowable paste epoxy
for bonding, sealing and
small encapsulation applications featuring high electrical
and thermal conductivity. EP5TC-80 contains
filler materials allowing it to achieve up to 3.3-3.7 W/
(m·K) as opposed to typical unfilled epoxies that feature
very low thermal conductivity and high electrical
insulation. https://www.masterbond.com/tds/
ep5tc-80
Master Bond
47
TEWS (Halstenbek,
Germany) extends its
tradition of delivering
high-density I/O solutions
with the introduction of a synchronous/asynchronous
standard full PCI
Express Mini Card module with three high
speed serial data communication channels.
The TMPE863 is designed for data communications,
LAN/WAN networking, traffic
control, simulation, telecommunications,
and COTS applications.
To minimize obsolescence issues, the serial
communication controller is implemented
in FPGA logic along with the bus master
capable PCIe interface, guaranteeing long
term availability and having the option to
implement additional functions in the
future. Data transfer to and from host memory
is handled via TMPE863 initiated DMA
cycles for minimum host/CPU intervention.
Each channel has a receive and transmit
FIFO of 512 long words (32 bit) per channel
for high data throughput.
www.tews.com

http://www.gms4sbc.com http://www.tews.com http://www.uavionix.com http://www.airborn.com http://info.hotims.com/84478-775 http://www.connecttech.com http://info.hotims.com/84478-776 http://www.congatec.com http://www.mobilityengineeringtech.com

Aerospace & Defense Technology - April 2023

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