Aerospace & Defense Technology - October 2024 - 39

Product Spotlight
New Products
MULTIPHYSICS
MODELING AND
SIMULATION
APPLICATIONS
COMSOL Multiphysics®
Non-Drip Epoxy
Master Bond's new (Hackensack, NJ) EP21ARHTND-2 is a
two part epoxy adhesive, designed to withstand prolonged
exposure to a wide range of chemicals. " The system's chemical
resistance was successfully tested in chemicals such as
98 percent sulfuric acid, 25 percent hydrochloric acid, 20
percent phosphoric acid, and 15 percent nitric acid, by
soaking cured samples for more than 12 months, " says
Senior Product Engineer Rohit Ramnath. " The product also
passes the damp heat reliability testing by withstanding 1,000 hours of 85 °C and 85 percent
Relative Humidity (RH). " Although EP21ARHTND-2 is capable of curing at room temperature,
to optimize its acid resistance properties, a cure schedule of overnight at ambient
temperatures, followed by a heat cure of 150-200 °F for 2-4 hours or longer is typically recommended,
and is serviceable from -60 °F to +400 °F.
www.masterbond.com
Rugged GPGPU AI Computer
Aitech Systems (Chatsworth, CA) has released the A178AV,
the latest iteration of its smallest rugged GPGPU AI
supercomputers available with the powerful NVIDIA Jetson
AGX Xavier System-on-Module. With its compact size, the
A178-AV is the most advanced solution for AI, deep learning,
and video and signal processing for the next generation
of avionic platforms. Its Volta GPU with 512 CUDA
cores and 64 Tensor cores reaches 32 TOPS INT8 and 11
TFLOPS FP16 at a remarkable level of energy efficiency, providing
all the power needed for AI-based local processing where needed, next to the sensors.
The A178-AV also features two dedicated NVIDIA engines providing an interface for deep
learning applications.
www.aitechsystems.com
Electrical Structural Tester
Keysight Technologies, Inc. (Santa Rosa, CA) introduces the Electrical
Structural Tester (EST), a wire bond inspection solution for
semiconductor manufacturing that ensures the integrity and reliability
of electronic components. The semiconductor industry is
faced with testing challenges due to the increasing density of chips
in mission-critical applications such as medical devices and automotive
systems. Current testing methodologies often fall short in
detecting wire bond structural defects, which lead to costly latent
failures. In addition, traditional testing approaches frequently rely on sampling techniques
that do not adequately identify wire bond structural defects.
www.keysight.com
TrueView 720 LiDAR
GeoCue (Madison, AL) and Xer Technologies AG, a Swiss manufacturer
of hybrid-electric drones, have successfully integrated
GeoCue's TrueView 720 LiDAR and imagery sensor with the Xer
X8 UAV platform. This collaboration marks a significant advancement
in scalable long-range LiDAR and imagery drone mapping
technology. The combination of the long-range, heavy-payload
Xer X8 and the GeoCue TrueView 720 enhances aerial operations,
enabling high-quality point cloud and imagery data collection
over vast and challenging terrains. The integration significantly improves the aerial mapping
and inspection workflow by delivering precise and reliable data, allowing operators to
manage and monitor large areas more effectively.
www.geocue.com
P940 Modular Power Instrument
The P940 from Highland Technology (San Francisco,
CA) is a modular power instrument intended primarily
for aerospace testing. It consists of a 3U rackmount
enclosure with main controller, power supply and
cooling, and provision for installation of up to eight
power, load, switching, or measurement modules. All
modules include full measurement capability; each module's measurable values (such as
output voltage, current, and frequency) can be read remotely via Ethernet/USB. All modules
include microsecond-resolution user-programmed parameter sequence tables. The P940 can
also be controlled manually via front panel color LCD and controls.
www.highlandtechnology.com
Aerospace & Defense Technology, October 2024
mobilityengineeringtech.com
REDEFINING
MEMS INERTIAL
- THE DMU41
IMU
Explore this compact,
rugged, tactical grade
MEMS IMU. This 50 × 50 × 50mm unit operates in
extreme temperatures, delivering exceptional low
noise performance with class-leading bias instability
and excellent angle random walk.
* -40°C to +85° C operating temp
* +/- 490 °/sec dynamic range
* 0.02°/√hr angular random walk
* 0.1° /hr, 0.015mg bias instability
https://siliconsensing.com/product/dmu41
Silicon Sensing
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is a software
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physics-based models and simulation apps and managing
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for electromagnetics, structural, acoustics, fluid flow,
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products offer a unified workflow with all major technical
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and COMSOL Server™ are used for deploying
simulation applications to colleagues and customers.
https://www.comsol.com/products
COMSOL, Inc.
NANOSILICA
FILLED EPOXY
SYSTEM
With superb optical
clarity and abrasion
resistance, Master Bond
UV22 cures quickly and
easily when exposed to a UV light source. Cationic
systems, such as UV22, tend to have much higher
temperature resistance than other UV type systems.
Its glass transition temperature when post cured is
135°C. http://www.masterbond.com/tds/uv22
Master Bond
www.techbriefs.com/insider
39

http://info.hotims.com/86260-804 http://www.masterbond.com http://info.hotims.com/86260-805 http://www.aitechsystems.com http://www.keysight.com http://info.hotims.com/86260-806 http://www.geocue.com https://www.techbriefs.com/insider http://www.highlandtechnology.com https://mobilityengineeringtech.com

Aerospace & Defense Technology - October 2024

Table of Contents for the Digital Edition of Aerospace & Defense Technology - October 2024