Tech Briefs Magazine - August 2024 - 35

New on the
MARKET
Data Acquisition Instrument for Long-Term Recording
Dewesoft, Trbovlje, Slovenia, has announced OBSIDIAN®, a breakthrough data acquisition (DAQ)
instrument that combines the best features of a high-end DAQ system, a long-term datalogger, a real-time
EtherCAT data server, and a signal conditioning front end. Traditional high-speed DAQ systems
are typically used for a few hours at a time and use software based on the Windows operating system,
which is not designed for long-term stability. However, numerous applications require the measurement
system to operate for weeks, months, or even years. Accordingly, OBSIDIAN is built on a low-power
ARM processor running an open-source LINUX® operating system and DewesoftRT DAQ software. This architecture allows
OBSIDIAN to operate for extended periods of time without intervention. It can be remotely monitored and controlled via the
DewesoftM app running on iOS or Android phones and tablets, or by computers running DewesoftX software.
www.dewesoft.com
Displacement Sensors with Integrated Inclination Sensor
ASM, Elmhurst, IL, presents the
posiwire® sensors WST61, WST85,
and WST21, combining linear position
determination and inclination
measurement. Many applications for
telescopic crane booms, transport
cranes, machines for the pharmaceutical
industry, and medical technology,
require both linear position and
inclination measurements. The posiwire sensors are equipped
with magnetic, non-contact multi-Hall encoder technology.
The inclination position is determined by an integrated sensor
based on MEMS technology.
www.asmsensors.com
Power-Thru Gate Driver IC
Allegro MicroSystems,
Manchester, NH, announced
the launch of the third product
in its High Voltage Power-Thru™
portfolio. Allegro's
two-chip AHV85000 and AHV85040 isolated gate-driver IC
solutions work together with external transformers to provide
the freedom to design and maximize power efficiency
for clean energy applications, including solar inverters, xEV
charging infrastructures and energy storage systems (ESS),
as well as data center power supply units.
www.allegromicro.com/en
High-Current Power Inductor
Sumida America, Schaumburg, IL,
has introduced the CDPQ/T150 Series
of high-current power inductors.
In this new design, a combination of
precision flat-wire windings and large
tinned copper surface mounting
pads maximizes current handling capacity.
These inductors are magnetically
shielded, AEC-Q200 qualified, and a good match for onboard
chargers. Inductance ranges from 1 to 4.7 µH at up to
48 Amps.
www.sumida.com
Tech Briefs, August 2024
www.techbriefs.com
USB C Plugs and Sockets
Faster data transfer speeds, increased
power transmission, and
smaller PCB footprints are key advantages
of the advanced new series
of USB Type C Plugs and Sockets
from Keystone Electronics
Corp., New Hyde Park, NY. These
USBs deliver significant real estate reductions to accommodate
a variety of devices. USB-1 standards supported by
these devices include 10Gbps top speed and up to 20V
(100W), 3 Amp output, bidirectional power, and orientation-free
cable applications.
www.keyelco.com
MEMS Six-Degree-of-Freedom Inertial Measurement Unit
Analog Devices, Inc., Wilmington, MA,
has announced a six-degree-of-freedom
IMU designed for a wide range of markets
including aerospace, defense, and industrial.
The ADIS16545 and ADIS16547 feature
a four times improvement in the gyroscope
all-condition bias repeatability
representing the combination of turn-on
drift, thermal hysteresis, vibration rejection, and end-of-life
drift. They offer factory calibrated sensitivity, bias, and axial
alignment over a temperature range of -40 °C - 85 °C.
www.analog.com
Panel Mount M12 Connectors
binder,
Camarillo, CA,
announced
the latest enhancements
to its panel mount connectors
in M12 size. These
connectors now feature assembled
wires, an advanced sealing
concept, safety features, and
sustainable materials. Users in process, sensor, and drive
technology also benefit from optional shielding and customization.
In addition to the previously offered dip-soldered
versions, this variant can be attached directly from
the front.
www.binder-usa.com
35

http://www.dewesoft.com http://www.keyelco.com http://www.asmsensors.com http://www.analog.com http://www.allegromicro.com/en http://www.sumida.com http://www.binder-usa.com https://www.techbriefs.com

Tech Briefs Magazine - August 2024

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